Photosensitive resin composition and preparation method thereof, photosensitive organic vehicle and yellow light paste

A technology of photosensitive resin and organic carrier, which is applied in the field of photosensitive organic carrier and yellow light paste, photosensitive resin composition and its preparation, and can solve problems such as insufficient adhesion, inability to form conductive network, and rough lines. Achieve the effects of increasing molecular weight and cross-linking density, not easy to separate and separate out, good wetting and dispersing

Active Publication Date: 2022-03-15
乾宇微纳技术(深圳)有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The current photosensitive resin composition is mainly used in an all-organic system, which has poor adaptability to inorganic metal powder. In the case of high inorganic metal powder filler ratio, it cannot form a homogeneous phase material after mixing with each other, resulting in stratification, precipitation, etc. Bad, finer nano-scale metal powders even agglomerate due to not being well dispersed
Part of the photosensitive resin has too strong coating on the metal powder, which leads to the inability of close contact between the metal powder after curing, and the inability to form a conductive network and conduct electricity.
Moreover, a small number of matching photosensitive resin compositions cannot reflect the high-resolution characteristics of yellow light materials due to their low proportion. large-scale short-circuit in case of distance, etc.
In addition, due to the influence of the material and surface energy of the circuit board, after the photosensitive resin composition is cured, the predetermined bonding strength cannot be achieved, and a large area falls off after development, or the adhesion is insufficient, and the product durability test cannot be passed.

Method used

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  • Photosensitive resin composition and preparation method thereof, photosensitive organic vehicle and yellow light paste

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preparation example Construction

[0047] The present invention also proposes a preparation method of a photosensitive resin composition, comprising the following steps:

[0048] Mix acidic monomers, high oxygen content monomers, backbone monomers, and thermal initiators to obtain a homogeneous mixture;

[0049] Dropping the homogeneous mixture into the reaction solvent preheated to 80°C to 90°C, and maintaining the reaction at 80°C to 90°C with stirring to obtain the base;

[0050] Add photocurable monomers to the base, and react at 70°C-80°C for 2-3h to obtain a photosensitive resin mixture.

[0051] Specifically, the acidic monomer, high oxygen content monomer, skeleton monomer and thermal initiator are first poured into a beaker, ultrasonically dissolved and mixed to obtain a homogeneous mixture. Then add the reaction solvent into the glass reaction kettle with a reflux condenser, heat at a constant temperature to 80°C~90°C, pass argon for protection, and stir at a speed range of 100~200RPM. Afterwards, t...

Embodiment 1

[0073] (1) Preparation of photosensitive resin composition:

[0074] In parts by mass, ultrasonically dissolve and mix 8 parts of methacrylic acid, 20 parts of polyethylene glycol methacrylate, 8 parts of n-butyl methacrylate, 4 parts of styrene, and 1 part of azobisethylbutyronitrile , to obtain a homogeneous mixture. Add 57 parts of propylene glycol monomethyl ether into a glass reactor with a reflux condenser, heat at a constant temperature to 85° C., protect with argon, and stir at 150 RPM. The aforementioned homogeneous mixture was gradually dropped into a glass reaction kettle through a dropping funnel, kept at 85° C., and stirred for 4 hours to obtain a photosensitive resin base. Then, 10 parts of triglycidyl methacrylate was added to the base, kept at 70° C., stirred for 2 hours, and reacted to obtain a photosensitive resin composition.

[0075] (2) Preparation of photosensitive organic carrier:

[0076] In parts by mass, weigh 55 parts of photosensitive resin compo...

Embodiment 2

[0088] (1) Preparation of photosensitive resin composition:

[0089] In parts by mass, 7 parts of methacrylic acid, 12 parts of polypropylene glycol methacrylate, 9 parts of methyl methacrylate, 3 parts of n-butyl acrylate, and 2 parts of azodiethylbutyronitrile were ultrasonically dissolved and mixed, A homogeneous mixture was obtained. Add 56 parts of ethylene glycol monobutyl ether into a glass reactor with a reflux condenser, heat it at a constant temperature to 85°C, protect it with argon, and stir at a speed of 150 RPM. The aforementioned homogeneous mixture was gradually dropped into a glass reaction kettle through a dropping funnel, kept at 85° C., and stirred for 4 hours to obtain a photosensitive resin base. Then, 3 parts of hydroxyethyl methacrylate and 8 parts of hydroxypropyl methacrylate were added to the base, kept at 70°C, stirred for 2 hours, and reacted to obtain a photosensitive resin composition.

[0090] (2) Preparation of photosensitive organic carrier:...

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Abstract

The invention discloses a photosensitive resin composition and a preparation method thereof, a photosensitive organic carrier and a yellow light slurry. Wherein, the photosensitive resin composition includes acidic monomers, high oxygen content monomers, skeleton monomers, photocurable monomers and thermal initiators. The technical solution of the present invention can obtain a photosensitive resin composition with good matching with inorganic precious metal powder, high resolution and good adhesion.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a photosensitive resin composition and a preparation method thereof, a photosensitive organic carrier and yellow light paste. Background technique [0002] With the innovation of technology, the functions of electronic products are becoming more and more perfect, and "light", "thin" and "small" have become the development trend of electronic products. The key to the miniaturization, light weight and integration of electronic systems lies in how to arrange higher density substrate circuits and internal circuits of components in a smaller space. The most effective solution to this is to improve the performance of the yellow light process paste. Further refine the dimensions of the substrate circuit and the internal circuit of the component. [0003] Yellow light process slurry is composed of photosensitive resin composition and precious metal powder filler. Conductiv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027G03F7/004G03F7/028
CPCG03F7/027G03F7/004G03F7/028
Inventor 董鹏程康文兵孙胜延许迪高辉伍佩铭
Owner 乾宇微纳技术(深圳)有限公司
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