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DCPD-bisphenol benzoxazine resin, composition for copper-clad plate and preparation method of composition

A technology of benzoxazine and bisphenol resin, applied in the field of benzoxazine resin and its composition and its preparation, can solve the problems of limited application, poor heat resistance of benzoxazine resin, etc.

Active Publication Date: 2020-12-15
江苏东材新材料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But on the other hand, since the dicyclopentadiene in the structure is an aliphatic ring segment, the heat resistance of the synthesized benzoxazine resin is poor, Tg≤140°C, which limits its application in the field of high-frequency and high-speed copper clad laminates. Applications

Method used

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  • DCPD-bisphenol benzoxazine resin, composition for copper-clad plate and preparation method of composition
  • DCPD-bisphenol benzoxazine resin, composition for copper-clad plate and preparation method of composition
  • DCPD-bisphenol benzoxazine resin, composition for copper-clad plate and preparation method of composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 5

[0093] DCPD-bisphenol-type benzoxazine resin is to react DCPD with bisphenol monomer and catalyst A to generate DCPD-bisphenol resin, and then mix DCPD-bisphenol resin with paraformaldehyde, primary amine compound and catalyst B Further reaction obtains DCPD-bisphenol type benzoxazine resin;

[0094] The DCPD is the abbreviation of the chemical name of dicyclopentadiene;

[0095] The bisphenol monomer is one or a mixture of two or more of bisphenol A, bisphenol F, bisphenol S, bisphenol B, bisphenol AF, bisphenol fluorene, and phenolphthalein;

[0096] The catalyst A is boron trifluoride ether, trifluoromethanesulfonic acid, anhydrous aluminum trichloride, p-toluenesulfonic acid, boron trifluoride, tin tetrachloride, iron trichloride, concentrated sulfuric acid, phosphoric acid One or more mixtures;

[0097] The paraformaldehyde is a mixture of one or more than two kinds with a degree of polymerization of 10-100, and its mole number is calculated according to the theoretical...

Embodiment 6

[0101] In the described DCPD-bisphenol type benzoxazine resin, the synthetic method of described DCPD-bisphenol resin is: in the reactor A that stirring, thermometer, condensation tube are housed, add the bisphenol monomer of 1mol, 100g of propylene glycol ether acetate, then add catalyst A whose weight is 1‰ of the weight of bisphenol monomer, stir evenly, heat up to 80°C (temperature 1), add 1mol of DCPD, DCPD (required) is added in three batches in equal amounts, Add one batch at intervals of 20 minutes. After adding in batches, maintain the temperature of 80°C (temperature 1) for 4 hours (time 1), evaporate propylene glycol methyl ether acetate under reduced pressure, and remove the material in reactor A (i.e. resin) while Pour out the heat and get (tan) DCPD-bisphenol resin (solid) after cooling.

Embodiment 7

[0103] In the described DCPD-bisphenol type benzoxazine resin, the synthetic method of described DCPD-bisphenol resin is: in the reactor A that stirring, thermometer, condensation tube are housed, add the bisphenol monomer of 1mol, 100g propylene glycol ethyl ether acetate, then add the catalyst A whose weight is 1% of the weight of the bisphenol monomer, stir evenly, heat up to 140°C (temperature 1), add 3mol of DCPD, DCPD (required) is added in three batches in equal amounts, Add one batch at intervals of 20 minutes. After adding in batches, maintain the temperature of 140°C (temperature 1) for 4 hours (time 1), evaporate propylene glycol methyl ether acetate under reduced pressure, and remove the material in reactor A (i.e. resin) while Pour out the heat and get (tan) DCPD-bisphenol resin (solid) after cooling.

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Abstract

The invention discloses a DCPD bisphenol type benzoxazine resin and a composition for a copper-clad plate and a preparation method thereof, and is characterized in that DCPD, a bisphenol monomer and acatalyst A are subjected to a heating reaction to form DCPD-bisphenol resin, and then the DCPD-bisphenol resin further reacts with paraformaldehyde, primary amine and a catalyst B to obtain the DCPD-bisphenol type benzoxazine resin. The composition for the copper-clad plate is prepared by mixing 40-50 parts by mass of DCPD-bisphenol benzoxazine resin, 20-30 parts by mass of naphthalene ring epoxyresin, 10-20 parts by mass of maleimide resin, 5-10 parts by mass of phosphorus-containing phenolic resin, 0.1-0.5 part by mass of an imidazole catalyst and 10-20 parts by mass of butanone. The DCPD-bisphenol type benzoxazine resin and the composition for the copper-clad plate has the characteristics of low dielectric constant, low dielectric loss, high heat resistance and the like, and is particularly suitable for being used as a raw material for the copper-clad plate.

Description

technical field [0001] The invention belongs to a benzoxazine resin for copper-clad laminates, a composition thereof and preparation thereof, and relates to a DCPD-bisphenol type benzoxazine resin, a composition for copper-clad laminates and a preparation method thereof. The DCPD-bisphenol type benzoxazine resin and the composition for copper clad laminates of the present invention have the characteristics of low dielectric constant, low dielectric loss, high heat resistance, etc., and are especially suitable for raw materials for copper clad laminates. Background technique [0002] Today, 5G (fifth generation mobile communication) is bringing a huge opportunity to related industries. 5G networks will bring new experiences to people in multiple fields such as driverless driving, smart cities, and the Internet of Things. Due to its data transmission rate and high reliability requirements, 5G communication puts forward very high requirements on the dielectric constant, dielec...

Claims

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Application Information

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IPC IPC(8): C08G14/073C08L61/34C08L63/00C08L79/08C08L61/06
CPCC08G14/06C08L61/34C08L2205/035C08L2205/02C08L2201/02C08L2201/08C08L2203/20C08L2205/025C08L63/00C08L79/085C08L61/06Y02P20/584
Inventor 支肖琼黄杰唐廖曦赵萧萧
Owner 江苏东材新材料有限责任公司