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Combination method for preparing flexible circuit on surface of biological material

A technology of flexible circuits and biomaterials, applied in flexible printed circuit boards, printed circuits, printed circuit manufacturing, etc., can solve the problems of increasing the conductivity of printing materials, poor thermal stability of biomaterials, and limiting the application of electronic devices, etc., to achieve improved The effect of electrode conductivity, not easy to fall off, and excellent biocompatibility

Active Publication Date: 2021-02-09
XIAMEN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]However, inkjet printing technology on the surface of flexible biofilm materials has always been a huge challenge
Due to the poor thermal stability of biomaterials, it is difficult to increase the conductivity of printed materials by high-temperature annealing, resulting in poor conductivity of electrodes, which limits their application in electronic devices

Method used

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  • Combination method for preparing flexible circuit on surface of biological material
  • Combination method for preparing flexible circuit on surface of biological material
  • Combination method for preparing flexible circuit on surface of biological material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A joint method for preparing flexible circuits on the surface of biomaterials is as follows:

[0031] 1. Pretreatment of flexible transparent substrates: Wash the substrate materials with absolute ethanol and deionized water respectively, and after drying, treat them with oxygen plasma (Plasma) or ultraviolet light (UV) for 5-10 minutes to improve their hydrophilicity.

[0032] 2. Turn on the inkjet printing equipment, select the printing voltage of 27V, the number of printing layers is 2 to 4 layers, sinter after printing, and the sintering temperature is 150°C;

[0033] 3. An electrochemical nickel plating solution is provided, and the sample sintered in step 2 is subjected to electrodeposition.

[0034] In step 3, the electrochemical nickel plating solution contains at least the following components: nickel salt and pH regulator. Described nickel salt is preferably nickel sulfate or nickel sulfate hexahydrate (NiCl 2 ·6H 2 O), nickel chloride or nickel chloride he...

Embodiment 2

[0037]Steps 1 and 3 are the same as in Example 1, the difference is that in step 2, the inkjet printing device is turned on, the printing voltage is selected to be 27V, the number of printing layers is 2-4 layers, and the printing is sintered, and the sintering temperature is selected to be 180°C.

Embodiment 3

[0039] Similar to Example 1, the difference is that in step 2: change the heating method of the inkjet printing circuit to a gradient of 6-10°C / min. When the heating method is gradually heating and keeping warm, the electrical properties of the electrodes are compared with The electrode made by directly heating without heat preservation has been significantly improved, and its scanning electron microscope image (such as figure 2 Said) also shows that the silver particles are closely combined in the heating mode of gradually heating up and keeping warm, and there is no bad phenomenon such as cracks.

[0040] Experiments show that the inkjet printed metal nanoparticles are closely stacked with each other, have good contact with the electroless metal conductive layer, and have good conductivity. The preparation method provided by the present invention can simplify the preparation process of flexible circuits, requires less raw materials, and is environmentally friendly. At the s...

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Abstract

The invention discloses a combination method for preparing a flexible circuit on the surface of a biological material, and relates to ink-jet printing. The method comprises steps: adjusting the numberof printing layers of ink-jet printing equipment, and carrying out the ink-jet printing of a flexible circuit pattern on a pretreated flexible substrate through employing particle-free silver ink; carrying out heat treatment on the flexible substrate subjected to ink-jet printing at the temperature rise gradient of 6-10 DEG C / min at the temperature of 120-180 DEG C to obtain a silver interdigitalelectrode: preparing an electrochemical nickel plating solution, and carrying out electrochemical nickel plating on the obtained silver interdigital electrode to obtain the flexible circuit; the silver interdigital electrode containing the nickel layer can further improve the conductivity of the electrode. The prepared flexible circuit is biocompatible and degradable, and can be applied to preparation of wearable sensors, electronic skin and electrochromic devices. An ink-jet printing technology is utilized, complex processes such as exposure, development and etching are not needed, the preparation process is simple, and few materials are used, so that the flexible circuit can be quickly prepared on a large scale.

Description

technical field [0001] The invention relates to inkjet printing, in particular to a combined method for preparing flexible circuits on the surface of biological materials. Background technique [0002] In recent years, wearable electronic devices have gained extensive attention in the fields of flexible / stretchable human-computer interaction sensors, displays, and energy devices due to their portable interactions with humans. To efficiently fabricate wearable electronic devices, an efficient, cost-effective, and environmentally friendly fabrication technique is required. Traditional metal electrodes are prepared by vacuum evaporation, magnetron sputtering and other processes. The disadvantages of complex preparation process and high energy consumption limit their rapid preparation and large-scale application in large areas. Inkjet printing has the characteristics of non-contact with the substrate, no mask, patterning, digital printing patterns are easy to change, and low co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12H05K3/18H05K3/22H05K1/02B41M3/00B41M1/26
CPCH05K3/125H05K3/181H05K3/22H05K1/028B41M3/00B41M1/26H05K2203/11H05K2201/05
Inventor 郭文熹陈帆赵莉赵继忠许清池徐俊
Owner XIAMEN UNIV