Preparation method of heat-conducting gasket with high normal heat conductivity and high elasticity

A technology of normal thermal conductivity and thermal pads, which is applied in the field of thermal pad preparation, can solve the problems of reducing the heat transfer performance of the three-dimensional skeleton, weak bonding force, and high polymer requirements

Active Publication Date: 2021-04-20
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The following disadvantages exist in the preparation of thermally conductive composite materials in the prior art. 1. The disadvantage of the ice template method is that the filler volume content is low, and the mechanical strength of the three-dimensional skeleton is not enough. In order to enhance the mechanical strength of the three-dimensional skeleton, it is usually necessary to add polymer adhesives. thereby reducing the heat transfer performance of the entire three-dimensional skeleton
2. The volume fraction of the three-dimensional graphene skeleton obtained by the hydrothermal method is not ideal, and it is generally difficult to exceed 25vol%, which affects the improvement of thermal co

Method used

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  • Preparation method of heat-conducting gasket with high normal heat conductivity and high elasticity
  • Preparation method of heat-conducting gasket with high normal heat conductivity and high elasticity
  • Preparation method of heat-conducting gasket with high normal heat conductivity and high elasticity

Examples

Experimental program
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Effect test

Embodiment 1

[0050] (1) Using graphite film as a high thermal conductivity filler material, put the graphite film into a plasma generator for bombardment, and use plasma bombardment equipment to etch the surface of the graphite film. The plasma atmosphere adopts air atmosphere, and the inlet pressure is 30MPa. The power of the device was 750kW, and the bombardment time was 15min to obtain the first modified graphite film.

[0051] (2), such as figure 2 Shown is a schematic diagram of the preparation process of the first modified graphite film. Specifically, the first modified graphite film is first hydroxylated in a mixed solution of hydrogen peroxide and ammonia water, and then the graphite film is put into the hydrolyzed coupling agent solution. , standing for 24 hours, grafting the hydrolyzed coupling agent, and then rinsing the ungrafted functional groups on the surface of the graphite membrane with alcohol to obtain the second modified graphite membrane. Wherein, the hydrolyzed coup...

Embodiment 2

[0057] The preparation steps of this example are the same as those of Example 1, except that in Example 2, the two-component polyolefin includes hydroxyl-terminated polybutadiene and maleic acid-grafted polybutadiene, and the terminal The ratio of hydroxyl polybutadiene and maleic acid grafted polybutadiene is 3.5:1, and the two-component polyolefin containing 0.6wt% antioxidant and 1wt% coupling agent is coated on the second modified graphite film On the surface, the film thickness is controlled at 500 μm, and the mass fraction of the graphite film in this example 2 is that the filler content is 33.7%. It can be seen from the test that Example 2 has higher thermal conductivity and superior mechanical properties.

[0058] 1. Testing and Characterization:

[0059] figure 1 is a schematic diagram of the normal orientation of the graphene sheet, through figure 1 It can be seen that the higher the degree of orientation along the normal direction of the graphene sheet, the great...

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Abstract

The invention belongs to the technical field of preparation of heat conduction materials, and discloses a preparation method of a heat-conducting gasket with high normal heat conductivity and high elasticity. The preparation method comprises the following steps: (1) with a graphite film or a graphene film as a filler, carrying out plasma modification to obtain a first modified graphite film or graphene film; (2) hydroxylating the first modified graphite film or graphene film, and grafting a hydrolyzed coupling agent to obtain a second modified graphite film or graphene film; (3) coating the surface of the second modified graphite film or graphene film with polyolefin, carrying out pre-curing treatment, and conducting stacking by adopting a laminating process to obtain a graphite film or graphene film/polyolefin multi-layer composite structure formed body; and (4) after hot-pressing treatment, conducting cutting along a direction vertical to the upper surface and the lower surface of the multi-layer composite structure formed body to obtain the heat-conducting gasket. The obtained heat-conducting gasket is good in heat-conducting property, and when a filler content reaches 94.3%, the heat conductivity of the gasket reaches 726.1 W/(m.K).

Description

technical field [0001] The invention belongs to the technical field of heat-conducting material preparation, and in particular relates to a method for preparing a heat-conducting gasket with high normal thermal conductivity and high elasticity. Background technique [0002] With the miniaturization, high density and high power of integrated circuits, the heat dissipation of electronic components has seriously restricted the development of the integrated circuit industry. According to statistics from the U.S. Air Force Electronics Industry Department: About 55% of the failures of electronic products are caused by overheating and heat-related problems. Therefore, the problem of thermal management of electronic devices needs to be solved urgently. [0003] Thermal interface material is a key material to solve the heat dissipation of electronic devices. It is used to fill the gap between device interfaces and reduce heat transfer resistance. The main types of thermal interface...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L47/00C08L51/00C08K9/02C08K9/04C08K9/06C08K3/04H05K7/20
Inventor 叶振强李俊伟曾小亮张晨旭张月星孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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