Preparation method of heat-conducting gasket with high normal heat conductivity and high elasticity

A technology of normal thermal conductivity and thermal pads, which is applied in the field of thermal pad preparation, can solve the problems of reducing the heat transfer performance of the three-dimensional skeleton, weak bonding force, and high polymer requirements
CN112679765AActive Publication Date: 2021-04-20SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
Publication Date
2021-04-20

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Abstract

The invention belongs to the technical field of preparation of heat conduction materials, and discloses a preparation method of a heat-conducting gasket with high normal heat conductivity and high elasticity. The preparation method comprises the following steps: (1) with a graphite film or a graphene film as a filler, carrying out plasma modification to obtain a first modified graphite film or graphene film; (2) hydroxylating the first modified graphite film or graphene film, and grafting a hydrolyzed coupling agent to obtain a second modified graphite film or graphene film; (3) coating the surface of the second modified graphite film or graphene film with polyolefin, carrying out pre-curing treatment, and conducting stacking by adopting a laminating process to obtain a graphite film or graphene film / polyolefin multi-layer composite structure formed body; and (4) after hot-pressing treatment, conducting cutting along a direction vertical to the upper surface and the lower surface of the multi-layer composite structure formed body to obtain the heat-conducting gasket. The obtained heat-conducting gasket is good in heat-conducting property, and when a filler content reaches 94.3%, the heat conductivity of the gasket reaches 726.1 W / (m.K).
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Description

technical field

[0001] The invention belongs to the technical field of heat-conducting material preparation, and in particular relates to a method for preparing a heat-conducting gasket with high normal thermal conductivity and high elasticity. Background technique

[0002] With the miniaturization, high density and high power of integrated circuits, the heat dissipation of electronic components has seriously restricted the development of the integrated circuit industry. According to statistics from the U.S. Air Force Electronics Industry Department: About 55% of the failures of electronic products are caused by overheating and heat-related problems. Therefore, the problem of thermal management of electronic devices needs to be solved urgently.

[0003] Thermal interface material is a key material to solve the heat dissipation of electronic devices. It is used to fill the gap between device interfaces and reduce heat transfer resistance. The main types of thermal interface...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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