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High-thermal-conductivity aluminum nitride ceramic and preparation method thereof

A technology of aluminum nitride ceramics and high thermal conductivity, applied in the field of ceramic materials, can solve the problem of not being able to take into account performance at the same time, and achieve the effects of good chemical stability and thermal stability, good lubricity, and stable slurry

Active Publication Date: 2021-06-11
FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, in view of the above content, the present invention provides a high thermal conductivity aluminum nitride ceramic and its preparation method to solve the problem that the existing aluminum nitride ceramics only have outstanding performance in one aspect such as thermal conductivity and strength, and cannot take into account all aspects at the same time performance problem

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Method for preparing high thermal conductivity aluminum nitride ceramics, including the following steps:

[0035] (1) A ball milling: aluminum nitride powder, calcium carbonate, lithium nitrate, and ethanol are added to the ball mill, ball milling dispersion for 6 h, dry dry after ball milling, sieved to the intermediate powder, the aluminum nitride powder, The mass ratio of calcium carbonate and lithium nitrate is 85: 5: 3, and the quality of ethanol is 60% of the aluminum nitride powder;

[0036] (2) Calcination: In a nitrogen atmosphere, the intermediate powder obtained by step (1) is calcined 90 min at 950 ° C, and the mixed powder is obtained by sieve;

[0037] (3) Secondary ball milling: The mixed powder, diombite, solvent, solvent, sodium polyacrylate, sodium phthalate, and binder, phthalate, and binder, 磨 时间 10 h ;

[0038] The amount of the diomide is 30% of the mass of the mixed powder, and the solvent is anhydrous ethanol, isopropyl alcohol according to a mixed s...

Embodiment 2

[0045] Method for preparing high thermal conductivity aluminum nitride ceramics, including the following steps:

[0046] (1) One ball milling: aluminum nitride powder, calcium carbonate, lithium nitrate, and ethanol are added to the ball mill, ball milling dispersion 10 h, dry dry, dry dry, sieved to the intermediate powder, the aluminum nitride powder, The mass ratio of calcium carbonate and lithium nitrate is 88: 6: 5, and the quality of ethanol is 70% of the aluminum nitride powder;

[0047] (2) Calcination: In a nitrogen atmosphere, the intermediate powder obtained by step (1) is calcined at 1000 ° C for 60 min, and the mixed powder is obtained by sieve;

[0048] (3) Secondary ball milling: The mixed powder, diombite, solvent, fish oil, fish oil, diethyl phthalate, and binder, and binder induced dihydrate, ball milling time 15 h;

[0049] The addition of molybdenum sulfide is 40% of the mass of the mixed powder, the solvent is anhydrous ethanol, isopropyl alcohol according to ...

Embodiment 3

[0056] Method for preparing high thermal conductivity aluminum nitride ceramics, including the following steps:

[0057] (1) One ball milling: aluminum nitride powder, calcium carbonate, lithium nitrate, and ethanol are added to the ball mill, ball milling dispersion 15h, dry dry, dry dry, sieved, aluminum nitride powder, The mass ratio of calcium carbonate and lithium nitrate is 90: 8: 6;

[0058] (2) Calcination: In a nitrogen atmosphere, the intermediate powder obtained by step (1) is calcined at 1050 ° C for 30 min, and the mixed powder is obtained by sieve;

[0059] (3) Secondary ball milling: The mixed powder, donulfide, solvent, solvent, polyethylene glycol 400, plasticizer, and binder, and binder, and binder are added to the ball mill for secondary ball mill.

[0060] The amount of molybdenum hydride is 50% of the mass of the mixed powder, and the solvent is anhydrous ethanol, isopropyl alcohol according to a mixed solvent composed of mass ratio 1: 3, and the solvent is ad...

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Abstract

The invention relates to the technical field of ceramic materials, and provides a high-thermal-conductivity aluminum nitride ceramic and a preparation method thereof, wherein the preparation method comprises the following steps: (1) carrying out primary ball milling; (2) calcining; (3) carrying out secondary ball milling; (4) carrying out vacuum defoaming; (5) carrying out tape casting; (6) carrying out isostatic compaction; (7) discharging glue; and (8) carrying out hot pressed sintering. The thermal conductivity of the obtained aluminum nitride ceramic is 200-230 W / (m*K), the bending strength is 470-540 MPa, the volume density is 3.3-3.5 g / cm, and the problem that existing aluminum nitride ceramic only has outstanding performance in one aspect of thermal conductivity, strength and the like and cannot give consideration to performance in all aspects at the same time is solved.

Description

Technical field [0001] The present invention relates to the field of ceramic materials, and more particularly to a high thermal conductivity aluminum nitride ceramic and a preparation method thereof. Background technique [0002] Ceramic substrate materials mainly have aluminum nitride (AlN), alumina (Al 2 0 3 ), Cerium oxide (BEO), silicon carbide (SiC), boron nitride (BN), silicon nitride (Si 3 N 4 )Wait. Al 2 O 3 As a conventional substrate material, the thermal conductivity is low, the linear expansion coefficient and Si are not very matched, and the thermal displacement between the substrate and the Si sheet is easily impeded; BEO ceramics although high thermal conductivity, it can reach 310W / M · K), but its raw materials have vicious, high production cost, has gradually been eliminated. Although the SiC substrate is high, the insulation is poor; the BN is difficult to sinter, the preparation process is complex, and the thermal conductivity is low, the mechanical strength ...

Claims

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Application Information

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IPC IPC(8): C04B35/581C04B35/622C04B35/638C04B35/645
CPCC04B35/581C04B35/622C04B35/638C04B35/645C04B2235/6025C04B2235/6562C04B2235/6567C04B2235/77C04B2235/96C04B2235/9607
Inventor 杨大胜施纯锡冯家伟
Owner FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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