High-thermal-conductivity boron nitride powder filler and preparation method thereof

A technology of boron nitride powder and high thermal conductivity, which is applied in chemical instruments and methods, fibrous fillers, heat exchange materials, etc., can solve the problems of affecting the thermal conductivity of resin composite materials, poor compatibility of organic matrix, uneven dispersion, etc. , to achieve the effect of improving heat conduction effect, good compatibility, and easy heat conduction network

Inactive Publication Date: 2021-06-18
东莞东超新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Inorganic thermally conductive particles mainly include nitrides, carbides, oxides, etc. At present, the high thermal conductivity insulating fillers developed by industrial and scientific research units are mainly the above-mentioned inorganic fillers. Special high thermal conductivity insulating material is of great significance. Boron nitride is composed of nitrogen and boron atoms. Because it has the same structure as graphite, it is a layered structure and is called "white graphite". Compared with other inorganic thermal conductivity fillers, BN is a ceramic The high-temperature insulating material with the best performance, high resistivity, high breakdow

Method used

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Embodiment 1

[0029] A high thermal conductivity boron nitride powder filler, the formula includes: sodium hydroxide, boron nitride, epoxy silane coupling agent, absolute ethanol and deionized water, the mass percentage of each component is: 25 Parts of sodium hydroxide, 40 parts of boron nitride, 25 parts of epoxy silane coupling agent, 15 parts of absolute ethanol and 10 parts of deionized water.

[0030] A method for preparing a high thermal conductivity boron nitride powder filler, comprising the following steps: Step 1, material selection; Step 2, boron nitride treatment; Step 3, ultrasonic dispersion; Step 4, preheating and sintering; Step 5, cooling storage ;

[0031] Wherein in the above-mentioned step one, according to the content of each component, it is respectively: 25 parts of sodium hydroxide, 40 parts of boron nitride, 25 parts of epoxy silane coupling agent, 15 parts of dehydrated alcohol and 10 parts of Deionized water is selected and weighed;

[0032] Wherein in above-me...

Embodiment 2

[0044] A high thermal conductivity boron nitride powder filler, the formula includes: sodium hydroxide, boron nitride, epoxy silane coupling agent, absolute ethanol and deionized water, the mass percentage of each component is: 20 Parts of sodium hydroxide, 50 parts of boron nitride, 25 parts of epoxy silane coupling agent, 15 parts of absolute ethanol and 10 parts of deionized water.

[0045] A method for preparing a high thermal conductivity boron nitride powder filler, comprising the following steps: Step 1, material selection; Step 2, boron nitride treatment; Step 3, ultrasonic dispersion; Step 4, preheating and sintering; Step 5, cooling storage ;

[0046] Wherein in the above-mentioned step one, according to the content of each component, it is respectively: 20 parts of sodium hydroxide, 50 parts of boron nitride, 25 parts of epoxy silane coupling agent, 15 parts of dehydrated alcohol and 10 parts of Deionized water is selected and weighed;

[0047] Wherein in above-me...

Embodiment 3

[0059] A high thermal conductivity boron nitride powder filler, the formula includes: sodium hydroxide, boron nitride, epoxy silane coupling agent, absolute ethanol and deionized water, the mass percentage of each component is: 15 Parts of sodium hydroxide, 60 parts of boron nitride, 25 parts of epoxy silane coupling agent, 15 parts of absolute ethanol and 10 parts of deionized water.

[0060] A method for preparing a high thermal conductivity boron nitride powder filler, comprising the following steps: Step 1, material selection; Step 2, boron nitride treatment; Step 3, ultrasonic dispersion; Step 4, preheating and sintering; Step 5, cooling storage ;

[0061] Wherein in the above-mentioned step one, according to the content of each component, it is respectively: 15 parts of sodium hydroxide, 60 parts of boron nitride, 25 parts of epoxy silane coupling agent, 15 parts of dehydrated alcohol and 10 parts of Deionized water is selected and weighed;

[0062] Wherein in above-me...

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Abstract

The invention discloses a high-thermal-conductivity boron nitride powder filler and a preparation method thereof. The high-thermal-conductivity boron nitride powder filler is prepared from sodium hydroxide, boron nitride, an epoxy silane coupling agent, absolute ethyl alcohol and deionized water. The mass percentage of each component is as follows: 15 to 25 parts of sodium hydroxide, 40 to 60 parts of boron nitride, 20 to 30 parts of epoxy silane coupling agent, 10 to 20 parts of absolute ethyl alcohol and 5 to 10 parts of deionized water. The preparation method is safe and reliable, the microsphere boron nitride easily forms a heat conduction network, the particle size of the boron nitride is optimized, the heat conduction effect of the filler is improved, the wet modification process conditions of the epoxy silane coupling agent on the boron nitride powder are optimized, so that the boron nitride powder has good compatibility with organic matters, and the viscosity, the oiliness, the water content and the like meet the technical index requirements; and the process is simple and rigorous, can replace other expensive high-thermal-conductivity boron nitride powder filler production processes, has the advantages of significant effect, cheap raw materials and low cost, greatly saves the production cost, and is beneficial to processing and production.

Description

technical field [0001] The invention relates to the technical field of high thermal conductivity boron nitride powder filler, in particular to a high thermal conductivity boron nitride powder filler and a preparation method thereof. Background technique [0002] Inorganic thermally conductive particles mainly include nitrides, carbides, oxides, etc. At present, the high thermal conductivity insulating fillers developed by industrial and scientific research units are mainly the above-mentioned inorganic fillers. Special high thermal conductivity insulating material is of great significance. Boron nitride is composed of nitrogen and boron atoms. Because it has the same structure as graphite, it is a layered structure and is called "white graphite". Compared with other inorganic thermal conductivity fillers, BN is a ceramic The high-temperature insulating material with the best performance, high resistivity, high breakdown field strength, strong thermal conductivity, the lowest...

Claims

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Application Information

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IPC IPC(8): C09C1/00C09C3/04C09C3/06C09C3/08C09C3/12C09K5/14
CPCC09C1/00C09C3/003C09C3/006C09C3/043C09C3/06C09C3/08C09C3/12C09K5/14
Inventor 魏东
Owner 东莞东超新材料科技有限公司
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