High-thermal-conductivity boron nitride powder filler and preparation method thereof

Abstract

The invention discloses a high-thermal-conductivity boron nitride powder filler and a preparation method thereof. The high-thermal-conductivity boron nitride powder filler is prepared from sodium hydroxide, boron nitride, an epoxy silane coupling agent, absolute ethyl alcohol and deionized water. The mass percentage of each component is as follows: 15 to 25 parts of sodium hydroxide, 40 to 60 parts of boron nitride, 20 to 30 parts of epoxy silane coupling agent, 10 to 20 parts of absolute ethyl alcohol and 5 to 10 parts of deionized water. The preparation method is safe and reliable, the microsphere boron nitride easily forms a heat conduction network, the particle size of the boron nitride is optimized, the heat conduction effect of the filler is improved, the wet modification process conditions of the epoxy silane coupling agent on the boron nitride powder are optimized, so that the boron nitride powder has good compatibility with organic matters, and the viscosity, the oiliness, the water content and the like meet the technical index requirements; and the process is simple and rigorous, can replace other expensive high-thermal-conductivity boron nitride powder filler production processes, has the advantages of significant effect, cheap raw materials and low cost, greatly saves the production cost, and is beneficial to processing and production.

Description

technical field [0001] The invention relates to the technical field of high thermal conductivity boron nitride powder filler, in particular to a high thermal conductivity boron nitride powder filler and a preparation method thereof. Background technique [0002] Inorganic thermally conductive particles mainly include nitrides, carbides, oxides, etc. At present, the high thermal conductivity insulating fillers developed by industrial and scientific research units are mainly the above-mentioned inorganic fillers. Special high thermal conductivity insulating material is of great significance. Boron nitride is composed of nitrogen and boron atoms. Because it has the same structure as graphite, it is a layered structure and is called "white graphite". Compared with other inorganic thermal conductivity fillers, BN is a ceramic The high-temperature insulating material with the best performance, high resistivity, high breakdown field strength, strong thermal conductivity, the lowest...

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Problems solved by technology

[0002] Inorganic thermally conductive particles mainly include nitrides, carbides, oxides, etc. At present, the high thermal conductivity insulating fillers developed by industrial and scientific research units are mainly the above-mentioned inorganic fillers. Special high thermal conductivity insulating material is of great significance. Boron nitride is composed of nitrogen and boron atoms. Because it has the same structure as graphite, it is a layered structure and is called "white graphite". Compared with other inorganic thermal conductivity fillers, BN is a ceramic The high-temperature insulating material with the best performance, high resistivity, high breakdown field strength, strong thermal conductivity, the lowest dielectric loss, and the lowest dielectric constant. It is the best choice for the development of low dielectric loss, low dielectric constant and high thermal conductivity composite materials. Optimum filling particles, because boron nitride powder is hydrophobic and oleophobic, has poor compatibility with the organic matrix, is very unevenly dispersed in the resin matrix, and has a high probability of agglomeration, which affects the thermal conductivity of the resin composite material ; For these defects, it is necessary to design a high thermal conductivity boron nitride powder filler and preparation method

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