Anti-oxidation bonding copper wire and preparation method thereof

A technology of bonding copper wires and oxidizing bonds, which is applied in the direction of coating, etc., can solve the problems of high oxidation characteristics of copper wires and inconvenient use, and achieve the effect of improving oxidation resistance and anti-oxidation performance

Inactive Publication Date: 2021-06-29
SHENZHEN ZHONGBAO NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a kind of anti-oxidation bonding copper wire and its preparation method, to solve the problem in the above-mentioned background technology that it is not convenient to use due to the high oxidation characteristics of copper wire

Method used

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  • Anti-oxidation bonding copper wire and preparation method thereof
  • Anti-oxidation bonding copper wire and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] An anti-oxidation bonded copper wire, comprising a bonded copper wire and an anti-oxidation coating coated on the outer wall of the bonded copper wire, in parts by mass, the formula of the anti-oxidation coating includes: hydroxyethyl cellulose 21 parts, 18 parts of tin octoate, 19 parts of methyl silane, 30 parts of triclosinate, 15 parts of fumaric acid diester, 18 parts of cerium oxide, 14 parts of dimethylaminopropylamine, 25 parts of sodium oleate, trihydroxy 17 parts of methylpropane trimethacrylate, 15 parts of cellulose acetate butyrate, 18 parts of vinyl acetate, 15 parts of montmorillonite powder, 14 parts of sepiolite powder, 10 parts of titanium dioxide, 5 parts of nano calcium sulfate, antifreeze 12 parts, 15 parts of methyl chloride, 13 parts of polyethylene wax, 16 parts of magnesium stearate, 12 parts of sodium stearate, 15 parts of dimethylol butyric acid, 17 parts of triisopropanolamine, 11 parts of graphite powder , 15 parts of ethyl acetate, 17 parts...

Embodiment 2

[0038] The difference from Example 1 is that the formula of the anti-oxidation coating includes: 27 parts of hydroxyethyl cellulose, 20 parts of tin octoate, 24 parts of methyl silane, 35 parts of triclosulphate, fumaric acid diester 25 parts, 26 parts of cerium oxide, 21 parts of dimethylaminopropylamine, 32 parts of sodium oleate, 24 parts of trimethylolpropane trimethacrylate, 25 parts of cellulose acetate butyrate, 26 parts of vinyl acetate, montmorillonite 21 parts of stone powder, 18 parts of sepiolite powder, 12 parts of titanium dioxide, 7 parts of nano calcium sulfate, 15 parts of antifreeze, 22 parts of methyl chloride, 20 parts of polyethylene wax, 18 parts of magnesium stearate, 16 parts of sodium stearate 18 parts of dimethylol butyric acid, 28 parts of triisopropanolamine, 15 parts of graphite powder, 17 parts of ethyl acetate and 22 parts of oxidizing agent.

Embodiment 3

[0040]The difference from Example 1 is that the formula of the anti-oxidation coating includes: 33 parts of hydroxyethyl cellulose, 23 parts of tin octoate, 29 parts of methyl silane, 41 parts of triclosulphate, fumaric acid diester 35 parts, 33 parts of cerium oxide, 29 parts of dimethylaminopropylamine, 38 parts of sodium oleate, 31 parts of trimethylolpropane trimethacrylate, 35 parts of cellulose acetate butyrate, 38 parts of vinyl acetate, montmorillonite 26 parts of stone powder, 23 parts of sepiolite powder, 15 parts of titanium dioxide, 9 parts of nano calcium sulfate, 18 parts of antifreeze, 27 parts of methyl chloride, 26 parts of polyethylene wax, 21 parts of magnesium stearate, 20 parts of sodium stearate Parts, 23 parts of dimethylol butyric acid, 31 parts of triisopropanolamine, 18 parts of graphite powder, 20 parts of ethyl acetate, 25 parts of oxidizing agent. The specific formula data of three groups of embodiments of the present invention are as follows:

[...

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Abstract

The invention discloses an anti-oxidation bonding copper wire, wherein the anti-oxidation bonding copper wire comprises a bonding copper wire and an anti-oxidation coating layer coated on the outer wall of the bonding copper wire. A formula of the anti-oxidation coating layer comprises the components in parts by weight: 21 to 33 parts of hydroxyethyl cellulose, 18 to 23 parts of tin octanoate, 19 to 29 parts of methylsilane, 30 to 41 parts of trichloro insecticidal ester, 15 to 35 parts of diester fumarate, 18 to 33 parts of cerium oxide, 14 to 29 parts of dimethylaminopropylamine, 25 to 38 parts of sodium oleate, 17 to 31 parts of trimethylolpropane trimethacrylate, 15 to 35 parts of cellulose acetate butyrate, 18 to 38 parts of vinyl acetate, 15 to 26 parts of montmorillonite powder, 14 to 23 parts of sepiolite powder, 10 to 15 parts of titanium dioxide, 5 to 9 parts of nano calcium sulfate, 12 to 18 parts of an anti-freezing agent, 15 to 27 parts of chloromethane, 13 to 26 parts of polyethylene wax, 16 to 21 parts of magnesium stearate and 12 to 20 parts of sodium stearate. The surface of the bonding copper wire is coated with the anti-oxidation coating layer through a laser melting method, the anti-oxidation performance of the bonding copper wire is further improved, and thus it is guaranteed that the bonding copper wire is not prone to oxidation in the storage, transportation and use processes.

Description

technical field [0001] The invention belongs to the technical field of oxidation-bonding copper wire, and in particular relates to an oxidation-resistant bonding copper wire; in particular, it also relates to a preparation method of an oxidation-resistant bonding copper wire. Background technique [0002] The bonding wires in integrated circuits and semiconductor discrete devices mainly use copper wires, that is, bonding copper wires. This kind of bonding copper wires is a relatively mature product and has the advantages of stable chemical properties. [0003] However, due to the high oxidation characteristics of copper wire, it must be used within the specified time after opening the package, and nitrogen and hydrogen mixed gas must be added to protect it, so that flammable and explosive gases will diffuse around the packaging and bonding production site, thereby It will increase the risk. If the exhaust system is installed, the temperature and humidity conditions will be f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D4/06C09D4/02C09D7/61C09D7/63C09D7/65
CPCC09D4/06C09D7/61C09D7/63C09D7/65
Inventor 王元锋王元钊李盛伟李蓝屏邱敏雄
Owner SHENZHEN ZHONGBAO NEW MATERIAL TECH CO LTD
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