Method for manufacturing circuit board with laser conductive pattern after only electroplating thickening and solderability treatment of holes

Abstract

The invention relates to a method for manufacturing a circuit board with a laser conductive pattern after only electroplating thickening and solderability treatment of holes. A multilayer copper-clad plate of which the inner-layer circuit is manufactured is coated with a chemical plating active seed and an anti-electroplating organic masking material, drilling is carried out, deposited copper is only electroplated on the hole wall to a required thickness; and then a weldability metal layer is electroplated and deposited, then a masking layer in a non-circuit area is removed through laser, and a conductive pattern is manufactured through copper foil. According to the method, the plate surface is masked through the anti-electroplating organic masking material, metal is only deposited on the hole wall, the quality of the plated-through hole of the circuit board is better, and the plated-through hole can better meet the electrical requirement; the laser spot diameter can be changed according to the pattern size, the copper foil removing speed is high, the machining effect is better, and finer conductive patterns can be manufactured; and the method for manufacturing the solder resist pattern by directly removing the material through laser has the advantages of fewer steps, high quality, low cost and environmental friendliness.

Description

technical field [0001] The invention belongs to the technical field of circuit manufacturing, and relates to laser processing technology, in particular to a method for manufacturing circuit boards by laser-guiding conductive patterns after electroplating thickening and solderability treatment holes. Background technique [0002] From concept to finished product, electronic products generally go through three stages: design, material preparation and assembly. [0003] After the physical design is completed, it is necessary to prepare materials, including selecting and customizing various components, connectors, display modules and other functional modules, etc. Among them, one of the most important materials is the bare circuit board, because the bare circuit board is used to support components and play the role of electrical interconnection between component pins, which is a difficult problem that affects the quality, reliability and entire manufacturing process of electroni...

AI Technical Summary

Problems solved by technology

Third, the increase in the thickness of copper foil and the resulting lateral etching is a factor that restricts the fineness of conductive patterns. In the process of manufacturing conductive patterns by chemical etching technology, the etching solution is in contact with copper foil for etching, except for the vertical direction of copper. The depth of the foil is carried out, because the etchant is in contact with the two sides of the wire, so that the etching is also carried out on both sides of the wire at the same time. The thicker the etched copper layer, the longer the time, the more serious the lateral etching phenomenon, and the lateral etching not only reduces If the width of the wire is reduced, there will be disconnection in severe cases

Fourth, the uneven thickness of copper foil is the bottleneck for the widespread application of laser-guided conductive pattern technology. Obviously, the thicker the copper foil, the greater the laser energy required, the more times it needs to be processed, and the faster the process will be. Slow; the more uneven the thickness of the copper foil, the more difficult the photoetching process is, either the laser power is too small in the area with a large copper foil thickness, the copper is not clean, and the residual copper affects the insulation performance, or the area with a small copper foil thickness Excessive laser power is applied, which ablates the insulating material under the copper foil and affects the quality of the circuit board.

Each of these single-function processes has its own inherent technical limitations, and they are mutually restrained and mutual results, which are the fundamental reasons for restricting higher quality, higher efficiency, and more environmental friendliness. It is necessary to improve each single-function process , update, but also need to be comprehensively optimized and upgraded as a whole

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