Fiber-free reinforced fluorine-containing resin-based high-frequency copper-clad plate and preparation method thereof

Abstract

The invention provides a fiber-free reinforced fluorine-containing resin-based high-frequency copper-clad plate. The fiber-free reinforced fluorine-containing resin-based high-frequency copper-clad plate comprises a fluorine-containing resin substrate positioned in the middle and copper foils positioned on two sides of the fluorine-containing resin substrate, the fluorine-containing resin substrate is prepared by the following steps: S1, adding a coupling agent into a 1-80wt / v% inorganic filler solution, stirring and reacting at 20-100 DEG C for 0.5-72 hours, filtering and drying to obtain a modified inorganic filler; s2, adding the modified inorganic filler obtained in the step S1 into hydroxylated fluorine-containing resin, heating to 220-350 DEG C, and stirring for 5-18 hours to obtain a fluorine-containing resin mixture; s3, adding the fluorine-containing resin mixture prepared in the step S2 into an injection molding machine, setting the temperature of a charging barrel to be 250-380 DEG C, the temperature of a mold to be 180-260 DEG C and the injection molding pressure to be 50-80 Mpa, and cooling at normal temperature to obtain a fluorine-containing resin substrate; the fiber-free reinforced fluorine-containing resin-based high-frequency copper-clad plate disclosed by the invention has the advantages of low hygroscopicity, low dielectric constant, low dielectric loss, high copper foil peel strength, relatively good adhesiveness and low possibility of falling off.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a non-fiber-reinforced fluorine-containing resin-based high-frequency copper-clad laminate and a preparation method thereof. Background technique [0002] At present, the information electronics industry is in a stage of rapid development and is gradually becoming one of the pillar industries of various countries. CCL is one of the key materials in the information electronics industry. It has been widely used in communication base stations, satellites, vending machines, computers, mobile phones and even gradually emerging wearable devices, driverless cars, drones and intelligent robots. field. [0003] Due to its unique chemical structure, fluorine-containing resin has extremely low dielectric constant and dielectric loss, high thermal stability and chemical stability, and is an ideal material for making high-frequency copper clad laminates. However, in genera...

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Problems solved by technology

Although the mechanical strength of the fluorine-containing substrate obtained in this patent is improved relative to the fluorine-containing substrate obtained by a single modification of the inorganic filler with a coupling agent, the increase in mechanical strength is limited

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