Organic acid super-coarsening micro-etching solution with high copper content and application of organic acid super-coarsening micro-etching solution

An organic acid and ultra-coarsening technology, which is applied to the removal of conductive materials by chemical/electrolytic methods, printed circuit manufacturing, printed circuits, etc., can solve problems such as easy crystallization, high copper ions, and clogged nozzles

Inactive Publication Date: 2022-06-28
SHENZHEN BANMING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

More importantly, if the copper ion is too high, it is easy to precipitate crystals, block the nozzle, etc. These problems will directly affect the yield of PCB production

Method used

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  • Organic acid super-coarsening micro-etching solution with high copper content and application of organic acid super-coarsening micro-etching solution
  • Organic acid super-coarsening micro-etching solution with high copper content and application of organic acid super-coarsening micro-etching solution
  • Organic acid super-coarsening micro-etching solution with high copper content and application of organic acid super-coarsening micro-etching solution

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0066] The preparation method of the organic acid ultra-coarsening micro-etching liquid with high copper content:

[0067] Step 1: Weigh the copper ion source, organic acid and chloride ion source of the formula, add them in deionized water and stir to dissolve;

[0068] Step 2: Weigh the water-soluble polymer complexing agent and the polyhydroxy compound of the formula amount in the solution obtained in step 1, and stir evenly;

[0069] Step 3: Dilute the solution obtained in Step 2 to 1L with deionized water, and stir evenly to obtain the micro-etching solution.

[0070] Ultra-roughening method of printed circuit board

[0071] The ultra-roughening method includes the following steps: S1: degreasing; S2: washing with water; S3: micro-etching; S4: washing with water; S5: pickling; S6: drying.

[0072] Among them, in the degreasing step, a solution of 3%-5% HCl is selected for cleaning at 25°C-35°C for 10s-15s. The micro-etching step adopts the ultra-roughening micro-etchin...

Embodiment 1

[0076] 1) Including the following components and their mass concentrations:

[0077] Formic acid: 50g / L;

[0078] Divalent cupric ion: 30g / L, from cupric chloride;

[0079] Chloride ion: 33.28g / L, from copper chloride;

[0080] Complexing agent: 55g / L, wherein, ammonium acetate: 52g / L, imidazolidinone: 3g / L;

[0081] Polyol: 0.09g / L, from glycerol;

[0082] Water-soluble polymer (I): 0.001g / L, water-soluble polymer (I) is polyethyleneimine;

[0083] Deionized water: balance.

[0084] 2) Preparation method:

[0085] Step 1: Weigh the copper ion source, organic acid and chloride ion source of the formula, add them in deionized water and stir to dissolve;

[0086] Step 2: Weigh the water-soluble polymer and the pyridine derivative in the formula amount in the solution obtained in step 1, and stir evenly;

[0087] Step 3: Dilute the solution obtained in Step 2 to 1L with deionized water, and stir evenly to obtain the crude solution.

Embodiment 2

[0089] 1) Including the following components and their mass concentrations:

[0090] Formic acid: 50g / L;

[0091] Divalent cupric ion: 35g / L, from cupric chloride;

[0092] Chloride ion: 38.8g / L, from cupric chloride;

[0093] Complexing agent: 55g / L, wherein ammonium acetate: 52g / L, hydroxymethylimidazolidinone: 3g / L;

[0094] Polyhydroxy compound: 0.075g / L, from methyl glycerol;

[0095] Water-soluble polymer (I): 0.030g / L, water-soluble polymer (I) is polyethyleneimine;

[0096] Deionized water: balance.

[0097] 2) Preparation method: the same as in Example 1.

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Abstract

The invention discloses an organic acid super-roughening micro-etching solution with high copper content and application thereof, and relates to the technical field of printed circuit board treatment. The organic acid super-roughening micro-etching liquid comprises the following components in mass concentration: 10-70g/L of bivalent copper ions from a copper ion source, 10-180g/L of organic acid, 5-80g/L of chloride ions from a chloride ion source, 5-90g/L of a complexing agent, 0.0005-2g/L of a polyhydroxy compound, 0.0001-0.6 g/L of a water-soluble polymer and a solvent which is deionized water. Through innovation of the copper complexing agent and the polyhydroxy compound, the copper content of the organic acid super-coarsening micro-etching liquid can reach 50 g/L or above, the coarsening morphology of the copper surface under the high copper content is uniform, the color of the plate surface is uniform, and crystallization and separation of copper salt cannot be generated.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board processing, and particularly relates to an organic acid ultra-roughening micro-etching solution with high copper content and its application. Background technique [0002] Pattern transfer is an important process in the printed circuit board (PCB) production process. In the pattern transfer process, it is necessary to use dielectric materials such as dry film, wet film and solder mask ink to complete. Therefore, the adhesion between the conductor copper layer and the above-mentioned dielectric materials directly affects the production yield, key performance and reliability of the PCB. Surface treatment is a common method for improving the adhesion of conductor copper layers to dielectric materials during the production of printed circuit boards. Common surface treatment methods include nylon brush, volcanic ash, chemical micro-etching and roughening. The common characteristics of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18H05K3/06
CPCC23F1/18H05K3/067
Inventor 陈修宁王立中李晨庆黄志齐王淑萍
Owner SHENZHEN BANMING SCI & TECH CO LTD
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