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Vapor depositing in-situ reaction process for preparing carbon nanotube reinforced copper-base composite material

A copper-based composite material, carbon nanotube technology, applied in metal material coating process, gaseous chemical plating, coating and other directions, can solve the problem of destroying the original properties of carbon nanotubes, and achieve improved mechanical properties and thermal properties. Effect

Inactive Publication Date: 2007-01-03
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Recently, Seung I. Cha et al. prepared carbon nanotube-reinforced copper-based composite materials by molecular mixing method, which solved the dispersion problem of carbon nanotubes better, but this method also requires complex purification of carbon nanotubes, Surface functionalization and other processes destroy the original properties of carbon nanotubes, but fail to obtain comprehensive properties with high strength and high conductivity at the same time

Method used

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  • Vapor depositing in-situ reaction process for preparing carbon nanotube reinforced copper-base composite material
  • Vapor depositing in-situ reaction process for preparing carbon nanotube reinforced copper-base composite material

Examples

Experimental program
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Effect test

Embodiment 1

[0018] After immersing 18g of electrolytic copper powder in 30mL of absolute ethanol for several hours, it was mixed with 7.926g of nickel nitrate hexahydrate and 1.723g of yttrium nitrate hexahydrate to make 363mL aqueous solution, and then 2.721g of sodium hydroxide was made into 272mL aqueous solution under magnetic stirring. Add dropwise to the above solution to obtain Ni(OH) 2 / Y(OH) 3 / Cu ternary colloid; the ternary colloid is washed and filtered, dehydrated and dried in a vacuum drying oven at 80°C, ground with an agate mortar, and calcined at 400°C under nitrogen protection for 2h to obtain Ni / Y / Cu catalyst Precursor. Then take 2g of Ni / Y / Cu catalyst precursor, raise the temperature to 500°C under the protection of nitrogen, stop the nitrogen, pass in hydrogen for reduction, and the hydrogen flow rate is 80 mL / min. After keeping for 4 hours, turn off the hydrogen, turn on the nitrogen and continue heating to 550°C, and then pass in a mixed gas of nitrogen and methane (nit...

Embodiment 2

[0020] After soaking 38g of electrolytic copper powder in 30mL of absolute ethanol for several hours, make 363mL of aqueous solution with 7.926g of nickel nitrate hexahydrate and 1.723g of yttrium nitrate hexahydrate, and then make 2.721g of sodium hydroxide into 272mL of aqueous solution, under magnetic stirring Add dropwise to the above solution to obtain Ni(OH) 2 / Y(OH) 3 / Cu ternary colloid; the ternary colloid is washed and filtered, dehydrated and dried in a vacuum drying oven at 150°C, ground with an agate mortar, and calcined at 400°C under nitrogen protection for 2h to obtain Ni / Y / Cu catalyst Precursor. Then take 2g of Ni / Y / Cu catalyst precursor, raise the temperature to 500°C under the protection of nitrogen, stop the nitrogen, and pass in hydrogen for reduction, and the hydrogen flow rate is 200 mL / min. After holding for 1.5h, turn off the hydrogen, turn on the nitrogen and continue heating to 700°C, and then pass in a mixed gas of nitrogen and methane (nitrogen flow ra...

Embodiment 3

[0022] After soaking 38g of electrolytic copper powder in 30mL of absolute ethanol for several hours, make 363mL of aqueous solution with 7.926g of nickel nitrate hexahydrate and 1.723g of yttrium nitrate hexahydrate, and then make 2.721g of sodium hydroxide into 272mL of aqueous solution, under magnetic stirring Add dropwise to the above solution to obtain Ni(OH) 2 / Y(OH) 3 / Cu ternary colloid; the ternary colloid is washed and filtered, dehydrated and dried in a vacuum drying cabinet at 100°C, ground with an agate mortar, and calcined at 400°C under nitrogen protection for 2h to obtain Ni / Y / Cu catalyst Precursor. Then take 2g of Ni / Y / Cu catalyst precursor, heat up to 400°C under the protection of nitrogen, stop the nitrogen, pass in hydrogen for reduction, and the flow rate of hydrogen is 100mL / min. After keeping for 4 hours, turn off the hydrogen and pass in a mixed gas of nitrogen and methane (nitrogen flow rate is 420mL / min, methane flow rate is 60mL / min) and react for 1 hour...

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Abstract

The present invention is preparation process of carbon nanotube reinforced copper-base composite material with high strength and high conductivity, and belongs to the field of copper-base composite material preparing technology. The preparation process includes the following steps: adding nickel nitrate hexahydrate, yttrium nitrate hexahydrate and ethanol soaked copper powder in certain weight proportion into distilled water to obtain nickel nitrate solution; dropping sodium hydroxide solution to the nickel nitrate solution to produce neutralizing reaction obtaining ternary Ni(OH)2 / Y(OH)3 / Cu colloid; washing, filtering, drying, grinding and calcining to obtain Ni / Y / Cu catalyst precursor; setting the precursor into reaction furnace, introducing H2 to reduce, and introducing N2 and reaction gas for catalytic cracking reaction to obtain composite carbon nanotube / Cu powder; initially pressing the composite powder, sintering and re-pressing to obtain carbon nanotube in-situ reinforced copper-base composite material.

Description

Technical field [0001] The invention relates to a method for preparing a high-strength and high-conductivity copper-based composite material by carbon nanotube-reinforced copper-based composite materials, and belongs to the preparation technology of copper-based composite materials. Background technique [0002] High-strength and high-conductivity copper-based materials are a class of functional materials with excellent comprehensive physical and mechanical properties. It not only has high strength and good plasticity, but also has good conductivity (electrical conductivity and thermal conductivity), so it is widely used in lead frames of integrated circuits, various welding electrodes, contacts of electrical engineering switches, and engine Collecting rings, armatures, rotors, empty overhead wires of electric trains, and metallurgical industry's blast furnace tuyeres, continuous casting molds, oxygen lance nozzles and other demanding electrical and heat-conducting environments. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/04C22C9/00C23C16/26C01B31/02
Inventor 赵乃勤康建立师春生杜希文李家俊
Owner TIANJIN UNIV
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