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Flame retardant adhesive without halogen in use for flexible printed circuit

A technology for printed circuits and adhesives, applied in printed circuit parts, adhesive types, circuit substrate materials, etc., can solve the problems of hydrogen halide gas, environmental pollution, etc., and achieve long storage period and good flame retardant effect. Effect

Active Publication Date: 2007-02-21
华烁电子材料(武汉)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of adhesive has good flame retardant effect, but it will produce hydrogen halide gas, dioxin and furan toxic substances when burning, which will pollute the environment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Take 100 grams of butyl methacrylate, 40 grams of methyl methacrylate, 40 grams of acrylonitrile, 40 grams of allyl dibutyl phosphate, 10 grams of methacrylic acid, 10 grams of glycidyl methacrylate, 2,2 5 grams of '-azobisisobutyronitrile, 4 grams of sodium dodecylsulfonate and 600 grams of OP-10 6 grams of deionized water are heated in a 2000 milliliter four-necked flask with agitator, condenser, and thermometer Reflux for 4 hours, cool, and filter to obtain multi-component copolymerized acrylate emulsion. Add 40 grams of triphenyl phosphate and 45 grams of magnesium hydroxide, and mix evenly to obtain the halogen-free flame-retardant adhesive for flexible printed circuits of the present invention.

[0049] Apply the prepared adhesive evenly on one side of a 25 micron thick polyimide film, pre-bake in an oven at 115±5°C for 30 minutes, and cool to room temperature. Laminated with 35 micron thick electrolytic copper foil, in a composite press at 170 ° C, 50 kg / cm 2 K...

Embodiment 2

[0051] Take 50 grams of ethyl acrylate, 20 grams of pentyl acrylate, 15 grams of acrylonitrile, 15 grams of propylphenyl allyl phosphate, 3 grams of acrylic acid, 3 grams of methacrylamide, 2 grams of ammonium persulfate, dodecyl 2 grams of potassium sulfate and 3 grams of Tween 60, 300 grams of deionized water, heated and refluxed for 8 hours in a 1000 milliliter four-necked flask with a stirrer, a condenser, and a thermometer, cooled, and filtered to obtain a multi-component copolymerized acrylate emulsion. Add 20 grams of triethyl phosphate and 20 grams of aluminum hydroxide, and mix evenly to obtain the halogen-free flame-retardant adhesive for flexible printed circuits of the present invention.

[0052] The prepared adhesive is evenly coated on one side of a 12.5 micron thick polyimide film, pre-baked in an oven at 80±5°C for 60 minutes, and cooled to room temperature. Laminated with 12 micron thick electrolytic copper foil, in a composite press at 180°C, 30 kg / cm 2 Keep...

Embodiment 3

[0054] Take 40 grams of styrene, 10 grams of propyl methacrylate, 8 grams of vinyl acetate, 10 grams of allyl ethyl methyl phosphate, 2 grams of glycidyl acrylate, 2 grams of methacrylamide, dibenzoyl peroxide 1 gram, 0.5 grams of sodium lauryl sulfate and 2.5 grams of Span 80, 200 grams of deionized water, heated and refluxed for 12 hours in a 500 milliliter four-neck flask equipped with a stirrer, condenser, and thermometer, cooled, and filtered to obtain multi-component copolymerization Acrylic emulsion. Add 10 grams of tricresyl phosphate and 5 grams of silicon dioxide, and mix evenly to obtain the halogen-free flame-retardant adhesive for flexible printed circuits of the present invention.

[0055] Apply the prepared adhesive evenly on one side of a 50 micron thick polyimide film, pre-bake in an oven at 100±5°C for 40 minutes, and cool to room temperature. Laminated with 50 micron thick electrolytic copper foil, in a composite press at 150°C, 40 kg / cm 2 Keep it under pr...

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PUM

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Abstract

This invention discloses a method for preparing halogen-free and flame-retardant acrylate adhesive for flexible printing circuit board. The adhesive comprises: multiple acrylate monomers, allyl phosphate, crosslinking monomer, initiator, emulsifier, phosphorus-containing filler and inorganic filler. The method comprises: (1) adding multiple acrylate monomers, allyl phosphate, crosslinking monomer, initiator and emulsifier into a reactor; (2) adding deionized water, heaing and polymerizing under stirring to synthesize an emulsion; (3) adding the fillers into the emulsion to obtain the halogen-free and flame-retardant acrylate adhesive. The adhesive can be used for interlayer adhering of multi-layered flexible printing circuit board, and the obtained flexible printing circuit board has such adadvantages as good flame retardancy, high peel strength, good Sn weldability and good synthetic properties.

Description

technical field [0001] The invention relates to a formulation of an acrylate multi-polymer copolymer halogen-free flame-retardant adhesive and the application of the adhesive on a flexible printed circuit base material. technical background [0002] Nowadays, printed circuit boards are widely used in various fields, and almost all electronic devices contain corresponding printed circuit boards. The use of flexible printed circuit boards can reduce the volume and realize the advantages of thin, light and small products. Therefore, high-tech electronic products such as automotive satellite direction positioning devices, digital cameras, folding mobile phones and LCD TVs that have emerged in recent years have adopted a large number of high-tech electronic products. Flexible printed circuit boards. [0003] Improving the flame retardancy of printed circuit boards is a very important aspect to ensure the safety of the entire electronic system or equipment and prolong its service...

Claims

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Application Information

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IPC IPC(8): C09J133/04H05K1/05
Inventor 范和平熊云
Owner 华烁电子材料(武汉)有限公司
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