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Method of preparing high performance conductive glue

A conductive adhesive, high-performance technology, applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of unstable contact resistance, insufficient impact strength, and unstable contact of conductive adhesives, and achieve high practicality Value, low cost, good aging resistance

Inactive Publication Date: 2007-04-18
ZHEJIANG SCI-TECH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As a substitute for Sn / Pb solder, conductive adhesive also shows some shortcomings of its own in practical applications: for example, the content of conductive filler in conductive adhesive generally has to reach about 33% (volume percentage) before there is a sudden change in resistance phenomenon, resulting in a relative reduction in the resin content in the conductive adhesive, and the resin is the main source of the bond strength, so the impact strength of the conductive adhesive is not good enough compared to the Sn / Pb solder; the conductive adhesive is filled with conductive particles in the resin matrix Conducting electricity by forming a conductive network in the middle, the quality of the network formation has a great influence on the electrical properties and aging resistance of the conductive adhesive. The quality of the network mainly depends on the type, shape, size, and conductivity of the filled conductive particles. etc. Recently, there have been many domestic and foreign literatures reporting conductive adhesives filled with different fillers, such as filled with micron-scale silver powder, micron-scale and nano-scale silver mixed powder, flake silver powder, nickel powder, etc.
The conductive adhesive filled with granular conductive fillers is unstable due to the small contact area between particles, and the conductive adhesive shows strong contact resistance instability.

Method used

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  • Method of preparing high performance conductive glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Follow the preparation process (1) and (2), using 1 volume of 0.1mol / l AgNO 3 Ethylene glycol solution, 1 volume of 0.6mol / l PVP ethylene glycol solution, inject 2 volumes of ethylene glycol solution, and the mixed solution is refluxed at 160°C for 60 minutes. After the reaction, 5-10 times volume of acetone was added to the mixed solution and then centrifuged in a centrifuge at 10,000 rpm for 30 minutes to remove the upper layer solution, and the lower layer solid was washed with acetone 3 times and then vacuum dried. The transmission electron microscope observation (TEM) test is to disperse the dried powder in toluene by ultrasonic treatment, and then drop the solution on a copper mesh coated with a carbon film and dry at room temperature. The TEM model is JEOL200CX. Field emission scanning electron microscopy (FESEM) samples are powder samples dispersed in ethanol and dropped on the sample stage. After the ethanol is volatilized, the scanning electron microscope is used ...

Embodiment 2

[0028] Follow the preparation process (1) and (2), using 1 volume of 0.1mol / l AgNO 3Ethylene glycol solution, 1 volume 0.5mol / l PVP ethylene glycol solution, poured into 1.5 volume ethylene glycol solution, and the mixed solution was refluxed at 150°C for 70 minutes. After the reaction, 5-10 times volume of acetone was added to the mixed solution, and then centrifuged in a centrifuge at 8000 rpm for 20 minutes to remove the upper layer solution, and the lower layer solid was washed with acetone 3 times and then vacuum dried. According to the preparation process (3), the specific weight percentage of phenolic resin, curing agent, antioxidant, anti-aging agent crosslinking agent, and silver nanowire and nanoparticle mixed powder is 1:0.5:0.1:0.05:0.1:0.5, Add the mixed powder of silver nanowires and silver nanoparticles to epoxy resin or phenolic resin for stirring and mixing, and then add an appropriate amount of polyurethane curing agent, crosslinking agent, antioxidant, and antio...

Embodiment 3

[0030] Follow the preparation process (1) and (2), using 1 volume of 0.1mol / l AgNO 3 Ethylene glycol solution, 1 volume 0.5mol / l PVP ethylene glycol solution, injected into 1.7 volume ethylene glycol solution, and the mixed solution was refluxed at 170°C for 90 minutes. After the reaction, 5-10 times volume of acetone was added to the mixed solution and then centrifuged in a centrifuge at 9000 rpm for 30 minutes to remove the upper layer solution, and the lower layer solid was washed with acetone 3 times and then vacuum dried. According to the preparation process (3), the specific weight percentage of epoxy resin (or phenolic resin), curing agent, antioxidant, antioxidant crosslinking agent, and silver nanowire and nanoparticle mixed powder is 1:0.7:0.12: 0.08:0.11:0.7, add the mixed powder of silver nanowires and silver nanoparticles to epoxy resin or phenolic resin for stirring and mixing, and then add an appropriate amount of polyurethane curing agent, crosslinking agent, antio...

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Abstract

This invention provides a high performance electric conduction paste preparation. The mixed powder of argentine nanometer lines and argentine nanometer particles is produced in bulk with the method of ethylene glycoldeoxidizing argent nitrate. A neotype isotrope electric conduction paste is made with such mixed powder of argentine nanometer lines and argentine nanometer particles which is used as electric conduction bulking agent and filling epoxy resin and phenol formaldehyde resin. Compared with traditional electric conduction paste, this paste not only has outstanding electricity performance, but also has outstanding mechanics performance just because the reduction of bulking agent.

Description

Technical field [0001] The invention belongs to the technical field of material preparation, and particularly relates to a method for preparing a high-performance isotropic conductive adhesive. Background technique [0002] Sn / Pb solder has been used for many years as a basic connection material used in the electronic packaging industry, such as chip connection; IC (integrate circuit) assembly into PCB (print circuit board) and other aspects. However, due to the presence of Pb in Sn / Pb solder, which is a heavy metal element, it has great toxicity. The soldering temperature is too high and it is easy to damage the device and substrate; there is a "bridging" phenomenon in the solder, which cannot be used for high-density integrated circuits. Defects limit its application. Since the conductive adhesive uses metal powder to conduct electricity, the line resolution of the connection can be greatly improved, which can meet the requirements of high capacity. The matrix is ​​a polymer ma...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J163/00C09J161/00C09J175/04
Inventor 张国庆吴海平蔡金锅
Owner ZHEJIANG SCI-TECH UNIV
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