Kind of prepolymer and its product-thermosetting resins composite

Abstract

The invention provides a kind of prepolymer with 4-(N-maleimide phenyl)Ether (MPGE) epoxy resin and 4,4′-diphenylmethane bismaleimide (BMI) as reactants, with free radical initiator leading to reaction in solvents, and adding inhibitor after reaction, with the mole ratio of 0.05-0.5 for BMI and MPGE; the initiator usage is 0.01%-0.15% of mole total for reactant monomers; the solvent usage is 50%-70% of the total weight of the reactants; the inhibitor usage is half to double of mole amount of the initiator used. This kind of prepolymer can be used to produce high-performance thermosetting resin composition corresponding to the packaging requirements for electronic components and Integrated Circuits (IC).

Description

BACKGROUND OF THE INVENTION[0001](a) Field of the Invention[0002]The present invention involves a kind of prepolymer, and from which producing a kind of high-performance thermosetting resin composition corresponding to the packaging requirements for electronic components and Integrated Circuits (IC).[0003](b) Description of the Prior Art[0004]Increasing demands on light-weight, small-scale and high densification for electronic and communication products are driving the development of printed circuit board towards thinning and microporosity techniques. In addition to continued improvement with miniaturization of Surface Mounting Technology (SMT), the demand on high quality IC package substrate is boosted constantly.[0005]For conventional IC package, the wire frame is used as the IC conducting circuit and the vehicle for IC, connected to the pins on sides or circumference. With the development of IC package technology, the increase of the number of pins (over 300 pins), the routing de...

AI Technical Summary

Benefits of technology

This patent describes a new type of high-heat resistance thermosetting resin composite that can be used for packaging electronic components and integrated circuit (IC) due to its excellent properties such as high glass transition temperature, low water absorption rate, high resistance to heat impact, and excellent thermal conductivity. The composite is made up of prepolymers made from a combination of maleimide phenyl ether (MPGE) epoxy resin and 4,4′-diphenylmethane bismaleimide (BMI) as reactants, with the addition of an initiator and a solvent. The resulting composite has a high solids weight of between 40% and 70%. The patent also describes the use of a new type of initiator and the addition of a new solvent to improve the performance of the composite. The resulting composite has excellent properties such as high glass transition temperature, low water absorption rate, high resistance to heat impact, and excellent thermal conductivity. The patent also describes the use of different fillers and solvents to create the composite.

Problems solved by technology

With the development of IC package technology, the increase of the number of pins (over 300 pins), the routing density augment, and the increase of the number of layers of substrates, limit its development for the traditional package method such as QFP (Quad Flat Package) etc.

The great amount of heat generated with power consumption by electronic components would lead to increase the temperature of device.

The other problem to be solved is that the coefficient of thermal expansion for IC package carrier is incongruent with it of semiconductor chips.

Even if the build-up multi-layer boards suited for minuteness circuit manufacturing technology, the problem about common excessive thermal expansion coefficient of insulated substrate (typically the thermal expansion is about 60 ppm / ° C.) also exists.

To make the coefficient of thermal expansion of substrate reach 6 ppm or so near that of semiconductor chips is surely a “formidable challenge”.

But the performance of epoxide resin at high temperature is not good enough, mainly higher dielectric constant (for example, the epoxide resin-basic package carrier E-679F developed by Hitachi Chemical Co., Ltd. has dielectric constant of 4.85 and 4.53 corresponding at frequency 1 MHz and 1 GHz respectively) and greater water absorption rate.

Therefore, the cured epoxide resin is very sensitive to water at high temperature and high humidity.

However, cyanate resin has itself high cost and weaknesses such as high brittleness, high water absorbtivity after it cured.

Bismaleimide has good damp and hot performance at high temperature of 230-250° C. But bismaleimide is insoluble in conventional organic solvents normally, so difficult for processing.

Further more, the weaknesses for bismaleimide that the curing condition too severe and too great brittleness which makes easy produce micro-cracks under thermal shock also exist.

But due to the crosslinking density of BT resin after polymerization large, plus the triazine ring structure in molecule high symmetreal, crystallinity high, that bring about the solids more brittle, and the price expensive resulting from complicated syntheses process of cyanate resin (CE) used, therefore increasing ductility and processability and reducing the cost is where the work centre of many derived patents is since the BT resin patent published by Mitsubishi Gas Co., Ltd. on August, 1978.

Further more, the epoxide resin / bismaleimide system, BT resin etc. are unable to form a stable solution in all kinds of low-boiling solvent.

And application of DMF and N-methylpyrrolidone solvents etc. will speed up the reactivity of resin system and severely affect the gelation time of resin composition, bring some problems along topping with gum.

If just simple blending, the phase separation would be brought since poor consistency between the both, that is not suit prepreg process.

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