Leadless alloy tin solder plaster and manufacturing method thereof

Abstract

The invention discloses a tin solder plaster of leadless alloy and making method, which consists of soldering flux and leadless tin solder alloy powder, wherein the soldering flux is composed of organic solute and organic solvent; the organic solute contains macromolecular PVP, macromolecular PEG and or PVA, abietic acid or modified abietyl, aliphatic acid monoglyceride and aliphatic acid sorbate; the organic solvent is one or more composition of anhydrous alcohol, ethandiol, cycloethane, glycol ethylene and diglycol ethylene.

Description

technical field

[0001] The invention relates to a welding material for assembly of electronic components, in particular to a lead-free alloy solder paste and a preparation method thereof, which are suitable for electronic assembly and packaging in the fields of electronic communication, aerospace, automobiles, locomotives and the like. Background technique

[0002] The EU RoHS Directive stipulates that electronic products and components exported to Europe must be free from lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr 6+ ), two kinds of brominated flame retardants including polybrominated biphenyls (PBBs), polybrominated diphenyl ethers (PBDEs) and other harmful substances are strictly restricted. This regulation involves 10 categories and nearly 200,000 product items, covering almost all electronic information products. China is a big manufacturing country in the world and a big exporter of products. More than 70% of the total export of electronic products...

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