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Leadless alloy tin solder plaster and manufacturing method thereof

A lead-free alloy and lead-free solder technology, which is used in welding equipment, metal processing equipment, welding media, etc., can solve the problems of narrow temperature range, inability to maintain printing shape with flux, inconvenient processing and production, etc. Wide range, excellent wettability and weldability, low cost effect

Inactive Publication Date: 2007-08-08
苏州盖依亚生物医药有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it brings inconvenience to normal processing and production
[0003] The flux currently used is mainly composed of modified rosin ester resin, modified castor oil, polyol ether or ester, and a small amount of long-chain dibasic acid. The solder powder is lead-free solder paste such as SnAgCu and SnAg. In other words, the liquidus line is 34-40°C higher than that of SnPb solder. With the increase of preheating temperature, the increase of preheating interval, and the increase of soldering time, the flux cannot maintain the original printing morphology, resulting in the collapse of printed dots or lines. , resulting in solder joint spread
[0004] In particular, it should be pointed out that the lead-free alloy solder paste in the prior art often only has a narrow range of crystallization temperature range, for example, usually 217°C-219°C, resulting in a narrow range of adjustable soldering temperature, so it is only suitable for specific electronic circuit board

Method used

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  • Leadless alloy tin solder plaster and manufacturing method thereof

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preparation example Construction

[0023] The preparation technology and method of lead-free alloy solder paste are characterized in that: using centrifugal atomization technology to prepare alloy powder with controllable shape, uniform particle size distribution and narrow particle distribution as the main material of lead-free solder paste; (polyvinylpyrrolidone), PEG (polyethylene glycol), PVA (polyvinyl alcohol), rosin (acid) / modified rosin, and organic additives fatty acid monoglyceride, fatty acid sorbitol ester, absolute ethanol, ethylene glycol Alcohol, cycloethylene, ethylene glycol, ethylene glycol and other solvents are combined into flux to realize the compounding and preparation of lead-free alloy solder paste.

[0024] The mass ratio of the alloy powder to the flux is: alloy powder: flux=87~90:10~13; the main material alloy powder is tin / silver / copper alloy powder; the composition ratio of the alloy powder is Tin 96.5, silver 3, copper 0.5; the particle size of the alloy powder is between 25 μm an...

Embodiment 1

[0027] A: Flux formula:

[0028] PVP (average molecular weight 1200) 8.0%; PEG (average molecular weight 800) 6.0%; fatty acid monoglyceride 8.5%; fatty acid sorbitol ester 2.5%; rosin (first grade, ie abietic acid / modified rosin) 40.0%; Ethylene glycol 15.0%; Ethylene ring 20.0%.

[0029] First mix rosin with cycloethane and ethylene glycol in proportion, heat and reflux until the rosin is completely dissolved, then add PVP and PEG, continue heating and reflux to form a uniform solution, and add fatty acid monoglyceride and fatty acid sorbic acid under stirring conditions Ester, stir evenly, its viscosity is 6500mps.

[0030] B. Solder paste preparation

[0031] The mass ratio of the flux to the spherical alloy powder of Sn96.5Ag3.0Cu0.5 with an average particle size of 32 μm is:

[0032] Alloy powder: flux=88:12, mix and stir evenly;

[0033] A bottle of 500g is individually packaged, sealed and stored at low temperature (4-8°C). Tested by SGS, it complies with EU RoHS ...

Embodiment 2

[0035] A: Flux formula:

[0036] PVP (average molecular weight is 2200) 6.0%; PEG (average molecular weight is 1000) 8.0%; fatty acid monoglyceride 6.5%; fatty acid sorbitol ester 4.5%; rosin (first grade, ie abietic acid / modified rosin) 35.0%; Ethylene glycol 20.0%; Ethylene ring 20.0%.

[0037] First mix rosin with cycloethane and ethylene glycol in proportion, heat and reflux until the rosin is completely dissolved, then add PVP and PEG, continue heating and reflux to form a uniform solution, and add fatty acid monoglyceride and fatty acid sorbic acid under stirring conditions acid ester, just stir well.

[0038] B. Solder paste preparation

[0039] The mass ratio of the flux to the spherical alloy powder of Sn96.5Ag3.0Cu0.5 with an average particle size of 35 μm is:

[0040] Alloy powder: flux=88:12, mix and stir evenly;

[0041] A bottle of 500g is individually packaged, sealed and stored at low temperature (4-8°C).

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Abstract

The invention discloses a tin solder plaster of leadless alloy and making method, which consists of soldering flux and leadless tin solder alloy powder, wherein the soldering flux is composed of organic solute and organic solvent; the organic solute contains macromolecular PVP, macromolecular PEG and or PVA, abietic acid or modified abietyl, aliphatic acid monoglyceride and aliphatic acid sorbate; the organic solvent is one or more composition of anhydrous alcohol, ethandiol, cycloethane, glycol ethylene and diglycol ethylene.

Description

technical field [0001] The invention relates to a welding material for assembly of electronic components, in particular to a lead-free alloy solder paste and a preparation method thereof, which are suitable for electronic assembly and packaging in the fields of electronic communication, aerospace, automobiles, locomotives and the like. Background technique [0002] The EU RoHS Directive stipulates that electronic products and components exported to Europe must be free from lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr 6+ ), two kinds of brominated flame retardants including polybrominated biphenyls (PBBs), polybrominated diphenyl ethers (PBDEs) and other harmful substances are strictly restricted. This regulation involves 10 categories and nearly 200,000 product items, covering almost all electronic information products. China is a big manufacturing country in the world and a big exporter of products. More than 70% of the total export of electronic products...

Claims

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Application Information

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IPC IPC(8): B23K35/36B23K35/363B23K35/26B23K35/02
Inventor 王家君史启媛
Owner 苏州盖依亚生物医药有限公司
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