Silicon dioxide hollow sphere/polymer composite heat insulating material and method for preparing same

A technology of silica and heat insulation materials, which is applied in the field of silica hollow sphere/polymer composite heat insulation materials, can solve the problems of poor heat insulation effect and poor mechanical strength of composite heat insulation materials, and achieve excellent heat insulation Performance, suppression of convective heat transfer, effect of reducing agglomeration

Active Publication Date: 2009-11-25
INST OF PROCESS ENG CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, among polymer or fibrous inorganic mineral reinforced silica airgel, silica airgel is an excellent thermal insulation material with a "fractal" network structure of nanoparticles and a large number of nanopore structures containing gas, but Its mechanical strength is poor, and it is reinforced by compounding with polymers or fibrous minerals, so that the mechanical propert...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Refer to the template method synthesis technology based on precipitation kinetics control described in Document 1: Wu Xiaofeng, Chen Yunfa, Wei Lianqi, Wang Qi Process Engineering Journal, 2006, 6 (Suppl.2) 285-289 to prepare non-agglomerated, monodisperse, sub- Micron silica hollow sphere powder. Disperse 0.3g of monodisperse polystyrene (PS) colloidal particles (with an average particle size ranging from 112 to 757nm) in a mixed solution of 94.5ml / 5.5ml of ethanol / water, and after ultrasonic treatment for 25min, add 1.3ml of concentrated ammonia water dropwise , after stirring evenly, continue to add 2.5ml of tetraethyl silicate (TEOS) dropwise, react for 10h, after that, centrifuge to separate the solid, redisperse in the mixed solution of 94.5ml / 5.5ml ethanol / water, repeat the above precipitation process, After centrifugation, wash with ethanol three times, then separate and dry; after that, heat up to 600°C at a heating rate of 3°C / min and keep it warm for 2 hours ...

Embodiment 2

[0028] 8g xylitol, 0.03g triethanolamine (co-catalyst) are mixed and stirred evenly, according to the amount of 0 (as a comparison), 5wt%, 15wt%, 25wt% and 35wt% of the polyether polyol quality, add in the embodiment 1 The obtained modified silicon dioxide hollow sphere powder A was ultrasonically treated for 20min under stirring, after that, 10g isocyanate (curing agent) was added under constant stirring, and 0.0028g dibutyltin dilaurate (catalyst) was added under stirring, and Pour the mixed slurry into a stainless steel mold with polytetrafluoroethylene in the size of 5mm×5mm×2mm, and after curing at room temperature for 24 hours, the silica hollow sphere / polyurethane composite heat insulation material S-PU-120nm of the present invention is obtained after demolding .

[0029] Test the thermal insulation performance of the S-PU-120nm series samples. In the present invention, the heat insulation performance test of material composite is carried out in Physical Property Measu...

Embodiment 3

[0033] Using surface modification technology, 0.8g of the silica hollow sphere powder prepared in Example 1 was added to the 100ml ethanol solution of 1.5g epoxypropyltriethoxysilane coupling agent, and after ultrasonication for 25min, room temperature Stir at low temperature for 12 hours, separate and wash with ethanol for 3 times, and then vacuum-dry to obtain hollow silica spherical powder B with an average diameter of 719 nm and surface epoxy group modification.

[0034] Polyethylene terephthalate 8g is dissolved in the mixed solution of 15ml phenol-tetrachloromethane, then according to the quality of polyethylene terephthalate 0 (as contrast), 4wt%, 12wt%, 28wt% and 32wt%, add modified silica hollow sphere powder B, and ultrasonically treat for 20min under stirring, after that, pour the mixed slurry into a stainless steel with polytetrafluoroethylene in the size of 5mm×5mm×2mm In the mold, after drying at room temperature for 48 hours, transfer to a vacuum oven for vacuum...

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Abstract

The invention relates to a silicon dioxide hollow sphere/polymer composite heat insulating material and a method for preparing the same. The composite material comprises a polymer substrate and submicron, agglomeration-free and monodisperse silicon dioxide hollow spheres evenly dispersed in the substrate, wherein the polymer substrate is a substrate of epoxy, polyurethane or polyethylene terephthalate; and for the submicron silicon dioxide hollow spheres, the hollow internal diameter is between 100 and 720nm, the thickness of the outer wall is between 50 and 100nm, and the weight of the submicron silicon dioxide hollow spheres is 1 to 35 percent of that of the polymer substrate. In the method, powder of the submicron, agglomeration-free and monodisperse silicon dioxide hollow sphere is prepared first; the powder is modified by the surface modifying technology; and finally, the modified powder is combined with the polymer taken as the substrate. The composite heat insulating material shows excellent heat insulating property, and the heat insulating property shows size-dependent characteristics in a rang of submicron. Moreover, because an organic foaming agent is not used in the preparation process, the composite heat insulating material is environment-friendly.

Description

technical field [0001] The invention relates to a silica hollow sphere / polymer composite heat insulating material and a preparation method thereof. technical background [0002] The dimension, morphology and structure of materials are important factors affecting the physical and chemical properties of materials. For heat insulation materials, in addition to selecting materials with low density and high reflectivity, the selection of structurally porous materials is the main factor for obtaining low thermal conductivity. Common insulation materials are mostly porous materials, such as foamed polymers (molded expanded polystyrene (EPS), extruded expanded polystyrene (XPS), polyurethane foam, epoxy foam, etc.) and Inorganic minerals (asbestos, calcium carbonate, clay, vermiculite, fly ash, perlite, etc.). The abundant porous channels in these materials contain gases with low thermal conductivity, which not only reduces the density of the bulk material, but also greatly reduce...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L75/04C08L67/02C08K9/06C08K7/26
Inventor 陈运法武晓峰张冬海
Owner INST OF PROCESS ENG CHINESE ACAD OF SCI
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