Method for electrodepositing lead by ionic liquid system

An ionic liquid and electrodeposition technology, applied in the field of electrodeposition lead process, can solve the problems of difficult maintenance, yellowing and turbid bath liquid, complicated process, etc., and achieves good thermal stability and chemical stability, no hydrogen release, high current The effect of efficiency

Inactive Publication Date: 2010-01-20
KUNMING UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

This kind of additive will cause the bath solution to turn yellow and turbid during long-term operation, and serious organic pollution will occur. A large-scale activated carbon treatment must be done every three months to remove excessive impurities and decomposed organic matter. Complicated and difficult to maintain
In order to solve this problem, an important improvement measure is to increase the content of free fluoroboric acid to 4 times of the original one, but at the same time it must be continuously added and saturated with "boric acid" as much as possible to maintain normal operation, while the odor of the bath, fluorine Public nuisance and organic pollution with boron still cannot be solved
However, its construction cost has increased a lot
[0005] At the same time, in the process of electrodepositing lead, the aqueous solution system has specific requirements for the substrate material. At present, there are many reports on copper and titanium, but there are few reports on the electrodeposition of lead on metal aluminum and aluminum alloys.

Method used

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  • Method for electrodepositing lead by ionic liquid system
  • Method for electrodepositing lead by ionic liquid system
  • Method for electrodepositing lead by ionic liquid system

Examples

Experimental program
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Embodiment 1

[0044] Embodiment 1 adopts [BMIM]PF 6 As for the ionic liquid in a vacuum glove box, lead nitrate was added in a molar ratio of 50:1, the electromagnetic stirring rate was 80 rpm, and the time was 2 hours, and the filtrate was obtained by filtration. Take 200ml of the filtrate and put it in the electroplating container, heat it in a water bath to 40°C, and the electromagnetic stirring speed is 120 rpm. The anode is made of pure lead plate with a size of 60mm×20mm×1mm, and the cathode is made of pure aluminum with a size of 60mm×10mm×1mm. Cell voltage is 1.5V, current density is 15A / m 2 , Plating time 2 hours. After the electroplating is finished, the metal base material is taken out from the plating tank, washed with acetone-water-acetone respectively, and dried to obtain a dense black lead plating layer.

[0045] The SEM microscopic appearance of the coating is as follows: figure 1 As shown, its composition is as figure 2 EDX results are shown.

Embodiment 2

[0046] Embodiment 2: Using [EMIM]BF 4 As for the ionic liquid in a vacuum glove box, lead acetate was added at a molar ratio of 60:1, and the electromagnetic stirring rate was 80 rpm for 2 hours, and the filtrate was obtained by filtration. Take 200ml of the filtrate and place it in the electroplating container, the operating temperature is room temperature, and the electromagnetic stirring rate is 120 rpm. The anode is made of pure lead plate with a size of 60mm×20mm×1mm, and the cathode is made of red copper with a size of 60mm×10mm×1mm. Cell voltage is 1.0V, current density is 10A / m 2 , Plating time 1 hour. After the electroplating is finished, the metal base material is taken out from the plating tank, washed with acetone-water-acetone respectively, and dried to obtain a dense black lead plating layer. The SEM microscopic appearance of the coating is as follows: image 3 As shown, the EDX results of its components are as follows Figure 4 shown.

Embodiment 3

[0047] Embodiment 3: The difference between this embodiment and Embodiment 1 is that the molar ratio of ionic liquid to lead nitrate is 23:1, the anode adopts metal platinum plate, the cell voltage is 2.2V, and the current density is 20A / m 2 , Plating time 2 hours. Other steps are identical with embodiment 1.

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Abstract

The invention discloses a technical method for electrodepositing metallic lead layers on metallic copper and an alloy thereof, metallic titanium and an alloy thereof as well as metallic aluminum and an alloy thereof by using an ionic liquid system as an electrolyte. Compared with an ordinary technology for electrodepositing metallic lead, the technical method has the advantages that the technical method can be carried out at room temperature, has no steam volatilization, no color or taste, no combustion, no hydrogen release, good thermal stability and chemical stability, wider electrochemical stability windows (3-5V), compact coated layers and small internal stress, and can achieve higher current efficiency (more than or equal to 90 percent). The technical method has the biggest advantage of acquiring lead coated layers which can not be acquired on the metallic aluminum and an alloy substrate material thereof in a conventional technology. The method has simple process, short flow, easy control and lower cost.

Description

technical field [0001] The invention relates to a process for obtaining a dense and uniform lead coating by electrodeposition, in particular to an electrodeposition lead process using ionic liquid system metal aluminum and its alloys as base materials. Background technique [0002] The electrodeposited lead coating has extremely high purity, and when the thickness of the coating reaches 25-75 μm, there are few or no pores, and it has good protection performance for the substrate. Usually lead plating is mainly used to protect metals from sulfuric acid, sulfur dioxide and other sulfides and sulfates. The electrodeposition lead process is widely used in the chemical industry. For example, the inner walls of autoclaves, crystallizers, vacuum evaporators, brine tanks for freezing and poison gas bombs are mostly lined with lead plating. In recent years, people have studied electrodepositing lead on the surface of copper plates and titanium plates, and using the battery plate mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/36
Inventor 沈黎孙勇胡劲翁家峰陈冬华朱孝钦高文桂
Owner KUNMING UNIV OF SCI & TECH
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