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Method and device of removing boron in polysilicon by local evaporation

A polysilicon, local technology, applied in chemical instruments and methods, silicon compounds, inorganic chemistry, etc., can solve the problems of inability to remove segregation coefficient, long process time, low primary conversion rate, etc. Technical bottleneck, good purification effect

Inactive Publication Date: 2010-05-19
GAOYOU INST CO LTD DALIAN UNIV OF TECH
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Problems solved by technology

The disadvantage of the Siemens method is that it adopts backward thermal chemical vapor deposition in the core link of the process. There are too many links in the process and the conversion rate is low at one time, which leads to a long process time and increases the cost of materials and energy consumption.
The simple directional solidification method cannot remove the impurity phosphorus with a large segregation coefficient. Among the many impurities in polysilicon, boron is a harmful impurity, which directly affects the resistivity and minority carrier lifetime of silicon materials, and then affects the performance of solar cells. Photoelectric conversion efficiency
The polycrystalline silicon phosphorus content that can be used to prepare solar cells is required to be reduced to below 0.00003%, and there is no application of electron beams to remove boron in the known invention patents and scientific papers

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  • Method and device of removing boron in polysilicon by local evaporation
  • Method and device of removing boron in polysilicon by local evaporation

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Embodiment Construction

[0018] The specific implementation of this solution will be described in detail below in conjunction with the technical solution and accompanying drawings.

[0019] According to the Langmuir equation, where ω B is the evaporation rate, P B is the saturated vapor pressure of boron, M B is the atomic weight of boron atom, T is the molten pool temperature, γ B(l)inSi o is the activity coefficient of boron in silicon. Since the saturated vapor pressure of boron is very low, when silicon is smelted at high temperature, the boron contained in the silicon vapor is only less than one percent of the silicon matrix, and the evaporated silicon vapor is deposited to achieve the purpose of removing boron.

[0020] Put the high-boron polysilicon 6 with a boron content of 0.0005% into the graphite crucible 8, close the vacuum cover 3, and vacuumize the vacuum chamber 12 to a low vacuum of 1Pa with the mechanical pump 2 and the Rhodes pump 15, and then use the The diffusion pump 16 pum...

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Abstract

The invention provides a method and a device of removing boron in polysilicon by local evaporation, belonging to the technical field of purifying the polysilicon by using the physical metallurgy technology, in particular relating to a method and a device of removing boron impurities in the polysilicon by using the electron beam melting technology. The method comprises the steps of: locally melting the polysilicon in a graphite crucible by using electron beams, evaporating the liquid silicon onto a deposition plate above the graphite crucible, and collecting the polysilicon deposited on the deposition plate. The shell of the device comprises a vacuum cover and a vacuum drum, the inner cavity of the vacuum drum is a vacuum chamber, a melting system is arranged in the vacuum chamber, and the melting system comprises an electron gun, the graphite crucible and a water cooled copper tray. The method has the advantages of simple processes, low energy consumption, little environmental pollution, high purifying precision and stable technology, and is beneficial to large scale production.

Description

technical field [0001] The invention belongs to the technical field of purifying polysilicon by using physical metallurgy technology, and particularly relates to a method for removing impurity boron in polysilicon by electron beam smelting technology. Background technique [0002] High-purity polysilicon is the main raw material for solar cells. The preparation of high-purity polysilicon abroad mainly uses the Siemens method, specifically the silane decomposition method and the gas-phase hydrogen reduction method of chlorosilane. The Siemens method is currently the mainstream technology for polysilicon preparation. Its useful deposition ratio is 1×10 3 , 100 times that of silane. The deposition rate of the Siemens method can reach 8-10 μm / min. The conversion efficiency of one pass is 5% to 20%, and the deposition temperature is 1100°C, second only to SiCl 4 (1200°C), the power consumption is about 120kWh / kg, and the power consumption is also relatively high. Domestic Si...

Claims

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Application Information

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IPC IPC(8): C01B33/037
Inventor 谭毅董伟姜大川李国斌
Owner GAOYOU INST CO LTD DALIAN UNIV OF TECH
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