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Microencapsulation expansion type flame retardant and application in epoxy resin composite material thereof

An intumescent flame retardant and microencapsulation technology, which is applied in the field of materials, can solve the problems of composite materials such as flame retardancy, water resistance, mechanical properties, restrictions on the wide application of IFR, and poor compatibility, so as to improve compatibility Effects of water resistance, compatibility and water resistance improvement, and flammability improvement

Inactive Publication Date: 2010-08-25
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, IFR has defects such as poor compatibility with the matrix, easy migration, and easy moisture absorption, which adversely affects the flame retardancy, water resistance, and mechanical properties of composite materials, which greatly limits the wide application of IFR in more fields.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Add 4.0 grams of melamine and 8.0 grams of 37% formaldehyde aqueous solution into a 200 milliliter three-necked bottle, add 50 milliliters of deionized water, adjust the pH of the solution to 9.0, heat to 80° C., and keep warm for 40 minutes to prepare melamine-formaldehyde pre- Polymer; Then add 24.0 grams of ammonium polyphosphate (APP) and 80 milliliters of ethanol, input consumption is the ammonium hydrogen phosphate of 2% of melamine-formaldehyde prepolymer quality, after stirring, reacting for 120 minutes, through suction filtration, washing, drying Dry to obtain about 27.0 grams of white microencapsulated intumescent flame retardant APP.

[0025] 4.5 grams of the above-mentioned microencapsulated intumescent flame retardant APP, 33.0 grams of bisphenol A type epoxy resin (epoxy value 0.44mol / 100g), and 12.5 grams of m-phenylenediamine were mixed and stirred evenly at 60 ° C. After 80 ℃ for 2 hours and 120 ℃ for 2 hours to cure, to obtain a microcapsule intumescen...

Embodiment 2

[0028] Except that the bisphenol F epoxy resin is replaced by the bisphenol A epoxy resin, all component proportions and process conditions are the same as in Example 1. The obtained intumescent flame-retardant epoxy resin material has an oxygen index of 32.0%, and can pass the V-0 level of the UL-94 test. After soaking in water at 50°C for 24 hours, the flame retardant grade of the composite is still V-0.

Embodiment 3

[0030] Get 2.5 grams of microencapsulated APP, 0.5 grams of titanium dioxide, 0.3 grams of cellulose, 0.1 grams of nickel phosphate, 34.5 grams of bisphenol A type epoxy resin (epoxy value 0.44mol / 100g), 12.5 grams of m-benzene The diamine is mixed and stirred evenly at 60° C., and solidified after 2 hours at 80° C. and 2 hours at 120° C. to obtain a microcapsule intumescent flame-retardant epoxy resin composite material.

[0031] The oxygen index of this intumescent flame-retardant epoxy resin material is 30.0%, which can reach the V0 level in the UL-94 test. After soaking in water at 50°C for 24 hours, the flame retardant grade of the composite is still V-0.

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PUM

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Abstract

The invention discloses a microencapsulation expansion type flame retardant and application in an epoxy resin composite material thereof. The microencapsulation expansion type flame retardant uses ammonium polyphosphate as a capsule core and uses a thermosetting resin melamine-formaldehyde resin as a capsule material. The microencapsulation expansion type flame retardant epoxy resin composite material consists of the epoxy resin, a curing agent, a curing accelerator, the microencapsulation expansion type flame retardant and a flame-retardant carbon-forming accelerator. The microencapsulation expansion type flame retardant and the application are economic, simple and convenient; the flame retardant has good flame-retardant synergistic effects; and under the condition of little flame retardant addition, the composite material can pass V-0 level of UL-94 test, and the oxygen index reaches over 30.0 percent.

Description

technical field [0001] The invention relates to the field of materials, in particular to a microencapsulated expansion flame retardant and its application in epoxy resin composite materials. Background technique [0002] Epoxy resin can be widely used in coatings, civil engineering, construction, adhesives, electronics, aerospace and other fields, but epoxy resin has the disadvantage of being flammable, such as the oxygen index (LOI) of general-purpose epoxy resin is only about 20% , so the epoxy resin is usually subjected to flame retardant treatment before use. There are many types of flame retardants currently used in epoxy resins, including halogen-based, phosphorus-nitrogen, and metal hydroxide flame retardants. However, halogen-based flame retardants will produce a lot of smoke and dust during thermal decomposition and combustion. Inflammatory gases and some toxic substances seriously endanger human health and pollute the environment; metal hydroxide flame retardants ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/10C08K3/32C08L63/00C08L63/02C08L63/04C08K13/06
Inventor 吴昆沈敏敏胡志忠岑学杨
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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