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Organosilicon and titanium modified boron containing phenolic resin composite material and preparation method thereof

The technology of boron phenolic resin and composite material is applied in the field of organosilicon and titanium modified boron phenolic resin composite material and its preparation field, which can solve the problems of complex preparation process and poor process stability, achieve stable preparation process and improve high temperature and humidity resistance. Effect of performance and water absorption reduction

Active Publication Date: 2012-01-25
太仓力达莱特精密工业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation process of this method is complex and the process stability is poor

Method used

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  • Organosilicon and titanium modified boron containing phenolic resin composite material and preparation method thereof
  • Organosilicon and titanium modified boron containing phenolic resin composite material and preparation method thereof
  • Organosilicon and titanium modified boron containing phenolic resin composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Preparation of boron-modified phenolic resin: First, suck 94g of preheated molten phenol and 162g of formaldehyde into the reactor by vacuum, then add 1.75g ​​of zinc acetate, adjust the pH value of the reaction solution to 6-7 with ammonia water, and heat up while stirring to 80-85°C, react until the muddy point of the mixed solution reaches 40-45°C, then add 18.6g of boric acid, raise the temperature to 90-100°C, react until the muddy point of the mixed liquid reaches 100°C, and perform dehydration under reduced pressure. Promptly obtain 154.6g of said boron modified phenolic resin.

[0039] Take 100g of the above-mentioned boron phenolic resin, 25g of tetraethyl orthosilicate, 10g of ethyl titanate, 40g of ethanol, 7g of graphite and 8g of molybdenum disulfide, mix them uniformly to form a solution, and add them to 45g of glass fibers to preform the glass fibers. The volatile content of the impregnated prepreg is not more than 2.5%; then put it into the drying equipm...

Embodiment 2

[0041]Preparation of boron-modified phenolic resin: firstly suck 84.6g of preheated molten phenol, 22.8g of bisphenol A and 162g of formaldehyde into the reaction kettle by vacuum, then add 1.97g of zinc acetate, and use ammonia water to adjust the pH value of the reaction solution to 6 ~7, heat up to 80-85°C while stirring, react until the muddy point of the mixture reaches 40-45°C, then add 6.2g of boric acid, heat up to 90-100°C, and react until the muddy point of the mixture reaches 100°C dehydration under reduced pressure to obtain 155.8 g of the boron-modified phenolic resin.

[0042] Take 100g of the above-mentioned boron modified phenolic resin, 10g of ethyl orthosilicate, 10g of isopropyl orthosilicate, 15g of isopropyl titanate, 30g of methanol, 2g of graphite, 4g of molybdenum disulfide, 2g of aluminum oxide, zirconia 2g, mix it evenly to form a solution, and add it to 30g chopped carbon fiber to prepreg the chopped carbon fiber. The volatile content of the prepreg ...

Embodiment 3

[0044] Preparation of boron-modified phenolic resin: first suck 84.6 grams of preheated molten phenol and 162 grams of formaldehyde into the reaction kettle by vacuum, then add 2.19 g of zinc acetate, adjust the pH value of the reaction solution to 6-7 with ammonia water, and stir While raising the temperature to 80-85°C, react until the muddy point of the mixture reaches 40-45°C, then add 18.6g of boric acid, raise the temperature to 90-100°C, react until the muddy point of the mixed liquid reaches 100°C, and decompress After dehydration, add 22.8 grams of double portions of A to obtain 154.0 g of the boron-modified phenolic resin.

[0045] Take 100g of the above-mentioned boron-modified phenolic resin, 15g of vinyl silicate, 15g of isopropyl orthosilicate, 6g of ethyl titanate, 6g of isopropyl titanate, 8g of butyl titanate, 50g of ethanol, 6g of graphite, Mix 2g of zirconium and 5g of silicon carbide to form a solution, and add 30g of high silica glass fiber and 30g of chop...

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Abstract

The invention discloses an organosilicon and titanium modified boron containing phenolic resin composite material and a preparation method thereof. The composite material comprises 100 parts of boron containing phenolic resin, 20 to 30 parts of silicate ester, 10 to 20 parts of titanate, 30 to 50 parts of alcohol, 10 to 15 parts of friction modifier and 30 to 60 parts of fiber. A special raw material formula is adopted and the prepared composite material has excellent frictional wear resistance, high temperature resistance, moisture resistance and self-lubricating property; a preparation process for the modified phenolic resin is stable, high in operability and easy for industrial production; the composite material prepared from the modified phenolic resin is suitable for water scraping plates, sliding plates and the like in hot rolling and cold rolling production lines in the steel industry, friction plates in the fields of automobiles and high-speed rails, and other fields of high-temperature and low-temperature brake; and a manufacturing process is simple and is suitable for large-scale industrial production.

Description

technical field [0001] The invention relates to a novel polymer composite material and a preparation method thereof, more specifically to an organosilicon and titanium modified boron phenolic resin composite material and a preparation method thereof. Background technique [0002] The heat resistance of ordinary phenolic resin is not ideal, and its thermal decomposition phenomenon is quite serious when it exceeds 300°C, and the residual carbon rate is only about 40% at high temperature (above 800°C). And because the phenolic hydroxyl group in the phenolic resin is a strong polar group, it is easy to absorb water, so that the mechanical strength of the product is greatly reduced when it is used under high temperature and humidity conditions. Nevertheless, among various synthetic resins, the carbon residue rate of phenolic resin is relatively high (second only to polysiloxane resin), but it is still difficult to meet the high performance requirements of modern industry for mate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/14C08K13/04C08K7/14C08K7/06C08K3/36C08K3/22C08G8/28
Inventor 沈学平
Owner 太仓力达莱特精密工业有限公司
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