Copper drawing and electroplating method for plastic substrate

A technology of plastic base material and wire drawing, which is applied in the direction of sputtering plating, ion implantation plating, vacuum evaporation plating, etc., can solve the problems of polluting the natural ecological environment, large environmental pollution, waste of water resources, etc., to reduce environmental and Harm to human beings, reduction of production cost, effect of reduction of waste water discharge

Active Publication Date: 2012-06-27
XIAMEN RUNNER IND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Chinese patent CN100552093C discloses a special activator and electroplating process for plastic electroplating. In this process, a large amount of chromic acid (hexavalent chromium) is used for coarsening and electroplating chromium, which is not used for recycling and has great environmental pollution.
So much wastewater not only wastes water resources, but also seriously pollutes the natural ecological environment of human beings, so it is urgent to improve or replace the exist

Method used

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  • Copper drawing and electroplating method for plastic substrate
  • Copper drawing and electroplating method for plastic substrate
  • Copper drawing and electroplating method for plastic substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] (1) Pretreatment of modified PP plastic substrate

[0052] Implement dry cleaning method on the modified PP plastic substrate, use plasma flame treatment and then carry out electrostatic treatment to remove oil and dust on the surface of the modified PP plastic substrate;

[0053] (2) PVD (Physical Vapor Deposition) metallization of plastic substrates

[0054] Perform PVD (Physical Vapor Deposition) metallization on the modified PP plastic substrate, and implement PVD plasma modification, metal plating bottom layer, metal transition layer and metal conductive layer in sequence. The plasma modification process conditions are ion source current 0.5A, Bias voltage 80V, duty cycle 80%, argon flow rate 50SCCM, oxygen flow rate 50SCCM, furnace vacuum pressure 0.2Pa, activation time 5min to achieve the purpose of cleaning and activating the substrate surface, metallized bottom layer, metal transition layer and metal conductive The layer adopts a high-power intermediate freque...

Embodiment 2

[0074] (1) Pretreatment of ABS plastic substrate

[0075] Implement dry cleaning method on the ABS plastic substrate, and use hydrocarbon vacuum cleaning to remove the oil stain on the surface of the ABS plastic substrate;

[0076] (2) PVD (Physical Vapor Deposition) metallization of plastic substrates

[0077] Perform PVD (Physical Vapor Deposition) metallization on the ABS plastic substrate, and implement PVD plasma modification, metal plating bottom layer, metal transition layer and metal conductive layer in sequence. The plasma modification process conditions are ion source current 0.3A, bias voltage 150V, duty cycle 80%, argon flow rate 50SCCM, oxygen flow rate 80SCCM, furnace vacuum pressure 0.3Pa, activation time 6min to achieve the purpose of cleaning and activating the surface of the substrate, metal-plated bottom layer, metal transition layer and metal conductive layer are Using high-power intermediate frequency pulse power supply, metal plating bottom current is 30...

Embodiment 3

[0097] (1) Pretreatment of modified PP plastic substrate

[0098] Implement dry cleaning method on the modified PP plastic substrate, use plasma flame treatment and then carry out electrostatic treatment to remove oil and dust on the surface of the modified PP plastic substrate;

[0099] (2) PVD (Physical Vapor Deposition) metallization of plastic substrates

[0100]PVD (Physical Vapor Deposition) metallization is carried out on the modified PP plastic substrate, and PVD plasma modification, metal plating bottom layer, metal transition layer and metal conductive layer are carried out in sequence. The plasma modification process conditions are ion source current 0.3A, Bias voltage 150V, duty cycle 50%, argon flow rate 100SCCM, oxygen flow rate 10SCCM, vacuum pressure in the furnace 0.2Pa, activation time 10min to achieve the purpose of cleaning and activating the surface of the substrate, metallized bottom layer, metal transition layer and metal conduction The layer adopts a h...

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Abstract

The invention relates to a copper drawing and electroplating method for a plastic substrate, and relates to a plastic surface wire drawing treatment method. According to the method, a plastic substrate is pretreated; the pretreated plastic substrate is subjected to physical vapor deposition metallization, and is sequentially subjected to physical vapor deposition plasma modification, metal bottom layer plating, metal transition layer plating and metal conductive layer plating; direct copper electroplating is performed; a drawing treatment is performed on the surface of the copper electroplating layer; a dry cleaning treatment is performed on the surface of the plastic substrate; nickel electroplating is performed; the resulting material is hung in a PVD furnace to carry out a plasma treatment, and then is subjected to a PVD film plating treatment, or an organic coating spray plating treatment is performed, or a chromium electroplating treatment is performed, or chromium electroplating is performed and finally a PVD film plating treatment is performed. With the present invention, the surface metallization of the plastic material can be achieved; the copper electroplating layer drawing is adopted to replace the nickel electroplating layer drawing so as to reduce the production cost, simplify the electroplating process, substantially reduce the discharge amount of the wastewater, and reduce the pollution to the environment and the human; and the method meets surface drawing function requirements of a plurality of the plastic substrates.

Description

technical field [0001] The invention relates to a plastic surface drawing treatment method, in particular to an environment-friendly electroplating method for plastic substrate copper drawing. Background technique [0002] Conventional plastic electroplating processes include high-concentration chromic acid roughening and hexavalent chromium electroplating, and hexavalent chromium is usually discharged into electroplating wastewater. Chromium in wastewater is relatively harmful to humans and the environment! Common chromium compounds include hexavalent chromic anhydride, potassium dichromate, sodium dichromate, potassium chromate, sodium chromate, etc.; trivalent chromium trioxide (chrome green, Cr 2 o 3 ); divalent chromous oxide. Among the chromium compounds, hexavalent chromium is the most toxic, followed by trivalent chromium. According to research, chromium is a trace element required for the life and health of mammals. Chromium deficiency can cause atherosclerosis....

Claims

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Application Information

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IPC IPC(8): C25D5/56C25D5/48C25D5/12C25D3/38C25D3/12C25D3/06C25D7/06C23C14/20
Inventor 余水柯学标乔永亮李明仁
Owner XIAMEN RUNNER IND CORP
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