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Modified nano zinc oxide doped cycloaliphatic epoxy resin light-emitting diode (LED) packaging adhesive

A nano-zinc oxide, LED packaging technology, used in epoxy resin glue, adhesives, other chemical processes, etc., can solve the problems of poor UV resistance, low moisture absorption, and high cost

Inactive Publication Date: 2012-10-10
JIANGSU TETRA NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a new type of LED encapsulant with high transparency, good UV aging resistance, strong cohesive force, high toughness, fast curing, low viscosity and low hygroscopicity, which is modified by silane coupling agent. Nano-zinc oxide is doped with alicyclic epoxy resin, avoiding the use of high-cost silicone, and at the same time overcoming the shortcomings of existing bisphenol A epoxy resin packaging adhesives such as high moisture absorption, poor UV resistance, and low short-wave transmittance, and more Suitable for high-end LED encapsulant, high-power LED encapsulant or UV-based white and blue LED encapsulant

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] (1) Preparation of component A: 96.6% by mass percentage of 3,4-epoxycyclohexylmethyl methacrylate, 2.6% propylene oxide butyl ether, 0.6% softener, 0.14% defoamer and 0.06% The transparent blue-violet dye paste is weighed in proportion, and stirred at 70-90°C for 3-4 hours until it is evenly mixed;

[0021] (2) Preparation of modified nanoparticles: adjust the PH value of 15% silane coupling agent aqueous solution to 3-4, pour it into a constant pressure dropping funnel, and slowly add it dropwise to 85% nano-zinc oxide dispersion at 75°C , drop it within 30 minutes and keep it warm for 3 hours;

[0022] (3) Preparation of component B: the mixture of 98.4% by mass percentage of methylhexahydrophthalic anhydride and polyazelaic anhydride, 0.92% of tetramethylammonium bromide, 0.5% of glycerin, and 0.1% of silane coupling agent were modified Proportional nano-zinc oxide and 0.08% tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester were weigh...

Embodiment 2

[0025] (1) Preparation of Component A: 96.8% bis(7-oxabicyclo[4.1.0]3-heptylmethyl adipate), 2.5% propylene oxide phenyl ether, 0.5% softener , 0.14% defoamer and 0.06% transparent blue-violet dye paste are weighed in proportion, and stirred at 70-90°C for 3-4h until they are evenly mixed;

[0026] (2) Preparation of modified nanoparticles: adjust the PH value of 15% silane coupling agent aqueous solution to 3-4, pour it into a constant pressure dropping funnel, and slowly add it dropwise to 85% nano-zinc oxide dispersion at 75°C , drop it within 30 minutes and keep it warm for 3 hours;

[0027] (3) Preparation of component B: the mixture of 98.4% by mass percentage of methylhexahydrophthalic anhydride and polyazelaic anhydride, 0.95% of tetramethylammonium iodide, 0.5% of glycerol, and 0.1% of silane coupling agent were modified Proportional nano-zinc oxide and 0.05% 2,6-di-tert-butyl-p-cresol were weighed in proportion, stirred at 70-90°C for 3-4h until uniformly mixed;

...

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PUM

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Abstract

The invention relates to a modified nano zinc oxide doped cycloaliphatic epoxy resin light-emitting diode (LED) packaging adhesive. The modified nano zinc oxide doped cycloaliphatic epoxy resin LED packaging adhesive is characterized by being composed of a component A and a component B, the component A and the component B are mixed according to the ratio of 1: (0.9-1.0), and then the packaging adhesive is used for construction. The component A is composed of a cycloaliphatic epoxy resin, a reactive diluent, transparent royal purple dye color paste, an antifoaming agent and a softening agent, and the component B is composed of a curing agent, an accelerating agent, a silane coupling agent modified nano ultraviolet absorption agent, polyatomic alcohol and an antioxidant. The modified nano zinc oxide doped cycloaliphatic epoxy resin LED packaging adhesive is high in transparency, good in ultraviolet aging resistance performance, high in adhesive power, rapid in solidification and low in viscosity; and according to the packaging adhesive, high-cost organosilicone isn't used, defects that existing bisphenol A epoxy resins are high in moisture absorption, poor in ultraviolet resistance performance and low in short-wave transmissivity are overcome, and the modified nano zinc oxide doped cycloaliphatic epoxy resin LED packaging adhesive can be used as a high-end LED packaging adhesive, a high-power LED packaging adhesive or an LED packaging adhesive based on white light and blue light of ultraviolet light.

Description

technical field [0001] The invention relates to an LED encapsulation adhesive, in particular to a nano zinc oxide-doped alicyclic epoxy resin LED encapsulation adhesive modified by a silane coupling agent. Background technique [0002] Light-emitting diodes (LEDs), as the third-generation semiconductor lighting source, are widely used in lighting, radiation sources, and displays because they have advantages in all aspects compared with incandescent lamps and fluorescent lamps. During the use of LEDs, the photons generated by radiative recombination will be lost when they are emitted outwards, and a lot of light cannot be emitted from the chip to the outside. By coating the surface of the chip with a transparent adhesive layer with a relatively high refractive index, that is, encapsulation adhesive, since the adhesive layer is between the chip and the air, the loss of photons at the interface can be effectively reduced and the light extraction efficiency can be improved. In ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06C08G59/42C09K3/10
Inventor 曹祥来曹祥明乔毅常杨军
Owner JIANGSU TETRA NEW MATERIAL TECH
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