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A nano-zinc oxide, LED packaging technology, used in epoxy resin glue, adhesives, other chemical processes, etc., can solve the problems of poor UV resistance, low moisture absorption, and high cost
Inactive Publication Date: 2012-10-10
JIANGSU TETRA NEW MATERIAL TECH
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[0005] The purpose of the present invention is to provide a new type of LED encapsulant with high transparency, good UV aging resistance, strong cohesive force, high toughness, fast curing, low viscosity and low hygroscopicity, which is modified by silane coupling agent. Nano-zinc oxide is doped with alicyclic epoxy resin, avoiding the
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[0019] Example 1
[0020] ⑴ Preparation of component A: the mass percentage is 96.6% 3,4-epoxycyclohexyl methyl methacrylate, 2.6% propylene oxide butyl ether, 0.6% softener, 0.14% defoamer and 0.06% The transparent blue-violet dye paste is weighed according to the proportion, and stirred at 70-90℃ for 3-4h until the mixture is uniform;
[0021] ⑵Preparation of modified nanoparticles: Adjust the pH value of 15% silane coupling agent aqueous solution to 3-4, pour it into a constant pressure dropping funnel, and then slowly add dropwise to the 85% nano zinc oxide dispersion at 75℃ , Drip in 30min and keep reaction for 3h;
[0022] (3) Preparation of component B: The mass percentage is 98.4% methylhexahydrophthalic anhydride and polyazelaic anhydride mixture, 0.92% tetramethyl amine bromide, 0.5% glycerin, 0.1% silane coupling agent Nanometer zinc oxide and 0.08% tetra[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid] pentaerythritol ester are weighed in proportion, and stirred at ...
Example Embodiment
[0024] Example 2
[0025] ⑴The preparation of component A: The mass percentage is 96.8% bis(7-oxabicyclo[4.1.0]3-heptamethyl adipate), 2.5% propylene oxide phenyl ether, 0.5% softener , 0.14% defoamer and 0.06% transparent blue-violet dye color paste are weighed in proportion, and stirred at 70-90°C for 3-4 hours until the mixture is uniform;
[0026] ⑵Preparation of modified nanoparticles: Adjust the pH value of 15% silane coupling agent aqueous solution to 3-4, pour it into a constant pressure dropping funnel, and then slowly add dropwise to the 85% nano zinc oxide dispersion at 75℃ , Drip in 30min and keep reaction for 3h;
[0027] (3) Preparation of component B: the mass percentage is 98.4% methylhexahydrophthalic anhydride and polyazelaic anhydride mixture, 0.95% tetramethyl amine iodide, 0.5% glycerin, 0.1% silane coupling agent Calcium nano-zinc oxide and 0.05% 2,6-di-tert-butyl-p-cresol are weighed in proportion, and stirred at 70-90℃ for 3-4 hours until they are uniform;
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Abstract
The invention relates to a modified nano zinc oxide doped cycloaliphatic epoxy resin light-emitting diode (LED) packaging adhesive. The modified nano zinc oxide doped cycloaliphatic epoxy resin LED packaging adhesive is characterized by being composed of a component A and a component B, the component A and the component B are mixed according to the ratio of 1: (0.9-1.0), and then the packaging adhesive is used for construction. The component A is composed of a cycloaliphatic epoxy resin, a reactive diluent, transparent royal purple dye color paste, an antifoaming agent and a softening agent, and the component B is composed of a curing agent, an accelerating agent, a silane coupling agent modified nano ultraviolet absorption agent, polyatomic alcohol and an antioxidant. The modified nano zinc oxide doped cycloaliphatic epoxy resin LED packaging adhesive is high in transparency, good in ultraviolet aging resistance performance, high in adhesive power, rapid in solidification and low in viscosity; and according to the packaging adhesive, high-cost organosilicone isn't used, defects that existing bisphenol A epoxy resins are high in moisture absorption, poor in ultraviolet resistance performance and low in short-wave transmissivity are overcome, and the modified nano zinc oxide doped cycloaliphatic epoxy resin LED packaging adhesive can be used as a high-end LED packaging adhesive, a high-power LED packaging adhesive or an LED packaging adhesive based on white light and blue light of ultraviolet light.
Description
technical field [0001] The invention relates to an LED encapsulation adhesive, in particular to a nano zinc oxide-doped alicyclic epoxy resin LED encapsulation adhesive modified by a silane coupling agent. Background technique [0002] Light-emitting diodes (LEDs), as the third-generation semiconductor lighting source, are widely used in lighting, radiation sources, and displays because they have advantages in all aspects compared with incandescent lamps and fluorescent lamps. During the use of LEDs, the photons generated by radiative recombination will be lost when they are emitted outwards, and a lot of light cannot be emitted from the chip to the outside. By coating the surface of the chip with a transparent adhesive layer with a relatively high refractive index, that is, encapsulation adhesive, since the adhesive layer is between the chip and the air, the loss of photons at the interface can be effectively reduced and the light extraction efficiency can be improved. In ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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