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Epoxy resin curing agent

An epoxy resin curing and nano titanium dioxide technology, which is applied in the field of epoxy resin curing agent, can solve the problems of inapplicability for fast operation, inability to meet fast adhesion, slow curing reaction speed, etc., and achieves enhanced toughness, small shrinkage deformation, and reaction fast effect

Inactive Publication Date: 2013-03-13
南通市福来特化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this traditional adhesive has a slow curing reaction speed, is not suitable for fast operations, and cannot meet the needs of fast bonding in the construction industry, fast potting and positioning on the production line of the mechanical and electrical industry, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] An epoxy resin curing agent, the composition of the epoxy resin curing agent is: by weight: acid anhydride: 40%, boron trifluoride 45%, toughening agent 10%, diluent 5%.

[0011] The toughening agent is carboxyl liquid nitrile rubber, carboxyl-terminated liquid nitrile rubber, polysulfide rubber, liquid silicone rubber, polyether, polysulfone, polyimide, nano calcium carbonate or nano titanium dioxide.

[0012] The diluent is polypropylene glycol diglycidyl ether, phenyl glycidyl ether or ethylene glycol diglycidyl ether.

Embodiment 2

[0014] An epoxy resin curing agent, the components of the epoxy resin curing agent are: by weight: acid anhydride: 45%, boron trifluoride 40%, toughening agent 5%, diluent 10%.

[0015] The toughening agent is carboxyl liquid nitrile rubber, carboxyl-terminated liquid nitrile rubber, polysulfide rubber, liquid silicone rubber, polyether, polysulfone, polyimide, nano calcium carbonate or nano titanium dioxide.

[0016] The diluent is polypropylene glycol diglycidyl ether, phenyl glycidyl ether or ethylene glycol diglycidyl ether.

Embodiment 3

[0018] An epoxy resin curing agent, the composition of the epoxy resin curing agent is weight percentage: acid anhydride: 50%, boron trifluoride 40%, toughening agent 5%, diluent 5%.

[0019] The toughening agent is carboxyl liquid nitrile rubber, carboxyl-terminated liquid nitrile rubber, polysulfide rubber, liquid silicone rubber, polyether, polysulfone, polyimide, nano calcium carbonate or nano titanium dioxide.

[0020] The diluent is polypropylene glycol diglycidyl ether, phenyl glycidyl ether or ethylene glycol diglycidyl ether.

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PUM

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Abstract

The invention relates to the technical field of curing agents, particularly an epoxy resin curing agent. The epoxy resin curing agent comprises the following components in percentage by weight: 40-50% of acid anhydride, 40-50% of boron trifluoride, 5-10% of toughener and 5-10% of diluter. The components above are adopted in combination with any one toughener of carboxyl liquid nitrile-butadiene rubber, carboxyl-terminated liquid nitrile-butadiene rubber, polysulfide rubber, liquid silicone rubber and the like, or any one diluter of polypropylene glycol diglycidyl ether, phenyl glycidyl ether and ethylene glycol diglycidyl ether to further improve the toughness of the epoxy resin curing agent and enhance the bearing strength and temperature tolerance. Therefore, the prepared epoxy resin curing agent has the advantages of high reaction speed, low toxicity, high pressure resistance, corrosion resistance, small shrinkage deformation and the like, and can be widely used in the industries of electrical potting and packaging, electrical casting, electric apparatus impregnation, insulating composite material winding, pulling and extrusion, and the like.

Description

technical field [0001] The invention relates to the technical field of curing agents, in particular to an epoxy resin curing agent. Background technique [0002] In the prior art, most of the low-molecular-weight polyamide resins used for bonding are room-temperature-curing epoxy-based bonding commonly used at home and abroad. The adhesive with this room temperature curing epoxy resin curing agent has the advantages of simple bonding process, no need to apply external pressure, and can be cured at room temperature. However, this traditional adhesive has a slow curing reaction speed, is not suitable for fast operations, and cannot meet the needs of fast bonding in the construction industry, fast potting and positioning on the production line of the mechanical and electrical industry, etc. Contents of the invention [0003] The object of the present invention is to provide an epoxy resin curing agent with fast curing reaction speed, low pungentness, high pressure resistance...

Claims

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Application Information

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IPC IPC(8): C08G59/42C08G59/22C08G59/20C08L63/00C08L13/00C08L81/04C08L83/04C08L71/00C08L81/06C08L79/08C08K3/26C08K3/22
Inventor 王悦康
Owner 南通市福来特化工有限公司
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