Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Multi-cycle rapid thermal annealing method of amorphous silicon film

An amorphous silicon thin film, thermal annealing technology, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve the problems of expensive equipment, poor process repeatability, easy access of metals, etc., to reduce annealing time, The effect of uniform temperature distribution and increased annealing times

Inactive Publication Date: 2013-03-20
SHANGHAI UNIV
View PDF4 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The metal induction method successfully achieved low temperature (o C) The preparation of polysilicon also has defects: in the process of crystallization, the metal is easily induced into the silicon film, and the metal contaminates the silicon-based semiconductor device
Laser crystallization refers to using a very narrow laser beam as the source energy to hit the surface of the silicon film and move it to melt and crystallize different regions of the silicon film material in turn. The polycrystalline silicon film prepared by laser crystallization has uniform grains and excellent performance. However, this technology also has great disadvantages, such as expensive equipment, poor process repeatability, and difficulty in large-area preparation.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-cycle rapid thermal annealing method of amorphous silicon film
  • Multi-cycle rapid thermal annealing method of amorphous silicon film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0022] The process and steps in the embodiment of the present invention are as follows:

[0023] (1) Use an ordinary glass slide as a substrate, cut into small pieces with a size of 1cm×1cm, clean the surface of the sample with analytical pure acetone, ethanol and deionized water respectively, and blow dry with nitrogen.

[0024] (2) Put the cleaned glass substrate into the film deposition chamber, and use plasma enhanced chemical deposition (PECVD) equipment to deposit a layer of amorphous silicon (a-Si) film on the glass substrate with a thickness of about 200nm. The substrate temperature during deposition was 200 o C, the deposition pressure is 10 -5 Pa, the gas glow pressure range is 50Pa-250Pa, the sputtering power is 200W, the RF frequency is 13.56MHz, and the gas source is 100% pure silane (SiH 4 ), hydrogen used as dilute silane (H 2 ) with a purity of 5N.

[0025] (3) Use hydrofluoric acid to remove the oxide layer on the surface of the amorphous silicon film. Pl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a multi-cycle rapid thermal annealing method of an amorphous silicon film, belonging to the technical field of preparation technology of a polycrystalline silicon film. The method comprises the following steps of: depositing an amorphous silicon film on a common glass slide substrate by a vapor deposition method; performing rapid thermal treatment, wherein the heating rate is about 150-200 DEG C / s; after the film sample is heated to 640 DEG C from room temperature, keeping the temperature for a while, and cooling naturally; when the film temperature reaches room temperature, performing next cycle; and after rapid thermal annealing is carried out several times, crystallizing the amorphous silicon film. Through the method, a polycrystalline film with crystallization rate being about 71.9% can be prepared. Compared with the traditional solid-phase crystallization technology of an amorphous silicon film, the method provided by the invention reduces requirements on the substrate, shortens the treatment time and has the characteristics of simple preparation technology, little pollution, low cost and the like. The polycrystalline silicon film prepared by using the method provided by the invention can be applied to the manufacture field of microelectronics such as thin-film transistors and solar cells.

Description

technical field [0001] The invention relates to a multi-cycle rapid thermal annealing method for crystallizing an amorphous silicon film, which is a preparation method for crystallizing an amorphous silicon film material by a solid-phase annealing method, and belongs to the technical field of polysilicon film preparation technology. Background technique [0002] Polycrystalline silicon thin-film solar cells have been recognized by the photovoltaic industry as one of the candidates for the second-generation solar cells that can achieve high efficiency, low cost, and long life. conversion efficiency of solar cells. In addition, polysilicon thin films are also widely used in microelectronic technology fields such as image sensors and thin film transistors. [0003] The preparation methods of polysilicon thin films can be divided into two categories according to the growth process of the film: one is to directly deposit polysilicon on the preset substrate, the main methods are ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C16/56
Inventor 金晶瞿晓雷史伟民戴文韫袁安东
Owner SHANGHAI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products