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Additive for anisotropic conductive adhesives and preparation method thereof

An anisotropic, conductive adhesive technology, used in conductive adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of low conductivity, incomplete replacement, and great influence on bonding effect.

Inactive Publication Date: 2013-07-03
GUANGDONG DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to its own problems to be solved, it still cannot completely replace Pb / Sn solder
The conductive adhesive film mainly has the following problems: ①Low conductivity, most conductive adhesive films are acceptable for general components, but not necessarily for power devices; ②Poor impact resistance, poor long-term mechanical strength and electrical stability; ③ The bonding effect is greatly affected by the type of components and the type of PCB (printed circuit board); ④Long curing time

Method used

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  • Additive for anisotropic conductive adhesives and preparation method thereof
  • Additive for anisotropic conductive adhesives and preparation method thereof
  • Additive for anisotropic conductive adhesives and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Epoxy resin will undergo curing reaction in the presence of curing agent. Even if latent curing agent is used under normal temperature and pressure, it will slowly polymerize, resulting in a gradual increase in viscosity and semi-curing or even curing, losing effectiveness. In order to improve the resin varnish For long-term storage stability, it is necessary to add stabilizers to the adhesive formulation. The purpose of this research is to study the influence of different stabilizers on the storage stability of epoxy resin adhesives, and to select the best stabilizer formulation.

[0056] Experimental Materials

[0057] Epoxy resin E-44 (by mass, the following examples are the same) 100 parts

[0058] Epoxy resin E-51 100 parts

[0059] Microencapsulated long-chain imidazole derivatives (latent curing agent) 57 parts

[0060] N-phenyl-β-naphthylamine (stabilizer) 5 parts

[0061] 2,6-Di-tert-butyl p-cresol (stabilizer) 5 parts

[0062] Mix 100g epoxy resin E-44 (or E-51), 57g m...

Embodiment 2

[0068] In the preparation of epoxy resin adhesive, the addition of curing accelerator can accelerate the curing reaction, reduce the curing temperature, and shorten the curing time. The addition of accelerators has a catalytic effect on the curing reaction. Most of them participate in the curing reaction and change the curing mechanism, thereby reducing the curing internal stress and improving the toughness, strength, heat resistance, and water resistance of the cured adhesive layer. The curing accelerator has the following categories: 1. Amine curing accelerator; 2. Substituted urea curing accelerator; 3. Imidazole and its salt curing accelerator; 4. Metal organic acid salt curing accelerator; 5. Phosphine compound Curing accelerator; 6. Boron trifluoride amine complex curing accelerator; 7. Composite nano TiO 2 Curing accelerator; 8. Phenolic curing accelerator. Considering its applicable curing system objects and comprehensive performance, this study selects 2,4,6-tris(dimet...

Embodiment 3

[0083] Unmodified thermosetting resin adhesives, such as epoxy resin and phenolic resin adhesives, have low elongation and greater brittleness after curing. When the bonding part is subjected to external force, it is easy to crack and quickly crack; it is not fatigue resistant and cannot be used as a structure Bonding. Therefore, we must try to reduce brittleness, increase toughness, and improve bearing strength. Any substance that can reduce brittleness and increase toughness without affecting other main properties of the adhesive can be called a toughening agent. Different from plasticizers, tougheners generally contain active groups, which can react with the resin, and are not completely compatible after curing. Sometimes there are phase separations to obtain ideal toughening effects and impact resistance. Obviously improved, while the heat distortion temperature dropped slightly.

[0084] Improved toughness can increase the impact strength by multiples or tens of times, and...

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Abstract

The invention discloses an additive for anisotropic conductive adhesives and a preparation method thereof. The additive consists of the following ingredients: microencapsulated long-chain imidazole derivatives, a stabilizer, a curing promoter, a plasticizer, a diluent and a coupling agent, wherein the stabilizer is N-phenyl-beta-naphthylamine or 2,6-di-tert-butyl-p-cresol, the curing promoter is a tri(-2ethylhexoic acid) salt of DMP-30 or an acetylacetone clathrate of manganese, the plasticizer is terminal carboxyl liquid butyronitrile-22, random carboxyl liquid butyronitrile-1002 or liquid butyronitrile-40, and the diluent is butyl glycidyl ether, phenyl glycidyl ether, glycidyl methacrylate, polyethylene glycol diglycidyl ether or polypropylene glycol diglycidyl ether. The additive for anisotropic conductive adhesives can ensure that each performance of an anisotropic conductive adhesive can reach a balanced and better level.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to an additive for anisotropic conductive adhesive and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics technology and its increasingly broad application prospects, the requirements for the integration of integrated circuits are getting higher and higher, the size of electronic components and lead spacing are continuously shrinking, and the density of packaging is constantly increasing while the volume is relatively small. . High I / O density requires connection materials to have high line resolution. The traditional tin-lead soldering process can only meet the connection with a spacing greater than 0.065mm, and cannot meet the requirements for high I / O numbers below 0.065mm. High (>230°C), the thermal stress generated is easy to damage components and substrates. With the continuous improvement of device integration, it ...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J11/06C09J11/08C09J163/00
Inventor 刘萍
Owner GUANGDONG DANBOND TECH
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