Novel high-thermal-conductive packaging material for solar module

A technology for solar modules and packaging materials, used in semiconductor devices, electrical components, adhesive types, etc., can solve the problem of low thermal conductivity, and achieve the effects of excellent bonding performance, high cross-linking density, and lower surface temperature.

Active Publication Date: 2013-10-23
JIANGNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the shortcoming of the low thermal conductivity of the existing heat-conducting PV module packaging materials, the present invention provides a new type of high thermal conductivity solar module packaging material preparation technology

Method used

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  • Novel high-thermal-conductive packaging material for solar module

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Effect test

Embodiment 1

[0013] A heat-conducting solar cell encapsulation material, consisting of 100 parts by mass of vinyl acetate (EVA), 0.6 parts by mass of tackifier r-glycidyl ether oxypropyltrimethoxysilane, 0.8 parts by mass of crosslinking curing agent dicumyl peroxide , 0.2 parts by mass of benzoyl peroxide, 0.1 parts by mass of crosslinking curing accelerator 1,2-divinylbenzene, 0.3 parts by mass of antioxidant two (2,4-dicumylphenyl) pentaerythritol diethylene Phosphate ester, 0.3 parts by mass of ultraviolet absorber fumed silica, 0.2 parts by mass of silane coupling agent KH-550, and 5 parts by mass of MWNT-PVBV, mixed uniformly and put into an extruder for mixing and plasticizing, extruding The machine temperature was controlled at 85°C. Extrude, cut into pellets, and press molding to obtain thermally conductive solar cell encapsulation EVA adhesive film F-01.

Embodiment 2

[0015] A thermally conductive solar cell encapsulation material, consisting of 100 parts by mass of vinyl acetate (EVA), 0.5 parts by mass of tackifier r-glycidyl ether oxypropyl trimethoxysilane, 0.9 parts by mass of crosslinking curing agent dicumyl peroxide , 0.2 parts by mass of benzoyl peroxide, 0.1 parts by mass of crosslinking curing accelerator triallyl isocyanurate, 0.15 parts by mass of antioxidant two (2,4-dicumylphenyl) pentaerythritol di Phosphite, 0.15 parts by mass of antioxidant distearyl pentaerythritol diphosphite, 0.3 parts by mass of UV absorber benzophenone, 0.2 parts by mass of silane coupling agent KH-570, 10 parts by mass of MWNT- PBV, after mixing evenly, put it into the extruder for mixing and plasticizing, and the temperature of the extruder is controlled at 88°C. Extrude, cut into pellets, and press molding to obtain thermally conductive solar cell encapsulation EVA film F-02.

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Abstract

The invention provides a novel high-thermal-conductive packaging material for a solar module. The novel high-thermal-conductive packaging material is characterized in that fillers which have outstanding thermal conductive performance and can be dispersed uniformly in an EVA (Ethylene Vinyl Acetate) adhesive film are prepared; and the PV (Photovoltaic) packaging material is composed of the following raw materials in parts by mass: 5 to 20 parts of high-performance carbon multi-walled nano-tube thermal-conductive filler (MWNT-PBV), 100 parts of ethylene vinyl acetate copolymer, 0.6 to 1.5 parts of crosslinking curing agent, 0.04 to 0.18 part of crosslinking curing accelerant, 0.1 to 0.2 part of silane coupling agent, 0.1 to 0.4 part of antioxidant, 0.1 to 0.3 part of ultraviolet absorber, and 30 to 60 parts of thermal-conductive functional powder. The prepared heat-conductive solar packaging material has outstanding adhering performance and high crosslinking density, can resist outdoor ultraviolet light aging, thermal oxidation and moisture erosion for a long time; and the heat resistance and heat dissipation properties are effectively improved, the temperature on the surface of a silicon cell can be effectively reduced, and the photovoltaic conversion efficiency is remarkably improved.

Description

technical field [0001] The invention discloses a novel high thermal conductivity solar module encapsulation material, which belongs to the solar module encapsulation polymer composite material. Background technique [0002] With the depletion of traditional fossil fuels, human beings are constantly looking for new energy alternatives. Solar energy is currently recognized as a green renewable resource. Photovoltaic (PV) power generation industry has continued to develop rapidly since the 1980s. How to effectively utilize solar energy has become a hot spot in the field of new energy technology. Both the United States and Europe have formulated the "Million Solar Roofs Plan". According to the "Renewable Energy Medium and Long-Term Development Plan" compiled by the National Development and Reform Commission, by 2020, the total capacity of photovoltaic power generation in my country will reach 25 million kilowatts. PV modules in a photovoltaic power generation system need to wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/08C09J151/10C09J7/00C09J11/06C09J11/04H01L31/048
CPCY02E10/50
Inventor 姚伯龙褚路轩李祥关晓
Owner JIANGNAN UNIV
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