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A novel electronic-grade polyimide film with low linear expansion coefficient and its production method

A technology of polyimide film and low coefficient of linear expansion, which is applied in the field of polyimide film with low coefficient of linear expansion and its production, can solve the problems of high-end electronic products, high coefficient of linear expansion of polyimide, High dimensional stability and other issues, to achieve the effect of large-scale industrial production, low linear expansion coefficient, and low cost

Active Publication Date: 2016-03-02
宏威高新材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] The purpose of the present invention is to overcome the large linear expansion coefficient of existing polyimide, which cannot meet the needs of high-end electronic products, and provide a polyimide with extremely low linear expansion coefficient, high dimensional stability, low moisture absorption rate, excellent High-end polyimide with excellent adhesive properties, good mechanical properties and electrical properties and production method thereof

Method used

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  • A novel electronic-grade polyimide film with low linear expansion coefficient and its production method
  • A novel electronic-grade polyimide film with low linear expansion coefficient and its production method
  • A novel electronic-grade polyimide film with low linear expansion coefficient and its production method

Examples

Experimental program
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Effect test

Embodiment 1

[0062] Put 500 liters of DMF into the dissolution tank, add 1.00 molar ratio of ODA, start the mixer to stir and dissolve, and the dissolution time is 1 hour. After the diamine monomer is completely dissolved in the polar solvent, stop stirring, and use compressed air to dissolve the diamine monomer. The body solution is pressed into the stainless steel polymerization reaction kettle through the filter, the mixer is started, the cooling water is passed, and then the dianhydride monomer (PMDA, BPDA, BTDA and its composition) is gradually added in 8 times with a total molar ratio of 1.010 to 1.015. . From the 1st to 4th times, the amount of dianhydride added is controlled in equal amounts and at even intervals. A total of 50wt% of the total amount of dianhydride is added in the first 4 times, and from the 5th to the 8th times, each addition is 50wt% of the total amount of the remaining amount. Putting in, checking the viscosity of the resin after 5-10 minutes of stirring and rea...

Embodiment 2

[0066] With reference to the solution polycondensation method of Example 1, using DMF as a solvent, the polyamic acid solution with a solid content of 15 to 20% was obtained by polycondensation of dianhydride and diamine in an equimolar ratio, and then filtered and vacuum defoamed. The mixed polyamic acid solution is cast on the endless steel belt through the extrusion die to form a film, and a gel film with a solid content of 22.5 to 55% is formed through chemical imidization, and then the steel belt is peeled off by a stripping roller, and sent by a silica gel roller. Go to the longitudinal stretching machine and the transverse stretching machine, and carry out biaxial stretching at a temperature of 125 ~ 185 ° C with a stretch ratio of 1.10 ~ 1.35, and then carry out a high temperature of 15 min ~ 25 min in an infrared box at 350 ~ 450 ° C. Complete imidization, heat setting in a high-temperature box at 250-300°C for 5min-8min, corona surface modification, natural cooling, t...

Embodiment 3

[0073] Referring to Example 1, a multi-component blended polyamic acid was synthesized by a step-by-step feeding method.

[0074]Purified and pre-measured in the solvent tank, the mass is 4 times the total amount of dianhydride and diamine monomer anhydrous N, N'-dimethylformamide 85% (parts by weight) and xylene 15% (parts by weight) ) mixed solvent into the dissolution kettle, put 108kg of high-purity p-phenylenediamine and 367kg of APDS into the dissolution kettle through the automatic metering system, start the mixer to stir and dissolve, the dissolution time is not less than 1.0 hours, and the diamine monomer is completely dissolved After soaking in the polar solvent, stop stirring, use compressed air to press the diamine monomer solution into the stainless steel polymerization reaction kettle through the filter, start the stirrer, pass cooling water, and then gradually add the total amount of 8 times under stirring. For 294kg of pyromellitic dianhydride, the amount of di...

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Abstract

The invention relates to a preparation method of an electronic-grade polyimide film with low linear expansion coefficient. The method comprises the following steps that (1) the step-by-step condensation polymerization technology is used for obtaining polybasic block copolymerization polyamide acid glue solutions comprising one or more bar-shaped rigid chain sections containing para-benzene or biphenyl and one or more soft chain sections containing ether bonds or silicon-oxygen bonds and the like; (2) polyamide acid comprising one or more bar-shaped rigid chain structures containing para-benzene or biphenyl and polyamide acid comprising one or more soft chain structures containing ether bonds or silicon-oxygen bonds are independently compounded, and the two or more polyamide acid glue solutions different in rigidity and softness are mixed and compounded; (3) the compounded glue solutions are subjected to filtration, vacuum defoamation, casting filming, bidirectional stretching, chemical amidization or thermal amidization, infrared complete amidization, high-temperature thermal forming processing, corona processing and a reeling process, and therefore the electronic-grade polyimide film with the thickness being 7.5-125 micrometers, the linear expansion coefficient being 5-18ppm / DEG C, and good physical mechanical performance is obtained.

Description

technical field [0001] The invention relates to a polyimide film with a low linear expansion coefficient and a production method thereof, which belongs to the technical field of high-performance engineering plastic films and can meet the requirements of high-end flexible printed circuit boards. Background technique [0002] Polyimide (PI) refers to a class of aromatic heterocyclic polymers containing imide rings in the main chain. It has excellent mechanical, dielectric, radiation resistance, and corrosion resistance at high temperatures. It is an organic polymer One of the materials with the best comprehensive properties among materials, known as the "Pearl in the Crown" of high-tech materials and the "expert" in solving microelectronics technologies such as VLSI in the 21st century, it is used in aerospace, electronic information, automobiles Industry and other fields have a broad application space. [0003] With the development of electronic products in the direction of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/18C08L79/08C08G73/10
Inventor 李晓敏袁萍黄渝鸿韩青霞袁彬彬杨帆陈凤阳龑黄小诚
Owner 宏威高新材料有限公司
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