Copper plating solution for PCB (printed circuit board) blind holes, as well as preparation method and plating method of copper plating solution
A technology of electroplating copper and solution, which is applied in the direction of electrical connection formation of printed components, etc., and can solve problems such as ductility, poor gloss and toughness, uneven copper plating layer, and low hole filling rate
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0088] Example 1
[0089] A copper electroplating solution for PCB blind holes, the components and contents of the copper electroplating solution are:
[0090] Copper sulfate pentahydrate: 100g / L
[0091] Sulfuric acid: 50g / L
[0092] Chloride ion: 30ppm
[0093] Brightener: 5g / L
[0094] Carrier: 3g / L
[0095] Leveling agent: 2g / L
[0096] Deionized water balance;
[0097] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 2:1.
[0098] The brightener is a mixture composed of sodium polydithiodipropane sulfonate and ethylene thiourea in a weight ratio of 1.5:1; the carrier is polypropylene glycol with a molecular weight of 500.
[0099] The leveling agent is a mixture of leveling agent A and leveling agent B in a weight ratio of 1.2:1; wherein, leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and leveling agent B is N- Vinylimidazole-ethyl acrylate copolymer.
[0100] The structural formula of the leveling agent A is:
[0101]
[0102] Where...
Example Embodiment
[0117] Example 2
[0118] A copper electroplating solution for PCB blind holes, the components and contents of the copper electroplating solution are:
[0119] Copper sulfate pentahydrate: 150g / L
[0120] Sulfuric acid: 80g / L
[0121] Chloride ion: 45ppm
[0122] Brightener: 15g / L
[0123] Carrier: 10g / L
[0124] Leveling agent: 5g / L
[0125] Deionized water balance;
[0126] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 1.88:1.
[0127] The brightener is a mixture composed of sodium polydithiodipropane sulfonate and ethylene thiourea in a weight ratio of 2:1; the carrier is polypropylene glycol with a molecular weight of 800.
[0128] The leveling agent is a mixture of leveling agent A and leveling agent B in a weight ratio of 1.5:1; wherein, leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and leveling agent B is N- Vinylimidazole-ethyl acrylate copolymer.
[0129] The structural formula of the leveling agent A is:
[0130]
[0131] Wh...
Example Embodiment
[0146] Example 3
[0147] A copper electroplating solution for PCB blind holes, the components and contents of the copper electroplating solution are:
[0148] Copper sulfate pentahydrate: 200g / L
[0149] Sulfuric acid: 120g / L
[0150] Chloride ion: 60ppm
[0151] Brightener: 25g / L
[0152] Carrier: 15g / L
[0153] Leveling agent: 10g / L
[0154] Deionized water balance;
[0155] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 1.67:1.
[0156] The brightener is a mixture composed of sodium polydithiodipropane sulfonate and ethylene thiourea in a weight ratio of 2.5:1; the carrier is polypropylene glycol with a molecular weight of 1000.
[0157] The leveling agent is a mixture of leveling agent A and leveling agent B in a weight ratio of 1.8:1; wherein, leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and leveling agent B is N- Vinylimidazole-ethyl acrylate copolymer.
[0158] The structural formula of the leveling agent A is:
[0159]
[016...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2023 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap