Copper plating solution for PCB (printed circuit board) blind holes, as well as preparation method and plating method of copper plating solution

A technology of electroplating copper and solution, which is applied in the direction of electrical connection formation of printed components, etc., and can solve problems such as ductility, poor gloss and toughness, uneven copper plating layer, and low hole filling rate

Inactive Publication Date: 2014-02-12
东莞市富默克化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] When the electroplating solution in the prior art electroplates PCB blind holes, the hole filling rate is low, and the obtained copper plating layer is uneven, and the ductility, gloss and toughness are poor. Therefore, it i

Method used

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  • Copper plating solution for PCB (printed circuit board) blind holes, as well as preparation method and plating method of copper plating solution
  • Copper plating solution for PCB (printed circuit board) blind holes, as well as preparation method and plating method of copper plating solution
  • Copper plating solution for PCB (printed circuit board) blind holes, as well as preparation method and plating method of copper plating solution

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0088] Example 1

[0089] A copper electroplating solution for PCB blind holes, the components and contents of the copper electroplating solution are:

[0090] Copper sulfate pentahydrate: 100g / L

[0091] Sulfuric acid: 50g / L

[0092] Chloride ion: 30ppm

[0093] Brightener: 5g / L

[0094] Carrier: 3g / L

[0095] Leveling agent: 2g / L

[0096] Deionized water balance;

[0097] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 2:1.

[0098] The brightener is a mixture composed of sodium polydithiodipropane sulfonate and ethylene thiourea in a weight ratio of 1.5:1; the carrier is polypropylene glycol with a molecular weight of 500.

[0099] The leveling agent is a mixture of leveling agent A and leveling agent B in a weight ratio of 1.2:1; wherein, leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and leveling agent B is N- Vinylimidazole-ethyl acrylate copolymer.

[0100] The structural formula of the leveling agent A is:

[0101]

[0102] Where...

Example Embodiment

[0117] Example 2

[0118] A copper electroplating solution for PCB blind holes, the components and contents of the copper electroplating solution are:

[0119] Copper sulfate pentahydrate: 150g / L

[0120] Sulfuric acid: 80g / L

[0121] Chloride ion: 45ppm

[0122] Brightener: 15g / L

[0123] Carrier: 10g / L

[0124] Leveling agent: 5g / L

[0125] Deionized water balance;

[0126] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 1.88:1.

[0127] The brightener is a mixture composed of sodium polydithiodipropane sulfonate and ethylene thiourea in a weight ratio of 2:1; the carrier is polypropylene glycol with a molecular weight of 800.

[0128] The leveling agent is a mixture of leveling agent A and leveling agent B in a weight ratio of 1.5:1; wherein, leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and leveling agent B is N- Vinylimidazole-ethyl acrylate copolymer.

[0129] The structural formula of the leveling agent A is:

[0130]

[0131] Wh...

Example Embodiment

[0146] Example 3

[0147] A copper electroplating solution for PCB blind holes, the components and contents of the copper electroplating solution are:

[0148] Copper sulfate pentahydrate: 200g / L

[0149] Sulfuric acid: 120g / L

[0150] Chloride ion: 60ppm

[0151] Brightener: 25g / L

[0152] Carrier: 15g / L

[0153] Leveling agent: 10g / L

[0154] Deionized water balance;

[0155] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 1.67:1.

[0156] The brightener is a mixture composed of sodium polydithiodipropane sulfonate and ethylene thiourea in a weight ratio of 2.5:1; the carrier is polypropylene glycol with a molecular weight of 1000.

[0157] The leveling agent is a mixture of leveling agent A and leveling agent B in a weight ratio of 1.8:1; wherein, leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and leveling agent B is N- Vinylimidazole-ethyl acrylate copolymer.

[0158] The structural formula of the leveling agent A is:

[0159]

[016...

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Abstract

The invention relates to the technical field of PCB (printed circuit board) plating, in particular to a copper plating solution for PCB blind holes, as well as a preparation method and a plating method of the copper plating solution. Each liter of the copper plating solution comprises the following components according to contents: 100-300g of copper sulfate pentahydrate, 50-200g of sulfuric acid, 30-100ppm of chlorine ions, 5-50g of brightener, 3-30g of carrier, 2-20g of leveling agent and the balance of deionized water, wherein the concentration ratio of the copper sulfate pentahydrate to the sulfuric acid is (1.5-2): 1. The plating method comprises the following steps: putting a PCB with blind holes into a plating bath with the copper plating solution; plating during air agitation to obtain a copper plating layer. The copper plating layer formed by the plating method has a hole-filling rate as high as 97% above, and is dense, smooth, voidless, seamless, low in surface sediment thickness, relatively good in malleability, good in gloss, high in toughness and low in internal stress.

Description

technical field [0001] The invention relates to the technical field of PCB electroplating, in particular to a PCB copper electroplating solution for blind holes, a preparation method thereof, and an electroplating method. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, referred to as printed board, is one of the important components of the electronics industry. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed boards are used for the electrical interconnection between them. . [0003] In the development process of copper electroplating, how to electroplate a relatively flat surface has always been the focus of the development of machine manufacturers and plating solution manufacturers. The aperture and line width are quite...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D7/00H05K3/42
Inventor 王维仁伊洪坤
Owner 东莞市富默克化工有限公司
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