Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Copper plating solution for PCB (printed circuit board) blind holes, as well as preparation method and plating method of copper plating solution

A technology of electroplating copper and solution, which is applied in the direction of electrical connection formation of printed components, etc., and can solve problems such as ductility, poor gloss and toughness, uneven copper plating layer, and low hole filling rate

Inactive Publication Date: 2014-02-12
东莞市富默克化工有限公司
View PDF7 Cites 27 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] When the electroplating solution in the prior art electroplates PCB blind holes, the hole filling rate is low, and the obtained copper plating layer is uneven, and the ductility, gloss and toughness are poor. Therefore, it is necessary to develop a PCB blind hole electroplating copper solution with high hole filling rate of copper plating layer, smooth copper plating layer, good ductility, gloss and toughness, preparation method and use method thereof

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Copper plating solution for PCB (printed circuit board) blind holes, as well as preparation method and plating method of copper plating solution
  • Copper plating solution for PCB (printed circuit board) blind holes, as well as preparation method and plating method of copper plating solution
  • Copper plating solution for PCB (printed circuit board) blind holes, as well as preparation method and plating method of copper plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0089] A kind of electroplating copper solution for PCB blind hole, each component and content thereof of described copper electroplating solution are:

[0090] Copper sulfate pentahydrate: 100g / L

[0091] Sulfuric acid: 50g / L

[0092] Chloride ion: 30ppm

[0093] Brightener: 5g / L

[0094] Carrier: 3g / L

[0095] Leveling agent: 2g / L

[0096] Deionized water balance;

[0097] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 2:1.

[0098] The brightener is a mixture of sodium polydithiodipropane sulfonate and ethylene thiourea with a weight ratio of 1.5:1; the carrier is polypropylene glycol with a molecular weight of 500.

[0099] The leveling agent is a mixture of leveling agent A and leveling agent B with a weight ratio of 1.2:1; wherein, the leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and the leveling agent B is N- Vinylimidazole-ethyl acrylate copolymer.

[0100] The structural formula of the leveling agent ...

Embodiment 2

[0118] A kind of electroplating copper solution for PCB blind hole, each component and content thereof of described copper electroplating solution are:

[0119] Copper sulfate pentahydrate: 150g / L

[0120] Sulfuric acid: 80g / L

[0121] Chloride ion: 45ppm

[0122] Brightener: 15g / L

[0123] Carrier: 10g / L

[0124] Leveling agent: 5g / L

[0125] Deionized water balance;

[0126] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 1.88:1.

[0127] The brightener is a mixture of sodium polydithiodipropane sulfonate and ethylene thiourea with a weight ratio of 2:1; the carrier is polypropylene glycol with a molecular weight of 800.

[0128] The leveling agent is a mixture of leveling agent A and leveling agent B with a weight ratio of 1.5:1; wherein, the leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and the leveling agent B is N- Vinylimidazole-ethyl acrylate copolymer.

[0129] The structural formula of the leveling age...

Embodiment 3

[0147] A kind of electroplating copper solution for PCB blind hole, each component and content thereof of described copper electroplating solution are:

[0148] Copper sulfate pentahydrate: 200g / L

[0149] Sulfuric acid: 120g / L

[0150] Chloride ion: 60ppm

[0151] Brightener: 25g / L

[0152] Carrier: 15g / L

[0153] Leveling agent: 10g / L

[0154] Deionized water balance;

[0155] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 1.67:1.

[0156] The brightener is a mixture of sodium polydithiodipropane sulfonate and ethylene thiourea with a weight ratio of 2.5:1; the carrier is polypropylene glycol with a molecular weight of 1000.

[0157] The leveling agent is a mixture of leveling agent A and leveling agent B with a weight ratio of 1.8:1; wherein, the leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and the leveling agent B is N- Vinylimidazole-ethyl acrylate copolymer.

[0158] The structural formula of the levelin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of PCB (printed circuit board) plating, in particular to a copper plating solution for PCB blind holes, as well as a preparation method and a plating method of the copper plating solution. Each liter of the copper plating solution comprises the following components according to contents: 100-300g of copper sulfate pentahydrate, 50-200g of sulfuric acid, 30-100ppm of chlorine ions, 5-50g of brightener, 3-30g of carrier, 2-20g of leveling agent and the balance of deionized water, wherein the concentration ratio of the copper sulfate pentahydrate to the sulfuric acid is (1.5-2): 1. The plating method comprises the following steps: putting a PCB with blind holes into a plating bath with the copper plating solution; plating during air agitation to obtain a copper plating layer. The copper plating layer formed by the plating method has a hole-filling rate as high as 97% above, and is dense, smooth, voidless, seamless, low in surface sediment thickness, relatively good in malleability, good in gloss, high in toughness and low in internal stress.

Description

technical field [0001] The invention relates to the technical field of PCB electroplating, in particular to a PCB copper electroplating solution for blind holes, a preparation method thereof, and an electroplating method. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, referred to as printed board, is one of the important components of the electronics industry. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed boards are used for the electrical interconnection between them. . [0003] In the development process of copper electroplating, how to electroplate a relatively flat surface has always been the focus of the development of machine manufacturers and plating solution manufacturers. The aperture and line width are quite...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25D3/38C25D7/00H05K3/42
Inventor 王维仁伊洪坤
Owner 东莞市富默克化工有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com