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Resin composition for printed circuit board

一种树脂组合物、印刷电路板的技术，应用在印刷电路、印刷电路制造、印刷电路零部件等方向，能够解决无法兼顾绝缘层表面粗度和镀铜密合性等问题，达到吸湿耐热性优异、密合性优异的效果

Active Publication Date: 2017-10-13
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, even in these resin compositions, the roughness of the surface of the insulating layer and the adhesion of copper plating cannot be achieved at the same time.

Method used

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  • Resin composition for printed circuit board
  • Resin composition for printed circuit board
  • Resin composition for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0114] The present invention will be described in detail below by showing synthesis examples, examples, and comparative examples, but the present invention is not limited thereto. In addition, in the following description, unless otherwise specified, "part" means a mass part.

Synthetic example 1

[0115] Synthesis example 1 Synthesis of α-naphthol aralkyl type cyanate compound (compound of formula (1a))

[0116]

[0117] The reactor equipped with thermometer, stirrer, dropping funnel and reflux cooler was pre-cooled to 0-5°C with brine, and 7.47g (0.122mol) of cyanogen chloride and 9.75g of 35% hydrochloric acid ( 0.0935mol), water 76ml, and dichloromethane 44ml. Keep the temperature in the reactor at -5 to +5°C, keep the pH below 1, and add the α-naphthol represented by the above formula (1a') dropwise with stirring for 1 hour using the dropping funnel. Aralkyl resin (SN485, OH group equivalent: 214g / eq., softening point: 86°C, manufactured by Nippon Steel Chemical Co., Ltd.) 20g (0.0935mol) and triethylamine 14.16g (0.14mol) with dichloromethane 92ml of dissolved solution.

[0118]

[0119] After completion of the dropping, 4.72 g (0.047 mol) of triethylamine was added dropwise over 15 minutes. After completion of the dropping, the mixture was stirred at th...

Embodiment 1

[0121] As the acid-soluble inorganic filler (A), 70 parts of magnesium oxide (average particle diameter: 0.4 μm) (FNM-G, manufactured by Tateho Chemical Industries Co., Ltd.) was used as the cyanate compound (B) , using 60 parts of the α-naphthol aralkyl type cyanate compound (cyanate equivalent: 237g / eq.) obtained in Synthesis Example 1 of the formula (1a), as the epoxy resin (C), using the above formula Phenol biphenyl aralkyl type epoxy resin shown in (4) (NC-3000-FH, epoxy group equivalent: 320g / eq., n=6-10 in formula (4), Nippon Kayaku Co., Ltd. 35 parts) and 5 parts of naphthalene 4-functional epoxy resin represented by the above formula (5) (EXA4710, epoxy group equivalent weight 170 g / eq., manufactured by DIC Corporation). These components were dissolved and mixed in methyl ethyl ketone, and 0.2 part of zinc octylate was mixed to obtain a varnish (solution of a resin composition). This varnish was diluted with methyl ethyl ketone, impregnated and applied to a 0.1 mm t...

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PUM

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Abstract

The present invention provides a resin composition capable of forming a low-roughness roughened surface on the surface of an insulating layer regardless of roughening conditions when used for an insulating layer in a printed circuit board material, and on the roughened surface The formed conductor layer is also excellent in adhesiveness, heat resistance, moisture absorption heat resistance, thermal expansion, and chemical resistance. This resin composition contains an acid-soluble inorganic filler (A), a cyanate compound (B), and an epoxy resin (C).

Description

technical field [0001] The present invention relates to a resin composition and the like useful when used for an insulating layer in a printed wiring board material. Background technique [0002] In recent years, miniaturization and high performance of electronic equipment have progressed. In multilayer printed circuit boards, in order to increase the mounting density of electronic components and miniaturization of conductor wiring, the wiring formation technology is expected. As a method of forming high-density fine wiring on an insulating layer, the following methods are known: an additive method of forming a conductor layer only by electroless plating; Plating forms a conductive layer, and then performs a semi-additive method of flash etching a thin copper layer, etc. [0003] Generally, when through holes and blind holes required for interlayer connection of printed circuit boards are formed by laser processing, desmearing treatment is performed to remove smears generat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08G59/40C08J5/24C08K3/00C08K5/3415C08L65/00H05K1/03
CPCC08G59/40C08K5/3415C08L63/00C08K3/22C08K3/36C08G59/4014C08K5/29H05K1/0366H05K3/0055H05K3/381H05K3/4676H05K2203/0793H05K2203/0796H05K2203/0773H05K2203/1152C08G73/0655C08L79/04C08J2379/04C08J2463/00C08K3/013C08L79/085Y10T428/31529Y10T428/24355Y10T428/24802Y10T428/24917H05K1/0373C08J5/244C08J5/249C08L65/00C08K3/34C08J5/24C08K2003/222H05K1/0296H05K3/022H05K3/07H05K3/108H05K3/182H05K3/188
Inventor 鹿岛直树长谷部惠一四家诚司马渕义则加藤祯启
Owner MITSUBISHI GAS CHEM CO INC