Heat-conducting insulating composite material and preparation method thereof

Abstract

The invention provides a heat-conducting insulating composite material and a preparation method of the heat-conducting insulating composite material. The composite material sequentially comprises a conduction layer and a heat dissipation layer according to the distance between the layers and a heat source from the near to the distant, wherein one side of the heat-conducting insulating composite material is a smooth surface, and the other side of the heat-conducting insulating composite material is a rough surface; the smooth surface is used for receiving a heat source, the thermal contact resistance can be greatly reduced through the smooth surface, and the heat energy can be well and rapidly absorbed; the rough surface is a heat dissipation surface and has a honeycomb porous structure, a far infrared radiation coefficient can be improved, convection is accelerated, and the heat dissipation capacity of the material is improved. The heat conductivity coefficient of the composite material can be 8-20W / m.k, the far infrared radiation coefficient can be over 0.9, the composite material has high heat-conducting performance, and the inherent good processability and insulating property are kept.

Description

technical field [0001] The invention relates to a polymer composite material and a preparation method thereof, in particular to a PC heat-conducting and insulating plastic, a preparation method and application thereof, and belongs to the technical field of polymer materials. Background technique [0002] With the industrialization of electronic and electrical products, the problem of heat dissipation has increasingly become a bottleneck restricting the development of electronic and electrical products, and it is a key element that needs to be solved urgently, especially with the rapid development of electronic appliances such as high-power LEDs in the optoelectronic industry, The problem of heat dissipation has become the key to technological progress. At present, most of the heat dissipation in the optoelectronic industry adopts two methods: 1. More than 95% are traditional metal aluminum heat dissipation systems: metal aluminum has excellent thermal conductivity, but the a...

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Problems solved by technology

At present, most of the heat dissipation in the optoelectronic industry adopts two methods: 1. More than 95% are traditional metal aluminum heat dissipation systems: metal aluminum has excellent thermal conductivity, but the aluminum itself is not insulated. For safety, it is necessary to add insulating glue or sleeves, and Insulating glue or sleeves generally have poor heat conduction, which is not good for heat dissipation. At the same time, the radiation coefficient of aluminum itself is low, which reduces its comprehensive heat conduction efficiency; at the same time, in terms of production efficiency, the production process of metal aluminum radiators includes casting, die-casting , grinding, polishing, and a series of processes require secondary processing, which greatly prolongs the production cycle of the product, and at the same time pollutes the environment (nickel plating in the process, nitriding process), which is not conducive to recycling, so this kind of Products are gradually withdrawing from the market; 2. Others are ceramic materials or functional plastics for heat dissipation systems. At present, everyone generally uses inorganic non-metallic materials, including metal oxides Al 2 o 3 , MgO, SiO 2 , metal nitrides AlN, Si 3 N 4 , BN, etc., the thermal conductivity and insulating plastics formed by using them as fillers generally have a thermal conductivity of about 1.5-5W / m.k, while some use metal and carbon-based fillers to form thermal conductivity plastics, and their thermal conductivity can reach 5.0- 8W / m.k or higher, but its electrical conductivity is also very high, and its application in the optoelectronic industry has great limitations

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