Positive-image thermosensitive light-sensitive composition and applications thereof

A composition and heat-sensitive technology, applied in the field of photosensitive compositions, can solve problems such as increased coating loss, poor solvent resistance, and reduced surface tension, and achieve good latitude and low coating density.

Active Publication Date: 2014-06-25
LUCKY HUAGUANG GRAPHICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The printing process is realized by applying the principle of water-ink balance. The support body with hydrophilic surface provides a hydrophilic surface, which is hydrophilic and ink-repelling. The photosensitive layer is exposed and developed to form an lipophilic layer, which is lipophilic and water-repelling. It has a fountain solution dampening process. In order to reduce the surface tension of the fountain solution, a certain amount of organic solvent is added to the fountain solution. At the same time, in the cleaning of the printing machine and other operations, there is an organic solvent that touches the printing plate, which affects the printing plate. The solvent-resistant type has certain requirements. The thermoplastic phenolic resin used in the general photosensitive layer has the following defects: poor wear resistance, low printing resistance when used as a lithographic printing plate, and poor solvent resistance, especially when using UV ink. even lower
In CN1891455A, CN1292508, and JP286964, the addition of acrylamide and acrylsulfonamide to the lit

Method used

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  • Positive-image thermosensitive light-sensitive composition and applications thereof
  • Positive-image thermosensitive light-sensitive composition and applications thereof
  • Positive-image thermosensitive light-sensitive composition and applications thereof

Examples

Experimental program
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preparation example Construction

[0087] Preparation and detection method of lithographic plate

[0088] Preparation of aluminum base:

[0089] An aluminum plate with a thickness of 0.28mm is degreased in a 7wt% sodium hydroxide aqueous solution at a temperature of 55°C for 40 seconds. Use sine wave alternating current for electrolytic treatment, 50HZ alternating current, current 50A / dm 2 , the electrolysis time is 60 seconds, control Ra=0.3-0.6um, preferably at 0.4~0.6μm,. Rz (H) The value is 2~3μm. Then, at a temperature of 60°C, remove slag in a 50wt% sodium hydroxide aqueous solution for 10 seconds, and then treat it in a sulfuric acid solution with a current density of 5A / d㎡ and a concentration of 20wt% at a temperature of 25°C for 40 seconds. Control oxide film=2.5-3.5g / m 2 . Finally, at 60 °C with NaH 2 PO 4 -NaF solution is sealed for 30 seconds to obtain an aluminum base suitable for a lithographic printing plate.

[0090] The photosensitive composition is formulated into a heat-sensitive ...

Embodiment 1

[0112] In a 1000ml four-necked flask, install a stirring tube, a condenser, and a dropping funnel, and feed nitrogen to eliminate oxygen in the bottle. Add 400ml of ethyl cellosolve, 0.6g of dibenzoyl peroxide, and 20g of acrylamide, and start stirring. Dissolve, add 5g of methacrylic acid, 5g of acrylonitrile, 10g of methyl methacrylate, stir for 10 minutes, start to heat up to 75°C, react for 1 hour, start to drop mixed monomers (acrylamide 15g, methyl methacrylate 5g Dissolve in 50ml ethyl cellosolve), drop it within 1 hour, continue to react for 4 hours, after the reaction, cool down to room temperature, add 0.5g hydroquinone (dissolved in 50ml ethyl cellosolve), Stir for 10 minutes, then slowly add the reaction mixture into 4 liters of water to obtain a white solid, which is filtered, washed three times, and dried in a vacuum oven to obtain acrylic resin R1.

Embodiment 2

[0114] In a 1000ml four-necked flask, install a top stirrer, a condenser tube, and a dropping funnel, and feed nitrogen to eliminate oxygen in the bottle. Add 400ml of ethyl cellosolve, 0.6g of dibenzoyl peroxide, and N-phenyl maleic acid. Imide 20g, start stirring to dissolve, add methacrylic acid 5g, acrylonitrile 5g, methyl methacrylate 10g, stir for 10 minutes, start to heat up to 75°C, react for 1 hour, start to drop the mixed monomer (N-benzene Dissolve 15g of methyl methacrylate and 5g of methyl methacrylate into 50ml of ethyl cellosolve), drop it within 1 hour, and continue to react for 4 hours. After the reaction, cool down to room temperature and add 0.5g of p-benzene Diphenol (dissolved in 50ml of ethyl cellosolve), stirred for 10 minutes, then slowly added the reaction mixture into 4 liters of water to obtain a white solid, filtered, washed three times, and dried in a vacuum oven to obtain the present invention Acrylic resin R2.

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Abstract

The invention relates to a positive-image thermosensitive light-sensitive composition. A coating in an unexposed part is small in density and good in tolerance level, good in solvent resistance and good in scratch resistance. The composition is characterized by comprising phenolic resin, alkali-soluble solvent-resistant acrylic resin, sulfonamide-formaldehyde resin, an infrared absorption dye, a background dye, a dissolution inhibitor, and the like. The sulfonamide-formaldehyde resin is the critical component of the composition. A edition drying step is arranged in a production process in order to remove solvent in a coating formula and the temperature can reach 120-150 DEG C, and if ortho- or para- toluene sulfonamide-formaldehyde resin is added, after being baked, the ortho- or para- toluene sulfonamide-formaldehyde resin and other resin in a thermosensitive coating can be crosslinked. After the crosslinking is performed in the unexposed part, the alkali resistance and the strength of the coating are enhanced, so that the coating loss of the unexposed part during alkaline development is reduced. In the exposed part, the association of the infrared absorption dye and the phenolic resin is opened after heat absorption, and the infrared absorption dye is liable to dissolve in an alkaline developing solution, thus increasing the developing tolerance level of the thermosensitive coating.

Description

technical field [0001] The invention relates to a photosensitive composition, in particular to the photosensitive composition using sulfonamide formaldehyde resin and its application in positive thermosensitive CTP plates. Background technique [0002] With the development of computer image processing technology, people's attention has turned to photosensitive or thermal direct plate-making systems that directly image digital imaging information through laser beams or thermal heads without using silver salt coated films. The use of large-scale semiconductor lasers or YGA lasers has the following advantages over traditional photocuring plate-making methods: high-resolution images can be obtained through short-time exposure; time-saving effects; thermal direct plate-making plates used in the system can be operated under sunlight, reaching Labor saving effect. [0003] In recent years, the technology of adding a chemically amplified photoresist to a long-wave absorbing dye has...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/09
Inventor 冯磊栗更新王群英曹蕾孔祥丽薛琴张刚
Owner LUCKY HUAGUANG GRAPHICS
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