Semiconductor-wafer-surface-protective adhesive tape

An adhesive tape and semiconductor technology, which is applied in semiconductor devices, thin film/sheet adhesives, semiconductor/solid device manufacturing, etc. It can solve the problem of different adhesives, and it is difficult to improve the adhesion and prevent adhesives at the same time. , Peel off bad wafers and other problems, to achieve the effect of easy peeling
CN104093802AActive Publication Date: 2014-10-08FURUKAWA ELECTRIC CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
FURUKAWA ELECTRIC CO LTD
Publication Date
2014-10-08

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Abstract

A semiconductor-wafer-surface-protective adhesive tape having a pressure-sensitive adhesive layer on a substrate film, wherein the thickness of the adhesive layer is 10mum or more, the surface free energy (gammas) of the surface of the adhesive layer is 30-35 mN / m, the contact angle (thetal I) in relation to diiodomethane is 54-60 DEG , the adhesive force in relation to an SUS280 polished surface at 23 DEG C is 0.8-4.3 N / 25mm, and the adhesive force in relation to the SUS280 polished surface when heat-releasing at 50 DEG C in comparison to the adhesive force when releasing at 23 DEG C is 50% or less.
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Description

technical field

[0001] The present invention relates to an adhesive tape (adhesive tape) for protecting the surface of a semiconductor wafer. More specifically, it is related with the adhesive tape for surface protection of the semiconductor wafer used when grinding a semiconductor wafer into a thin film. Background technique

[0002] A semiconductor package is manufactured by slicing a high-purity silicon single crystal or the like into a semiconductor wafer, and then forming an integrated circuit on the surface of the wafer by ion implantation, etching, or the like. The semiconductor wafer has a desired thickness by grinding, polishing, or the like on the back surface of the semiconductor wafer on which the integrated circuit is formed. At this time, in order to protect the integrated circuit formed on the surface of the semiconductor wafer, an adhesive tape for protecting the surface of the semiconductor wafer is used. The semiconductor wafer subjected to backside grind...

Claims

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