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Thermosetting resin composition and prepreg and laminated board produced therefrom

A resin composition and resin curing technology, used in the field of thermosetting resin compositions, prepregs and laminates, can solve the problems such as the decline of moisture and heat resistance and dielectric properties, the increase of the water absorption rate of the cured product, and the low glass transition temperature. Good adhesion, low dielectric constant and low dielectric loss tangent, effect of low dielectric constant

Active Publication Date: 2016-06-01
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, curing agents containing active hydrogen in the molecular structure of amines and phenolic resins have a large number of hydroxyl groups in the cured epoxy resin, which will lead to an increase in the water absorption rate of the cured product, and a decrease in moisture and heat resistance and dielectric properties.
Although there is no hydroxyl group in the epoxy resin cured by acid anhydride, the reactivity of the anhydride is poor, and the curing conditions required are harsh.
In recent years, epoxy resin systems cured by styrene-maleic anhydride (SMA) have emerged, which have excellent electrical properties. The dielectric constant of the epoxy resin system can reach below 4.0, and the dielectric loss can be reduced to Below 0.01; but the disadvantage is that the glass transition temperature of the system is low and the thermal stability is poor
The use of styrene-maleic anhydride-N-phenylmaleimide (SMN) as a curing agent for epoxy resins has improved heat resistance compared to SMA-cured epoxy resin systems, but the improvement effect is very limited

Method used

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  • Thermosetting resin composition and prepreg and laminated board produced therefrom
  • Thermosetting resin composition and prepreg and laminated board produced therefrom
  • Thermosetting resin composition and prepreg and laminated board produced therefrom

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0043]According to the mass ratio, 1.8 parts of benzoyl peroxide (BPO) were dissolved in 100 parts of styrene, and then 23.6 parts of maleic anhydride, 41.6 parts of N-phenylmaleimide, 6.3 parts of divinylbenzene and The above-mentioned styrene monomer that is dissolved with BPO joins in 171 parts of butanone (MEK), and the mol ratio of styrene, maleic anhydride, N-phenylmaleimide and divinylbenzene monomer is 4: 1:1:0.2, stir at 40°C until monomers such as maleic anhydride are completely dissolved; then heat up to 90°C for 4 hours, pour it into ethanol for precipitation, filter and dry to obtain styrene-maleic anhydride Anhydride-N-phenylmaleimide-divinylbenzene tetrapolymer.

Embodiment 1

[0045] 70g biphenyl type polyfunctional epoxy resin (NC-3000, Nippon Kayaku) is added in 70g butanone, stirred to make it dissolve completely; after it dissolves completely, add the obtained styrene-malay Anhydride-N-phenylmaleimide-divinylbenzene resin curing agent 30g, 0.2g 2-ethyl-4-methylimidazole and an appropriate amount of butanone solvent, stirred and mixed evenly to obtain glue;

[0046] The glue is dipped and coated on E glass fiber cloth (2116, unit weight is 104g / m 2 ) and baked in an oven at 160°C for 5 minutes to make a prepreg.

[0047] Put a piece of copper foil on the top and bottom of the prepared prepreg, and place it in a vacuum hot press to press to obtain a copper clad laminate. The specific pressing process is pressing at a pressure of 1.5Mpa and a temperature of 220° C. for 2 hours. The properties of the obtained copper-clad laminates are shown in Table 1.

Embodiment 2

[0049] 60g biphenyl type polyfunctional epoxy resin (NC-3000, Nippon Kayaku) is added in 60g methyl ethyl ketone, stirs to make it dissolve completely; After it dissolves completely, add the obtained styrene-malay Anhydride-N-phenylmaleimide-divinylbenzene resin curing agent 15g, 15g polyphenylene ether resin (MX-90, Saber Innovative Plastics), 10g phosphorus-containing phenolic resin (XZ92741, Dow Chemical) , 0.2g 2-ethyl-4-methylimidazole and an appropriate amount of butanone solvent, stirred and mixed evenly to obtain glue;

[0050] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment. The properties of the obtained copper-clad laminates are shown in Table 1.

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Abstract

The invention discloses a thermosetting resin composition. The thermosetting resin composition comprises (a) a resin curing agent and (b) an epoxy resin; the resin curing agent is a quadripolymer. The invention provides a novel thermosetting resin composition which is obtained by modifying the epoxy resin system by use of a micro-crosslinked compound, wherein the micro-crosslinked compound is formed by copolymerization of an unsaturated monomer unit containing two double bonds and three unsaturated monomer units each of which contains one single double bond; a printed circuit board manufactured by use of the thermosetting resin composition is capable of showing a low dielectric constant and low dielectric loss angle tangent which are low enough in a high-speed and high-frequency signal transmission process, and also has excellent heat resistance to meet the requirements of practical use; proven by practical use, compared with an existing epoxy resin system modified by styrene-maleic anhydride (SMA) and styrene-maleic anhydride-N-phenylmaleimide (SMN), the thermosetting resin composition has more excellent glass-transition temperature and heat stability.

Description

technical field [0001] The invention relates to a thermosetting resin composition, and a prepreg and a laminate made of the resin composition, belonging to the technical field of electronic materials. Background technique [0002] For a long time, epoxy resin has been widely used in FR-4 laminates due to its comprehensive advantages such as wide source of raw materials, good processability, and low cost. However, with the high-speed and high-frequency increase in information processing and information transmission in recent years, higher requirements have been placed on the dielectric properties of laminates for printed circuits. To put it simply, laminate materials need to have low dielectric constant and dielectric loss to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. However, the dielectric constant and dielectric loss of ordinary epoxy resin substrate materials (FR-4 copper clad laminates) are relativel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08G59/40B32B27/04B32B27/38B32B15/092
Inventor 马建何继亮王钧段华军
Owner SHENGYI TECH SUZHOU