Water cleaning type tin soldering paste soldering flux

A flux and solder paste technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems that the solubility affects the performance of electronic components, the flux cannot be dissolved by water, and is not easy for users to accept, etc. , to achieve effective welding activity, good welding effect and low odor

Active Publication Date: 2015-03-18
EUNOW ELECTRONICS TECH CO LTD SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially in the fields that require high surface insulation resistance and corrosion resistance after welding, it is generally required to clean the welding surface. Traditional cleaning agents are mostly organic solvents (such as trichlorethylene), which not only have toxic side effects on the human body during the cleaning process, but also It has a serious impact on the natural environment, and it will also affect the performance of some more sophisticated electronic components due to its strong solubility. Therefore, using the simplest and environmentally friendly method to effectively clean the residues on the welding surface is a problem that needs to be solved. The problem
Cleaning with pure water is the method with the least pollution and the least harm. However, due to the use of rosin and other basic materials in traditional solder paste, the flux residue after soldering cannot be dissolved by water, so organic solvents have to be used as cleaning solvents and cannot be used. Washing process for cleaning
Water-washed solder paste without rosin is quite different from ordinary rosin-based solder paste in terms of soldering ability, storage stability, and construction characteristics, and is not easily accepted by users.

Method used

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  • Water cleaning type tin soldering paste soldering flux
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  • Water cleaning type tin soldering paste soldering flux

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Soldering flux: Prepare the following flux raw materials by weight percentage: 40% hydrogenated rosin, 18% triethanolamine, 24.5% diethylene glycol monobutyl ether, 1% antioxidant BHT, 1% benzotriazole, succinic acid 2%, ammonium oxalate 2%, oxalic acid 0.3%, polymeric acid 3.2%, ammonium succinate 3%, ammonium bifluoride 0.5%, behenamide 4.5%. Heat the rosin and triethanolamine evenly to 160°C. After they are completely melted, add the rest of the materials and stir to dissolve all the materials. The appearance is a uniform and clear liquid. Filter after heating, filter the heated and melted flux through a 100-mesh filter, pour it into a high-temperature bag to cool, and put it away after cooling to room temperature. It can be used to configure tin-silver-copper alloy solder paste.

Embodiment 2

[0029] Soldering flux: Prepare the following flux raw materials by weight percentage: 30% hydrogenated rosin, 10% disproportionated rosin, 10% triethanolamine, 8% diethanolamine, 24.5% diethylene glycol monobutyl ether, anti-aging agent BHT1%, benzene Triazole 1%, succinic acid 2%, ammonium oxalate 2%, oxalic acid 0.3%, polyacid 3.2%, ammonium succinate 3%, ammonium bifluoride 0.5%, behenamide 4.5% . Heat the rosin and triethanolamine evenly to 160°C. After they are completely melted, add the rest of the materials and stir to dissolve all the materials. The appearance is a uniform and clear liquid. Filter after heating, filter the heated and melted flux through a 100-mesh filter and pour it into a high-temperature bag to cool. After cooling to room temperature, it becomes the required flux, which is suitable for tin-silver-copper alloy solder.

Embodiment 3

[0031] Soldering flux: prepare the following flux raw materials by weight percentage: 40% hydrogenated rosin, 8% ethanolamine, 10% diethanolamine, 26.5% diethylene glycol monohexyl ether, 1% antioxidant BHT, 1% succinic acid, ethyl alcohol Ammonium diacid salt 1%, oxalic acid 0.3%, polymeric acid 2.2%, ammonium succinate 5%, ammonium bifluoride 0.5%, polyamide wax thickener (Disparon 6500) 4.5%. Heat the rosin and triethanolamine evenly to 160°C. After they are completely melted, add the rest of the materials and stir to dissolve all the materials. The appearance is a uniform and clear liquid. Filter after heating, filter the heated and melted flux through a 100-mesh filter and pour it into a high-temperature bag to cool. After cooling to room temperature, it becomes the required flux, which is suitable for tin-copper alloy solder.

[0032] The above flux uses 11% SAC305 alloy 3# tin powder to configure solder paste, and the effect after cleaning with water after soldering is ...

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PUM

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Abstract

The invention discloses water cleaning type tin soldering paste soldering flux. The invention has the key points that the water cleaning type tin soldering paste soldering flux comprises the components in percentage by weight: 2%-15% of thickening thixotropic agent, 0.1%-3% of corrosion inhibitor, 5%-10% of organic acid, 0.5%-1% of fluoride, 0.5%-5.5% of surface active agent, 20%-30% of mixed solvent, 10%-20% of alcamines, and the balance of rosin (modified rosin). The water cleaning type tin soldering paste soldering flux disclosed by the invention has the advantages that the soldering performance is excellent, the soldering reliability is high, and prepared tin soldering paste has the basic using characteristics of common rosin type tin soldering paste.

Description

Technical field: [0001] The invention relates to the technical field of soldering, in particular to soldering by using tin alloys, in particular to a flux used for solder paste. Background technique: [0002] Solder paste is a kind of paste assembly material made by mixing solder alloy powder and flux. It has a wide range of applications, especially with the development of electronic technology and the requirements for environmental protection, the requirements for solder paste are becoming more and more diverse. For example, the performance indicators of solder paste must comply with JIS (Japanese Industrial Standards), IPC (American Printed Circuit Society) standards, and meet EU regulations REACH (Registration, Evaluation, Authorization and Restriction) and ROHS (Restriction on the use of certain hazardous ingredients in electrical and electronic equipment) requirements. Therefore, the flux must exclude the use of harmful substances in the above regulations and standards...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
CPCB23K35/3613B23K35/362
Inventor 陈钦徐华侨张义宾廖永丰罗登俊胡文学武新磊
Owner EUNOW ELECTRONICS TECH CO LTD SUZHOU
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