Water cleaning type tin soldering paste soldering flux
A flux and solder paste technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems that the solubility affects the performance of electronic components, the flux cannot be dissolved by water, and is not easy for users to accept, etc. , to achieve effective welding activity, good welding effect and low odor
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Embodiment 1
[0027] Soldering flux: Prepare the following flux raw materials by weight percentage: 40% hydrogenated rosin, 18% triethanolamine, 24.5% diethylene glycol monobutyl ether, 1% antioxidant BHT, 1% benzotriazole, succinic acid 2%, ammonium oxalate 2%, oxalic acid 0.3%, polymeric acid 3.2%, ammonium succinate 3%, ammonium bifluoride 0.5%, behenamide 4.5%. Heat the rosin and triethanolamine evenly to 160°C. After they are completely melted, add the rest of the materials and stir to dissolve all the materials. The appearance is a uniform and clear liquid. Filter after heating, filter the heated and melted flux through a 100-mesh filter, pour it into a high-temperature bag to cool, and put it away after cooling to room temperature. It can be used to configure tin-silver-copper alloy solder paste.
Embodiment 2
[0029] Soldering flux: Prepare the following flux raw materials by weight percentage: 30% hydrogenated rosin, 10% disproportionated rosin, 10% triethanolamine, 8% diethanolamine, 24.5% diethylene glycol monobutyl ether, anti-aging agent BHT1%, benzene Triazole 1%, succinic acid 2%, ammonium oxalate 2%, oxalic acid 0.3%, polyacid 3.2%, ammonium succinate 3%, ammonium bifluoride 0.5%, behenamide 4.5% . Heat the rosin and triethanolamine evenly to 160°C. After they are completely melted, add the rest of the materials and stir to dissolve all the materials. The appearance is a uniform and clear liquid. Filter after heating, filter the heated and melted flux through a 100-mesh filter and pour it into a high-temperature bag to cool. After cooling to room temperature, it becomes the required flux, which is suitable for tin-silver-copper alloy solder.
Embodiment 3
[0031] Soldering flux: prepare the following flux raw materials by weight percentage: 40% hydrogenated rosin, 8% ethanolamine, 10% diethanolamine, 26.5% diethylene glycol monohexyl ether, 1% antioxidant BHT, 1% succinic acid, ethyl alcohol Ammonium diacid salt 1%, oxalic acid 0.3%, polymeric acid 2.2%, ammonium succinate 5%, ammonium bifluoride 0.5%, polyamide wax thickener (Disparon 6500) 4.5%. Heat the rosin and triethanolamine evenly to 160°C. After they are completely melted, add the rest of the materials and stir to dissolve all the materials. The appearance is a uniform and clear liquid. Filter after heating, filter the heated and melted flux through a 100-mesh filter and pour it into a high-temperature bag to cool. After cooling to room temperature, it becomes the required flux, which is suitable for tin-copper alloy solder.
[0032] The above flux uses 11% SAC305 alloy 3# tin powder to configure solder paste, and the effect after cleaning with water after soldering is ...
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