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Pretreatment method of molybdenum copper carrier before electroplating

A pretreatment and carrier technology, applied in the field of metal surface treatment, can solve the problems of large environmental impact, poor binding force, and poor control of small carrier technology, and achieve the effect of environmental friendliness and simple method

Active Publication Date: 2016-06-15
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are the following problems in electroplating: (1) the surface of molybdenum copper is easily oxidized to form a complex oxide film, and the existence of this oxide film will lead to poor bonding between the coating and the carrier
However, the electroplating process of chromium has a great impact on the environment, and the small carrier process is not easy to control
(3) The molybdenum-copper carrier is a pseudo-alloy. There is no eutectic between molybdenum and copper. In fact, they are still two substances. Poor strength, easy to foam and peel
However, the sand blasting method is only suitable for workpieces with simple shapes and large volumes; the anodic etching method is likely to cause over-corrosion of copper; the chromic acid treatment method uses high concentrations of chromic acid, which has a great impact on the environment
(2) Use nickel instead of chromium as the base layer of other coatings (such as Chinese patent CN102345145B), but the binding force between nickel and molybdenum-copper carrier is low
However, the main component of the molybdenum-copper carrier is molybdenum. The molybdenum-copper carrier itself is a pseudo-alloy, and the bonding force between molybdenum and copper is poor.

Method used

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  • Pretreatment method of molybdenum copper carrier before electroplating

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Experimental program
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Effect test

Embodiment 1

[0035] A pretreatment method before electroplating of a molybdenum copper carrier, is characterized in that, comprises the following steps:

[0036] (1) degreasing;

[0037] Soak the molybdenum-copper carrier in a degreasing powder solution with a concentration of 50g / L and ultrasonically clean it for 10 minutes, then soak it in acetone and ultrasonically clean it for 10 minutes to remove the oil on the surface of the molybdenum-copper carrier;

[0038] (2) Alkali washing and pickling;

[0039] Place the molybdenum-copper carrier in a sodium hydroxide solution with a concentration of 150g / L, boil for 10 minutes, take it out and wash it with a large amount of pure water; then place it in a hydrochloric acid solution with a concentration of 250ml / L, and boil for 5 minutes. After taking it out, wash it with plenty of pure water;

[0040] (3) Membrane removal activation;

[0041] Place the molybdenum-copper carrier in FeCl with a concentration of 180g / L 3 Remove the film in th...

Embodiment 2

[0045] A pretreatment method before electroplating of a molybdenum copper carrier, is characterized in that, comprises the following steps:

[0046] (1) degreasing;

[0047] Soak the molybdenum-copper carrier in a degreasing powder solution with a concentration of 70g / L and ultrasonically clean it for 10 minutes, then soak it in acetone and ultrasonically clean it for 12 minutes to remove the oil on the surface of the molybdenum-copper carrier;

[0048] (2) Alkali washing and pickling;

[0049] Place the molybdenum-copper carrier in a sodium hydroxide solution with a concentration of 200g / L, boil for 10 minutes, take it out and wash it with a large amount of pure water; then place it in a hydrochloric acid solution with a concentration of 280ml / L, and boil for 5 minutes. After taking it out, wash it with plenty of pure water;

[0050] (3) Membrane removal activation;

[0051] Place the molybdenum-copper carrier in FeCl with a concentration of 200g / L 3 Remove the film in the ...

Embodiment 3

[0055] A pretreatment method before electroplating of a molybdenum copper carrier, is characterized in that, comprises the following steps:

[0056] (1) degreasing;

[0057] Soak the molybdenum-copper carrier in a degreasing powder solution with a concentration of 50-80g / L and ultrasonically clean it for 10 minutes, then soak it in acetone and ultrasonically clean it for 10-15 minutes to remove the oil on the surface of the molybdenum-copper carrier;

[0058] (2) Alkali washing and pickling;

[0059] Place the molybdenum-copper carrier in a sodium hydroxide solution with a concentration of 150-250g / L, boil it for 10 minutes, take it out and wash it with a large amount of pure water; then place it in a hydrochloric acid solution with a concentration of 250-300ml / L, and boil it Keep it for 5 minutes, take it out and wash it with plenty of pure water;

[0060] (3) Membrane removal activation;

[0061] Place the molybdenum-copper carrier in FeCl with a concentration of 180-230g...

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Abstract

The invention relates to a metal surface treatment method, particularly a pretreatment method of a molybdenum copper carrier before electroplating. The invention aims to provide a pretreatment method of a molybdenum copper carrier before electroplating. The method can be used for obtaining a high-binding-force non-scale non-blistering coating on the molybdenum copper surface. Meanwhile, the method has small influence on the environment. The method comprises the following steps: oil removal, alkali washing and acid washing, stripping and activation, and sputtering for depositing a prime coat.

Description

technical field [0001] The invention relates to a metal surface treatment method, in particular to a pretreatment method before electroplating. Background technique [0002] The molybdenum-copper carrier is a pseudo-alloy material composed of molybdenum with a body-centered cubic structure and copper with a face-centered cubic structure that are insoluble in each other and each maintains a relatively independent composition. It has high electrical and thermal conductivity, adjustable thermal expansion coefficient, good high temperature characteristics, and excellent processing performance and is widely used in various fields of industrial production, such as electronic packaging, heat sink materials, large-scale integrated circuit devices . In addition, Mo / Cu composite materials are essential key materials in microwave, communication, radio frequency, aerospace, power electronics, high-power laser and other industries, and are the basis for the development and production of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/38C25D5/34C23C14/35C23C14/16
CPCC23C14/165C23C14/352C25D5/34C25D5/38
Inventor 陈帅邱颖霞魏晓旻郭育华宋夏
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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