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Technology of preparing nano-Schottky structure by physical method

A physical method and nanotechnology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as agglomeration, poor repeatability of experimental results, and low efficiency, and achieve controllable particle dispersion and repeatable experiments Good performance and uniform size distribution

Active Publication Date: 2019-02-22
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 1. The combination of the sample and the substrate is not good;
[0007] 2. Since the experimental instrument is affected by various factors, it is impossible to obtain nanoparticles with consistent size distribution;
[0008] 3. Many factors in the reaction process lead to poor repeatability of the experimental results, such as environmental humidity, drug purity and gas impurities, etc.;
[0009] 4. There are many restrictions on sample preparation, only metal nanoparticles or nano-films can be prepared, and multi-layer films of compounds such as oxides and nitrides cannot be prepared.
However, the size of these nanoclusters or nanoislands varies with the treatment conditions. Sometimes even if the treatment conditions are the same, the size distribution of the obtained nanoclusters is not uniform, and sometimes agglomeration occurs. Cannot get very well separated nanoparticles
The preparation process of the self-assembly method usually takes several hours or a few days, and the nano-Schottky junction prepared by the spin-coating method takes a long time and has low efficiency, which cannot meet the needs of industrial preparation of the nano-Schottky structure.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] In this example, see Figure 1~4 , a process for preparing a nano-Schottky structure using a physical method, comprising the steps of:

[0030] a. Selection and pretreatment of the substrate: According to the requirements of the nano-Schottky structure for the preparation of micro-devices, the substrate type is selected as a Ge substrate, and the resistivity of the germanium sheet is 10 Ω cm. First, hydrogen fluoride: fluorine Soak the Ge substrate in a BOE solution with a molar ratio of 1:5 of ammonium chloride for 5 minutes, then ultrasonically clean it with acetone and ethanol solutions for 10 minutes, and then use acetone, absolute ethanol, and deionized water to clean the germanium sheet successively. Then use high-purity nitrogen to blow dry the germanium sheet, and finally place it in a drying oven at 80°C for 15 minutes to obtain a dry and clean substrate for future use;

[0031] b. Preparation of metal colloid solution: select the concentration of gold nanopar...

Embodiment 2

[0036] This embodiment is basically the same as Embodiment 1, especially in that:

[0037] In this embodiment, a process for preparing a nano-Schottky structure using a physical method includes the following steps:

[0038] a. This step is the same as in Embodiment 1;

[0039] b. Preparation of metal colloid solution: select the concentration of gold nanoparticles to be 7.0×10 12 particles / ml and the particle size of the nano-gold particles is 20nm colloidal nano-gold solution, and then adjust the dilution degree of the colloidal nano-gold solution according to the demand, that is, use absolute ethanol diluent, mix according to the volume of the colloidal nano-gold solution and absolute ethanol The ratio is 1:8, and the nano-gold colloid solution is diluted to obtain a diluted solution of nano-gold colloid;

[0040] c. This step is the same as in Embodiment 1;

[0041] d. This step is the same as in Embodiment 1.

[0042] In this example, see Figure 5 , the test results...

Embodiment 3

[0044] This embodiment is basically the same as the previous embodiment, and the special features are:

[0045] In this embodiment, a process for preparing a nano-Schottky structure using a physical method includes the following steps:

[0046] a. This step is the same as in Embodiment 1;

[0047] b. This step is the same as in Embodiment 1;

[0048] c. Prepare the nano-Schottky structure: adopt the method of indirect boiling deposition, place a steel sheet next to the Ge sheet pretreated in the step a, and use a pipette gun to remove the diluted gold nano-colloid prepared in the step b The droplet volume of the solution was adjusted to 10 μ L, and then the nano-gold colloid dilution solution was added dropwise on the steel sheet, and then the steel sheet was heated to 120 ° C by heating the steel sheet, so that the nano-gold colloid dilution solution on the steel sheet was boiled and then sputtered to the Next to the Ge sheet, and then deposit nano-gold colloidal particles ...

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PUM

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Abstract

The invention discloses the process for preparing a nanometer schottky structure through utilizing a physical method and relates to a new method through which the dispersal-uniform and dimension-consistent nanometer schottky structure is prepared on the basis of the boiled colloid droplet technology. According to the method, a proper substrate is selected, and the nanometer schottky structure is prepared through boiling a colloidal solution. In the preparation process, not only can colloidal solutions with different materials be selected, but also the colloidal solutions of one same material can have different concentrations and different dimensions. Compared with other nanometer schottky structure preparation methods in the prior art, nanometer particles having better dimension consistency and more uniform dispersal property can be acquired through the method, operation is simple and convenient, the method further has advantages of good controllability and high repeatability, and thereby abundant nanometer schottky structure materials can be prepared.

Description

technical field [0001] The invention relates to a preparation method of a micro electronic device, in particular to a preparation method of a nanostructure electronic device, which is applied in the fields of nano semiconductor electronic devices and optoelectronic devices. Background technique [0002] The higher the integration of integrated circuits, the higher the manufacturing precision in the manufacturing process (that is, the smaller the minimum line width of the photolithography process), and the smaller the transistor size in the circuit. Therefore, it is necessary to explore the performance of nano-devices. No semiconductor technology can do without a metallization system. The so-called metallization system includes the interconnection lines of each device unit, metal-semiconductor contacts (Schottky barrier contacts and ohmic contacts) and gate electrodes. Moreover, any semiconductor device has a common basic structure, that is, the input of energy and the funct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/329
CPCH01L29/66143
Inventor 郭二娟龙啸石晓波曾志刚
Owner SHANGHAI UNIV