Starch-based adhesive with high binding power and good heat conductivity for paperboard
A cohesive force and thermal conductivity technology, which is applied in the direction of starch adhesives, adhesives, adhesive types, etc., can solve the problems of waterproofness, toughness and stability that cannot meet the needs, product adhesion decline, and low production efficiency. , to achieve the effect of high density, enhanced waterproof performance and low cost
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Embodiment 1
[0017] A starch-based adhesive with strong cohesive force and good thermal conductivity for cardboard, the raw materials of which include by weight: 40 parts of acrylate adhesive, 40 parts of modified vegetable protein, 5 parts of lotus root starch, diphenylmethane diisocyanate 3 parts, 1 part of sodium hypochlorite, 2 parts of hydrogen peroxide, 1 part of borax, 6 parts of silane coupling agent KH-570, 2 parts of vinyl acetate, 2 parts of calcium carbonate, 2 parts of urea-formaldehyde resin, 4 parts of sodium hydroxide, silicon dioxide 2 parts, 6 parts of aluminum hydroxide, 1 part of aluminum oxide, 5 parts of magnesium oxide, 0.1 part of ammonium persulfate, 5 parts of croscarmellose sodium, 1 part of stabilizer, 2 parts of defoamer, 10 parts of water .
Embodiment 2
[0019] A starch-based adhesive with strong cohesive force and good thermal conductivity for cardboard, the raw materials of which include by weight: 80 parts of acrylate adhesive, 20 parts of modified vegetable protein, 15 parts of lotus root starch, diphenylmethane diisocyanate 1 part, 2 parts of sodium hypochlorite, 1 part of hydrogen peroxide, 3 parts of borax, 2 parts of silane coupling agent KH-570, 6 parts of vinyl acetate, 1 part of calcium carbonate, 10 parts of urea-formaldehyde resin, 1 part of sodium hydroxide, silicon dioxide 10 parts, 1 part of aluminum hydroxide, 4 parts of aluminum oxide, 1 part of magnesium oxide, 8 parts of ammonium persulfate, 1 part of croscarmellose sodium, 3 parts of stabilizer, 1 part of defoamer, 30 parts of water share.
Embodiment 3
[0021] A starch-based adhesive with strong cohesive force and good thermal conductivity for cardboard, the raw materials of which include by weight: 60 parts of acrylate adhesive, 30 parts of modified vegetable protein, 13 parts of lotus root starch, diphenylmethane diisocyanate 2 parts, 2 parts of sodium hypochlorite, 1.4 parts of hydrogen peroxide, 2 parts of borax, 3 parts of silane coupling agent KH-570, 5 parts of vinyl acetate, 1.5 parts of calcium carbonate, 8 parts of urea-formaldehyde resin, 1.5 parts of sodium hydroxide, silicon dioxide 8 parts, 2 parts of aluminum hydroxide, 2.2 parts of aluminum oxide, 2 parts of magnesium oxide, 0.5 parts of ammonium persulfate, 2 parts of croscarmellose sodium, 2.2 parts of stabilizer, 1.5 parts of defoamer, 28 parts of water .
[0022] The modified vegetable protein is prepared by the following process: mix 5 parts of corn protein, 20 parts of soybean protein, and 40 parts of water in parts by weight, heat up to 120 ° C for 10 m...
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