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A high-temperature solder preparation method based on ag@sn core-shell structure

A high-temperature solder and shell structure technology, applied in welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of low reaction rate and inability to obtain thick weld structure, stress concentration in thin welds, and easy cracking and failure of welds. , to achieve the effect of reducing the possibility of thermal damage, alleviating stress concentration and low cost

Active Publication Date: 2018-07-20
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

However, this technology also has defects. Because the whole process is solid-liquid diffusion, the reaction rate is low and the weld structure with large thickness cannot be obtained, and the thin weld is prone to stress concentration. At the same time, the weld with all-compound structure The seam structure is brittle and prone to cracks, which will make the welds prone to cracking and failure during service

Method used

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  • A high-temperature solder preparation method based on ag@sn core-shell structure
  • A high-temperature solder preparation method based on ag@sn core-shell structure
  • A high-temperature solder preparation method based on ag@sn core-shell structure

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Experimental program
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Effect test

Embodiment 1

[0048] The method specifically includes the following steps (using 100ml of plating solution to tinplate 3g of silver powder with a particle size of 40 μm and finally making it into a high-temperature resistant solder joint as an example):

[0049] (1), Weigh 7.5g of sodium citrate, 4g of nitrilotriacetic acid, 0.04g of hydroquinone, and 3g of disodium edetate, dissolve them in 100ml of deionized water and apply stirring at a stirring rate of 100rpm, and place the solution in Put in an ultrasonic device and apply stirring until the solute is completely dissolved to obtain solution A.

[0050] (2), take by weighing particle diameter and be the silver powder 3g of 40 μ m, be placed in the solution that contains thiourea, citric acid, potassium carbonate (mass ratio, thiourea: citric acid: potassium carbonate: deionized water=1:3:1 :25), add a surfactant and apply ultrasound to the silver powder, then clean the silver powder with deionized water 3 times for use.

[0051] (3), ta...

Embodiment 2

[0057] Embodiment two, refer to figure 1 , 2 and 3

[0058] (1), Weigh 8g of sodium citrate, 4.5g of nitrilotriacetic acid, 0.04g of hydroquinone, and 3.5g of disodium edetate, dissolve them in 100ml of deionized water and apply stirring at a stirring rate of 100rpm, and the solution Place in an ultrasonic device and apply stirring until the solute is completely dissolved to obtain solution A.

[0059] (2), take by weighing particle diameter and be the silver powder 3g of 40 μ m, be placed in the solution that contains thiourea, citric acid, potassium carbonate (mass ratio, thiourea: citric acid: potassium carbonate: deionized water=1:3:1 :25), add a surfactant and apply ultrasound to the silver powder, then clean the silver powder with deionized water 3 times for use.

[0060] (3), take by weighing 1.52g stannous chloride and be dissolved in 1ml pure hydrochloric acid, as solution B;

[0061] (4), solution B is poured in the solution A that is in stirring at room temperat...

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Abstract

The invention provides a preparation method for high-temperature brazing filler metal based on Ag@Sn kernel-shell structure dual-metal powder. The high-temperature brazing filler metal is obtained through a plating and attaching method which is used for plating and attaching thick-tin layers with the weldability thicknesses on the surfaces of micron and nanoscale copper balls of micron and nanoscale metal powder of an Ag@Sn kernel-shell structure. Low-temperature (250 DEG C) welding can be realized by adopting preset pieces, obtained through pressing of the high-temperature brazing filler metal, for welding, a welding spot can meet the high temperature (480 DEG C) service requirement, the welding spot reliability and weld joint stability are greatly improved, and the high-temperature brazing filler metal can be widely applied to various high-temperature welding fields.

Description

technical field [0001] The invention belongs to the cross-technical field of material chemistry and material processing, and relates to a method for preparing bimetallic powder-type high-temperature solder based on an Ag@Sn core-shell structure. Background technique [0002] Since high-power devices are needed in many fields (such as automobiles, space exploration, etc.), people pay more and more attention to high-power devices. Although silicon is generally used as the raw material of IGBT chips in the market, the development of this material has been greatly restricted due to some shortcomings of the silicon material itself. At the same time, current electronic products tend to be more and more miniaturized and integrated, so the current density inside the chip is getting higher and higher, and more heat needs to be dissipated. Looking at the wide bandgap semiconductor materials currently on the market, silicon carbide (SiC) materials are the most mature, and their advant...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/40
CPCB23K35/40
Inventor 陈宏涛王斌郭强
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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