Low-dielectric welding-resistant photoresist ink composition for printed circuit board

An ink composition, a technology of the composition, applied in the directions of ink, application, household appliances, etc., can solve the problem of inability to obtain electronic signal transmission characteristics and the like

Active Publication Date: 2017-01-11
NANYA PLASTICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The photopolymerizable prepolymer formed by novolac polyfunctional epoxy acrylate or o-cresol polyfunctional epoxy acrylate is combined with commonly used epoxy resins such as crystalline epoxy resins or any bifunctional epoxy resins or polyfunctional rings. The solder resist photoresist ink composition of oxygen resin has a dielectric constant Dk of about 3.6 (1GHz) and a dissipation factor Df of about 0.025 (1GHz) after hardening, which cannot meet the transmission characteristics of electronic signals. The development of high-frequency and high-speed, and the requirement of faster and faster transmission speed, tends to make the upstream raw materials of printed circuit boards need to have lower dielectric constant Dk and dissipation factor Df. Solder resist photoresist ink is also an important key raw material for circuit protection, so the development of Solder resist photoresist inks with low dielectric constant / dissipation factor and meeting the physical requirements of printed circuit boards are an important issue in the future

Method used

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  • Low-dielectric welding-resistant photoresist ink composition for printed circuit board
  • Low-dielectric welding-resistant photoresist ink composition for printed circuit board
  • Low-dielectric welding-resistant photoresist ink composition for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0037] Synthesis Example 1: Photopolymerizable prepolymer (oligomer)-A1

[0038] Add 1000g of dicyclopentadiene-phenol polyfunctional epoxy resin (Nanya Plastics Company, NPPN-272H, epoxy equivalent 272g / eq) into 390g solvent KA, heat to 100°C, add 4.5g triphenylphosphorus and 1.0 g Hydroquinone HQ, stir to dissolve and then add 265g acrylic acid AA dropwise to the aforementioned solution for reaction. The reaction time is 90 minutes, and the temperature is 95°C. After the addition, the temperature is raised to 120°C for maturation reaction and maturation reaction Time 12 hours. When analyzing acid value <1mgKOH / g, then add 380g of tetrahydrophthalic anhydride THPA, and 390g of solvent I-150, react for 5 hours at a reaction temperature of 110°C, add 55g of solvent KA and I-150 each, and dilute to a solid part of 65 ﹪The photopolymerizable prepolymer A1 is obtained, the acid value is 60mgKOH / g, and the weight average molecular weight Mw is 1839.

Synthetic example 2

[0039] Synthesis Example 2: Oligomer-A2

[0040] Add 1000g of polyphenylene ether modified benzaldehyde phenolic multifunctional epoxy resin (NPPN-433P, EEW316g / eq) from Nanya Plastics Co., Ltd., add 378g of solvent KA, heat up to 100℃, add 4.0g of triphenylphosphorus and 1.0g of p-benzene Diphenol HQ, after stirring and dissolving, 227g acrylic acid AA was added dropwise to the aforementioned solution for reaction, the dropping time was 90 minutes, the dropping temperature was 95°C, the dropping was completed, and the maturing was 12 hours, and then tetrahydrophthalic anhydride THPA was added. 327g, reacted with 378g of I-150 solvent for 5 hours at a reaction temperature of 110°C, add 41g each of solvent KA and I-150, dilute to a solid content of 65% to obtain photopolymerizable prepolymer A2, analyze the acid value of 77mgKOH / g, the weight average molecular weight Mw 1872.

Synthetic example 3

[0041] Synthesis Example 3: Oligomer-A3

[0042] Add 1000g of phenol-benzaldehyde polyfunctional epoxy resin (Nanya Plastics Company's brand NPPN-433, EEW230g / eq) into 405g solvent KA, heat to 100°C, add 5.4g triphenylphosphorus and 1.0g hydroquinone HQ After stirring and dissolving, 312g of acrylic acid AA was added dropwise to the aforementioned solution for reaction. The reaction time was 90 minutes, and the temperature was 95°C. After the addition, the temperature was raised to 120°C for maturation reaction. The maturation reaction time was 12 hours. When analyzing acid value <1mgKOH / g, then add 450g tetrahydrophthalic anhydride THPA, and 405g solvent I-150, react for 5 hours at a reaction temperature of 110℃, add 71g each of solvent KA and I-150, and dilute to a solid part of 65 ﹪The photopolymerizable prepolymer A3 is obtained, the acid value is 59mgKOH / g, and the weight average molecular weight Mw is 2267.

[0043] Synthesis comparative example: photopolymerizable prepolyme...

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Abstract

The invention provides a welding-resistant photoresist ink composition with the advantages of excellent light hardening force, high alkali wash imaging resolution force and low dielectric constant. The printed circuit board welding-resistant ink prepared by using the composition has the advantages of excellent adherence, solution resistance, electrical characteristics, plating resistance, solder heat resistance, electrical erosion resistance and the like, the dielectric constant Dk of the ink is less than 3.20 (1GHz), and the loss factor Df is less than 0.015(1GHz). The low-dielectric constant welding-resistant photoresist ink composition comprises the following components in percentage by weight: (A) 20-70% of light polymerizable prepolymer (oligomer) shown as a formula (1), wherein the prepolymer is prepared by reacting (a1) dicyclopentadiene-phenol polyfunctional epoxy resin (namely DCPD-phenol polyfunctional epoxy resin) or (a2) polyoxyphenylene modified polyfunctional epoxy resin or (a3) phenol-benzaldehyde polyfunctional epoxy resin or any mixture of two of (a1), (a2) and (a3) with (b) monocarboxylic acid containing a vinyl and then reacting with (c) saturated or insaturated polybasic anhydrides; (B) 0-20% of a light polymerizable vinyl monomer serving as a diluent; (C) 5-30% of an epoxy resin compound comprising (C1) a dicyclopentadiene-phenol polyfunctional epoxy resin (namely DCPD-phenol polyfunctional epoxy resin) or polyoxyphenylene modified polyfunctional epoxy resin or phenol-benzaldehyde polyfunctional epoxy resin or any combination of the three resins, (C2) a tetramethyl diphenol epoxy resin, and (C3) an active ester-based resin; (D) 2-10% of a photo-polymerizatoin initiator; (E) 10-50% of an inorganic filling agent; (F) 0-2.0% of an accelerant; and (G) 10-40% of an organic solvent.

Description

[0001] 【Technical Field】 [0002] The present invention relates to a novel low-dielectric solder-resistant photoresist ink composition. The low-dielectric solder-resistant photoresist ink composition has excellent developability, light hardening power, and excellent adhesion, chemical resistance, and chemical resistance to printed circuit boards. Electrical properties, electroplating resistance, solder heat resistance, electric corrosion resistance, etc., its dielectric constant Dk <3.20(1GHz), loss factor Df <0.015 (1GHz), suitable for high-performance, high-frequency printed circuit boards. [0003] 【Background technique】 [0004] In recent years, in the production of photoresist patterns for various printed circuit boards, in order to match the high wiring density of printed circuit boards, liquid solder resist inks or dry films with excellent visualization and dimensional accuracy have been used. Among them, especially phenolic polyfunctional epoxy acrylate resin or o-creso...

Claims

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Application Information

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IPC IPC(8): C09D11/101C09D11/102C09D11/03
Inventor 李政中黄永通许世宏黄绍恩
Owner NANYA PLASTICS CORP
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