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Organic silicon resin aluminum-based copper-clad plate and production method thereof

A technology of aluminum-based copper-clad laminates and organic silicon, which is applied in the direction of circuit substrate materials, chemical instruments and methods, and synthetic resin layered products, can solve the problem of large thermal resistance of glass fiber cloth, poor heat dissipation, and brittleness of the insulating layer of glass fiber cloth. problems, to achieve the effect of mild reaction conditions, high thermal conductivity, and superior electrical insulation performance

Active Publication Date: 2017-03-01
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When working, the heat generated per unit area is getting bigger and bigger. If the heat cannot be dissipated in time, the reliability and service life of electronic products will be reduced.
The thermal conductivity of traditional FR-4 copper clad laminates is only 0.18-0.25W / (m.K), which cannot meet the requirements of rapid heat dissipation of end products
[0003] The existing aluminum-based copper-clad laminates usually have a three-layer structure consisting of copper foil, insulating layer, and aluminum plate. The insulating layer is made of glass fiber cloth impregnated with a resin system and molded by high-temperature semi-curing. Although this insulating sheet has both thermal conductivity and insulation However, its disadvantages are: ① glass fiber cloth has large thermal resistance and poor heat dissipation, which is difficult to meet the needs of high-power and high-heat dissipation electronic products; Increased product scrap rate
[0004] CN 103275671A discloses heat-conducting silicone potting glue, although the silicone potting glue has superior thermal conductivity, but because it adds carbon nanotubes in the formula, and the structure of carbon nanotubes is the same as the sheet structure of graphite, it has Certain electrical conductivity, and the insulating layer used to make aluminum substrates requires relatively high electrical insulation performance, so it is not suitable for application in the insulating layer of aluminum substrates

Method used

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  • Organic silicon resin aluminum-based copper-clad plate and production method thereof
  • Organic silicon resin aluminum-based copper-clad plate and production method thereof
  • Organic silicon resin aluminum-based copper-clad plate and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Design formula according to Si-H (silicon hydrogen) / Si-Vi (silicon vinyl)=1.6 (molar ratio), weigh 100 parts of methylphenyl vinyl silicone resin (vinyl mass fraction is 1.0%), dissolve in In 50 parts of methylphenyl-terminated vinyl silicone oil with a viscosity of 250mPa.s, dissolve evenly and add 4.56 parts of methylphenyl hydrogen-containing silicone oil (the hydrogen content is 1.3%) and 0.1 part of γ-glycidyl ether oxypropyl Trimethoxysilane (manufactured by Dow Corning in the United States), after stirring at a high speed, weigh 0.001 part of hexynol, add 0.01 part of platinum-methylphenylvinyl complex after stirring for 30 minutes, and add 150 parts of 3.5 Boron nitride with a particle size of μm was stirred at room temperature for 1 hour and emulsified for 20 minutes to obtain a silicone resin composition.

[0050] Use a piece of 35μm clean copper foil to coat the above-mentioned silicone resin composition with a layer of 100μm adhesive layer with an automatic ...

Embodiment 2

[0052] Design formula according to Si-H / Si-Vi=1.4 (molar ratio), weigh 100 parts of methyl vinyl silicone resin (vinyl mass fraction is 3.5%), dissolve into 70 parts of methyl terminal with a viscosity of 3000mPa.s In vinyl silicone oil, after dissolving evenly, add 18.15 parts of methyl hydrogen-containing silicone oil (hydrogen mass fraction is 1.0%) and 1.8 parts of W-903 dispersant (manufactured by BYK Company in Germany), and weigh 0.00005 parts of hexyl Alkynyl alcohol, after stirring for 30 minutes, add 0.005 parts of platinum-methyl vinyl complex, continue stirring for 30 minutes, add 38 parts of silicon carbide with a particle size of 35 μm, 300 parts of 3.5 μm alumina and 40 parts of rutile titanium dioxide, and stir at room temperature for 1 hour. Emulsified for 20 minutes to obtain a silicone resin composition.

[0053] An aluminum-based copper-clad laminate was obtained in the same manner as in Example 1 except that the resin composition was used.

Embodiment 3

[0055] Design formula according to Si-H / Si-Vi=1.1 (molar ratio), weigh 100 parts of methyl vinyl silicone resin (vinyl mass fraction is 5.5%), dissolve into 100 parts of methyl terminal with a viscosity of 9500mPa.s In vinyl silicone oil, after dissolving evenly, add 28.0 parts of methyl hydrogen-containing silicone oil (hydrogen mass fraction is 0.8%) and 4.5 parts of γ-glycidyl etheroxypropyl trimethoxysilane (manufactured by Dow Corning in the United States), and stir evenly at high speed Finally, weigh 0.1 part of tetramethyltetravinylcyclotetrasiloxane (D4vi), add 0.0001 part of platinum-methylvinyl complex after stirring for 30 minutes, and add 55 parts of alumina with a particle size of 3.5 μm after stirring for 30 minutes. and 155 parts of aluminum nitride, stirred at room temperature for 1 hour, and emulsified for 20 minutes to obtain a silicone resin composition.

[0056] An aluminum-based copper-clad laminate was obtained in the same manner as in Example 1 except th...

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Abstract

The invention relates to an organic silicon resin aluminum-based copper-clad plate and a production method thereof. The aluminum-based copper-clad plate comprises a copper foil layer, an insulating layer and an aluminum plate layer. The insulating layer is prepared by an organic silicon resin composition, the organic silicon resin composition comprises the following components in parts by weight: 100 parts of organic silicon resin, 40-100 parts of vinyl-terminated silicone oil, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor. According to the invention, the organic silicon resin is taken as a matrix polymer, electrical isolation performance and heat resistance of the aluminum-based copper-clad plate is increased. The vinyl-terminated silicone oil as an active diluent can effectively reduce the brittleness of the organic silicon resin and increases the toughness of the organic silicon resin composition. The aluminum-based copper-clad plate has the advantages of excellent electrical isolation performance, thermal conductivity, high temperature resistance and long-term aging resistance.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminates, and relates to a silicone resin aluminum-based copper clad laminate and a preparation method thereof. Background technique [0002] Since the 1990s, the heat dissipation of electronic products has undoubtedly become one of the biggest challenges facing electronic designers. With the continuous development of PCB boards towards high density and multi-layering, components on PCB board The space for loading and installation has been greatly reduced, and the power requirements of power components for electronic products in the whole machine are getting higher and higher. The heat generated per unit area during work is increasing. If the heat cannot be dissipated in time, the reliability and service life of electronic products will decrease. The thermal conductivity of traditional FR-4 copper clad laminates is only 0.18-0.25W / (m.K), which cannot meet the requirements of rapid heat dissi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L83/07
CPCB32B15/08C08K3/22H05K1/05B32B15/20B32B27/283B32B2307/302B32B2457/08C08K3/013B32B27/20B32B27/22B32B2311/12C08K2201/001B32B7/12B32B15/043B32B2250/02B32B2255/06B32B2255/24B32B2307/206C09J9/00C09J11/04C09J183/04H05K1/0204H05K1/0373H05K1/056H05K3/022H05K2201/0162H05K2201/0209H05K2203/068H05K2203/085
Inventor 唐国坊叶素文
Owner GUANGDONG SHENGYI SCI TECH
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