A method for preparing graphene film by atmospheric pressure low temperature chemical vapor deposition
A technology of graphene film and low-temperature chemistry, applied in the direction of graphene, gaseous chemical plating, nano-carbon, etc., to achieve the effect of simple process, high quality, reduced energy consumption and cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0031] In this embodiment, a graphene film is prepared by chemical deposition at normal pressure and low temperature, including the following steps:
[0032] (1) Ultrasonic clean the copper foil with hydrochloric acid, acetone and deionized water for 5~10 minutes, then remove the moisture on the surface of the copper foil, then put the copper foil into the quartz tube, and make the copper foil in the middle of the tube furnace, adjust The flow rate of argon gas is 800 sccm, and the flow rate of hydrogen gas is 30 sccm. In this atmosphere, the copper foil is heated to 950°C, and then annealed for 50 minutes;
[0033] (2) Cool the annealed copper foil in step (1) to 700°C at a constant speed in an argon atmosphere, where the flow rate of argon gas is 300 sccm, and the cooling rate is 28°C / min;
[0034] (3) When the temperature of the copper foil in step (2) drops to 700°C, feed methane and argon to grow graphene, wherein the flow rate of methane is 2 sccm, the flow rate of argon...
Embodiment 2
[0040] In this embodiment, a graphene film is prepared by chemical deposition at normal pressure and low temperature, including the following steps:
[0041] (1) Ultrasonic clean the copper foil with hydrochloric acid, acetone and deionized water for 5~10 minutes, then remove the moisture on the surface of the copper foil, then put the copper foil into the quartz tube, and make the copper foil in the middle of the tube furnace, adjust The flow rate of argon gas is 800 sccm, and the flow rate of hydrogen gas is 30 sccm. In this atmosphere, the copper foil is heated to 950°C, and then annealed for 50 minutes;
[0042] (2) Cool the annealed copper foil in step (1) to 400°C at a constant speed in an argon atmosphere, wherein the argon flow rate is 300 sccm, and the cooling rate is 30°C / min;
[0043] (3) When the temperature of the copper foil in step (2) drops to 400°C, feed methane and argon to grow graphene, wherein the flow rate of methane is 10 sccm, the flow rate of argon gas...
Embodiment 3
[0049] In this embodiment, a graphene film is prepared by chemical deposition at normal pressure and low temperature, including the following steps:
[0050] (1) Using magnetron sputtering method on SiO 2 Prepare copper-nickel alloy film on / Si sheet, then put the copper-nickel alloy film into the quartz tube, and make the copper-nickel alloy film in the middle of the tube furnace, adjust the flow of argon to 900 sccm, and the flow of hydrogen to 30 sccm, in this atmosphere environment Heat the copper-nickel alloy film to 900°C, and then anneal for 65 minutes;
[0051] (2) The annealed copper-nickel alloy film in step (1) is cooled to 400°C at a uniform speed in an argon atmosphere, wherein the argon gas flow rate is 400 sccm, and the cooling rate is 25°C / min;
[0052] (3) When the temperature of the copper-nickel alloy film in step (2) drops to 400°C, feed the mixed gas of acetylene and argon to grow graphene, wherein the flow rate of the mixed gas is 10 sccm, and the volume...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com