Preparation method of HEDP copper-plated non-porous thin layer

Abstract

The invention belongs to the technical field of cyanide-free copper plating technology, and particularly relates to a preparation method of an HEDP copper-plated non-porous thin layer. The preparation method comprises the steps that abrasive paper is used for polishing to remove floating rust at first, then, chemical degreasing and activation are carried out, and finally deionized water is used for cleaning; a plating solution is prepared; plating is carried out, particularly, an electrolysis copper plate is used as an anode, an oxidation film on the surface of the copper plate is removed, activation treatment is carried out for 5-10 s through a 10%-20% dilute hydrochloric acid solution, a base plate which is treated is used as a cathode to be placed in the plating solution, the temperature is 50-65 DEG C, the pH value is 9-11, direct current plating is carried out, the current density is 0.5-3.5 A / dm<2>, plating is carried out under the cathode moving condition, the moving speed is 3 cm / s-5 cm / s, and the HEDP copper-plated non-porous thin layer is obtained. The HEDP alkaline plating solution is low in toxicity, environmentally friendly and quite low in corrosion to production equipment, the leveling ability, dispersing ability and deep plating ability of the HEDP alkaline plating solution can reach or even exceed those of a cyanide copper plating solution, the cathode current efficiency reaches up to 95% or above, and the plating solution is stable in performance.

Description

technical field

[0001] The invention belongs to the technical field of cyanide-free electroplating copper plating technology, and in particular relates to a preparation method of HEDP copper-plating non-porous thin layer. Background technique

[0002] Cyanide copper plating has become the most widely used and mature pre-plating copper technology due to its good dispersion ability of plating solution, fine crystallization, and good bonding force between coating and substrate. However, it uses toxic and harmful cyanide and HCN produced by cyanide carbonation. It is also highly toxic, has strict requirements on the safety of the operating system, and costs a lot to deal with the three wastes. The development of an environmentally friendly cyanide-free copper plating process to replace the cyanide copper plating process is the focus of research in the field of electroplating industry.

[0003] Although there are many types of cyanide-free copper plating processes, such as sulfa...

Examples

Embodiment 1

[0024] 1) Substrate treatment: sand with 600#, 800#, 1000# sandpaper in sequence to remove floating rust on the surface; then carry out chemical degreasing, the composition of chemical degreasing liquid is: sodium hydroxide 70g / L, sodium carbonate 40g / L, phosphoric acid Trisodium 40g / L, sodium silicate 20g / L, temperature 80°C, time 20min; then wash with flowing warm water, flow cold water, deionized water, and then activate. The composition of the activation solution is: hydrochloric acid 25g / L, room temperature, time 90s ;Followed by flowing cold water washing, deionized water washing, and then neutralization, the neutralization liquid composition is: sodium carbonate 35g / L, room temperature, time 60s; then flowing cold water washing, deionized water washing;

[0025] 2) Electroplating solution preparation: prepare 1L HEDP copper plating solution, its composition is as follows:

[0026] Basic copper carbonate 15g / L;

[0027] Sodium Potassium Tartrate 14g / L;

[0028] Potassi...

Embodiment 2

[0034] 1) Substrate treatment: sand with 600#, 800#, 1000# sandpaper in sequence to remove floating rust on the surface; then carry out chemical degreasing, the composition of chemical degreasing liquid is: sodium hydroxide 70g / L, sodium carbonate 40g / L, phosphoric acid Trisodium 40g / L, sodium silicate 20g / L, temperature 80°C, time 20min; then wash with flowing warm water, flow cold water, deionized water, and then activate. The composition of the activation solution is: hydrochloric acid 25g / L, room temperature, time 90s ;Followed by flowing cold water washing, deionized water washing, and then neutralization, the neutralization liquid composition is: sodium carbonate 35g / L, room temperature, time 60s; then flowing cold water washing, deionized water washing;

[0035] 2) Electroplating solution preparation: prepare 1L HEDP copper plating solution, its composition is as follows:

[0036] Basic copper carbonate 15g / L;

[0037] Sodium Potassium Tartrate 14g / L;

[0038] Potassi...

technical field

[0001] The invention belongs to the technical field of cyanide-free electroplating copper plating technology, and in particular relates to a preparation method of HEDP copper-plating non-porous thin layer. Background technique

[0002] Cyanide copper plating has become the most widely used and mature pre-plating copper technology due to its good dispersion ability of plating solution, fine crystallization, and good bonding force between coating and substrate. However, it uses toxic and harmful cyanide and HCN produced by cyanide carbonation. It is also highly toxic, has strict requirements on the safety of the operating system, and costs a lot to deal with the three wastes. The development of an environmentally friendly cyanide-free copper plating process to replace the cyanide copper plating process is the focus of research in the field of electroplating industry.

[0003] Although there are many types of cyanide-free copper plating processes, such as sulfa...

Examples

Embodiment 1

[0024] 1) Substrate treatment: sand with 600#, 800#, 1000# sandpaper in sequence to remove floating rust on the surface; then carry out chemical degreasing, the composition of chemical degreasing liquid is: sodium hydroxide 70g / L, sodium carbonate 40g / L, phosphoric acid Trisodium 40g / L, sodium silicate 20g / L, temperature 80°C, time 20min; then wash with flowing warm water, flow cold water, deionized water, and then activate. The composition of the activation solution is: hydrochloric acid 25g / L, room temperature, time 90s ;Followed by flowing cold water washing, deionized water washing, and then neutralization, the neutralization liquid composition is: sodium carbonate 35g / L, room temperature, time 60s; then flowing cold water washing, deionized water washing;

[0025] 2) Electroplating solution preparation: prepare 1L HEDP copper plating solution, its composition is as follows:

[0026] Basic copper carbonate 15g / L;

[0027] Sodium Potassium Tartrate 14g / L;

[0028] Potassi...

Embodiment 2

[0034] 1) Substrate treatment: sand with 600#, 800#, 1000# sandpaper in sequence to remove floating rust on the surface; then carry out chemical degreasing, the composition of chemical degreasing liquid is: sodium hydroxide 70g / L, sodium carbonate 40g / L, phosphoric acid Trisodium 40g / L, sodium silicate 20g / L, temperature 80°C, time 20min; then wash with flowing warm water, flow cold water, deionized water, and then activate. The composition of the activation solution is: hydrochloric acid 25g / L, room temperature, time 90s ;Followed by flowing cold water washing, deionized water washing, and then neutralization, the neutralization liquid composition is: sodium carbonate 35g / L, room temperature, time 60s; then flowing cold water washing, deionized water washing;

[0035] 2) Electroplating solution preparation: prepare 1L HEDP copper plating solution, its composition is as follows:

[0036] Basic copper carbonate 15g / L;

[0037] Sodium Potassium Tartrate 14g / L;

[0038] Potassi...

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