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Composite solder paste stored at room temperature and preparation method thereof

A composite solder paste storage technology at room temperature, applied in welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of reducing the mechanical integrity of the interface, reducing the welding strength, and affecting reliability, so as to avoid the problems of brittleness and voids, Achieve normal temperature storage, delay speed and thickness effect

Active Publication Date: 2020-06-16
有研纳微新材料(北京)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These coarse intermetallic compounds will reduce the mechanical integrity of the interface, weaken the interface and cause damage to the solder joint at the boundary between the intermetallic compound and the solder, resulting in solder failure
In addition, intermetallic compounds have higher melting points (such as Cu 6 sn 5 The melting point is 415°C) and the formation speed is extremely fast. At the soldering temperature, there will be gas inside the solder paste system. Once the intermetallic compound of the high temperature phase forms the gas inside the solder paste, it is difficult to escape and form a cavity after the soldering is completed. , the void will greatly reduce the welding strength and seriously affect the reliability

Method used

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  • Composite solder paste stored at room temperature and preparation method thereof
  • Composite solder paste stored at room temperature and preparation method thereof
  • Composite solder paste stored at room temperature and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] 1. Preparation method of surface-coated composite metal powder:

[0036] (1) The configuration ratio of the photo-induced solder resist coating solution is:

[0037] Propylene glycol epoxy resin 40%;

[0038] 1-Hydroxycyclohexyl phenyl ketone 1%;

[0039] Glycidyl ether 59%.

[0040] Add SnAgCu305 solder powder with a particle size of 0.1-8 μm into the coating solution, use a stirring paddle to suspend the metal powder in the coating solution for 60 minutes at a speed of 120 rpm, and then let it stand for precipitation.

[0041] (2) Send the above precipitated metal powder into a convection heat transfer type centrifugal spray dryer to dry to obtain a uniformly dispersed metal powder. At the same time of centrifugal drying, additional ultraviolet light is required to quickly solidify the coating agent on the surface of the metal powder to obtain a coated metal powder.

[0042] 2. Solder paste preparation method:

[0043] Mix the coated solder powder and flux in a r...

Embodiment 2

[0045] 1. Preparation method of surface-coated composite metal powder:

[0046] (1) The configuration ratio of the photo-induced solder resist coating solution is:

[0047] Novolak epoxy resin or urethane 60%;

[0048] 2-Hydroxy-2-methyl-1-phenylacetone 3%;

[0049] Ethyl acetate 37%.

[0050] Add SnAgCu305 solder powder with a particle size of 2-11 μm and Cu60Zn40 powder with a particle size of 2-11 μm into the coating solution at a weight ratio of 30:70, and use a stirring blade to suspend the metal powder in the coating solution for 50 minutes at a speed of 120 rpm , and then left to settle.

[0051] (2) Send the above precipitated metal powder into a convection heat transfer type centrifugal spray dryer to dry to obtain a uniformly dispersed metal powder. At the same time of centrifugal drying, additional ultraviolet light is required to quickly solidify the coating agent on the surface of the metal powder to obtain a coated metal powder.

[0052] 2. Solder paste prep...

Embodiment 3

[0055] 1. Preparation method of surface-coated composite metal powder:

[0056] (1) The configuration ratio of the photo-induced solder resist coating solution is:

[0057] Propylene glycol epoxy resin 50%;

[0058] 2,4,6-Trimethylbenzoylphenylphosphonic acid ethyl ester 5%;

[0059] Glycidyl ether 45%.

[0060] Add SnAgCu305 solder powder with a particle size of 5-15 μm and silver powder with a particle size of 5-15 μm into the coating solution at a weight ratio of 80:20, and use a stirring paddle to suspend the metal powder in the coating solution for 40 minutes at a speed of 120 rpm. Then let it settle down.

[0061] (2) Send the above precipitated metal powder into a convection heat transfer type centrifugal spray dryer to dry to obtain a uniformly dispersed metal powder. At the same time of centrifugal drying, additional ultraviolet light is required to quickly solidify the coating agent on the surface of the metal powder to obtain a coated metal powder.

[0062] 2. ...

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Abstract

The invention relates to a normal-temperature storage composite solder paste and a preparation method. The preparation method comprises the steps that 30-100% of tin alloy welding powder and 0-70% of high-temperature phase metal powder are mixed with a coating agent solution, evenly-coated metal powder is obtained through centrifugal drying, the metal powder is mixed with soldering flux, and the composite solder paste is obtained. The coating layer will not be dissolved to the soldering flux under low temperature, the surfaces of the tin alloy welding powder and the high-temperature phase metal power are isolated from oxygen and a corrosion media under normal temperature, and the prepared solder paste can be stored at normal temperature; the coating layer can be dissolved to the soldering flux only under the certain temperature, the degree that an intermetallic compound is formed between the tin alloy welding powder and the high-temperature phase metal powder can be effectively controlled, the problems of brittleness and holes caused by overgrow of the intermetallic compound due to the fact that the forming degree of the intermetallic compound cannot be controlled when the composite solder paste is applied are solved, and therefore welding strength and toughness are improved. The normal-temperature storage composite solder paste is applicable to all tin alloy welding powder and can be widely applied to electronic SMT assembly industry.

Description

technical field [0001] The invention belongs to the technical field of soldering, in particular to a solder paste for electronic assembly. Background technique [0002] With the rapid development of the modern electronics industry, new electronic products emerge in an endless stream, and electronic equipment is developing in the direction of light, thin, and small. Solder paste is a key material in the electronics industry and an important link in assembly. Solder paste is a mixture of flux and solder powder. In order to achieve a good soldering effect, traditional solder paste uses many active components to remove solder powder and pad surface oxides and improve the spread rate. Therefore, the activity of the solder paste is strong, and the flux and the oxide on the surface of the solder powder are prone to react at room temperature, resulting in deterioration of the solder paste such as "drying", especially as the components become smaller and smaller, the use of finer sol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/22B23K35/14B23K35/40
CPCB23K35/025B23K35/22B23K35/40
Inventor 贺会军张江松赵朝辉朱捷王志刚安宁朱学新张富文刘希学张品李志刚张焕鹍王丽荣刘英杰刘建
Owner 有研纳微新材料(北京)有限公司
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