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A kind of built-in high dielectric constant flexible resin composite material and its preparation method and application

A high dielectric constant, composite material technology, applied in directions including printed electrical components, etc., can solve the problems of steep rise in dielectric loss, reduced material compressive strength, no practical value, etc., to increase effective contact and improve resistance. The effect of pressure strength and high capacitance

Active Publication Date: 2020-07-24
深圳市峰泳科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the introduction of a large amount of ceramic fillers will inevitably lead to a large number of defects, which will greatly reduce the compressive strength of the material
Second, adding a conductive phase filler to the polymer matrix can obtain a higher dielectric constant by using the percolation effect, but the dielectric loss also rises sharply with the increase of the filler filling amount, so it is generally not of practical value

Method used

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  • A kind of built-in high dielectric constant flexible resin composite material and its preparation method and application
  • A kind of built-in high dielectric constant flexible resin composite material and its preparation method and application
  • A kind of built-in high dielectric constant flexible resin composite material and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Example 1 A built-in high dielectric constant flexible resin-based composite material

[0036] A built-in high dielectric constant flexible resin composite material in this embodiment is prepared from the following raw materials:

[0037]

[0038] A method for preparing a built-in high dielectric constant flexible resin-based composite material in this embodiment includes the following steps:

[0039] (1), take 100 nanometer spherical BaTiO 3 Disperse 10g of powder in 20ml butanone solution, stir and ultrasonically disperse to form mixture A;

[0040] (2), get 5 grams of graphene oxide nanosheets and disperse them in 20ml butanone solution, form mixture B through stirring and ultrasonic dispersion, A and B are mixed and ultrasonically stirred for 60 minutes;

[0041] (3), then 5 grams of BaTiO with a diameter of 100 nanometers and a length of 1 micron 3 Add nanofibers to the mixed solution of A and B, add 0.5 g of dispersant (German BYK-AT204), continue to sonicat...

Embodiment 2

[0045]Example 2 A built-in high dielectric constant flexible resin-based composite material

[0046] A built-in high dielectric constant flexible resin composite material in this embodiment is prepared from the following raw materials:

[0047]

[0048] A method for preparing a built-in high dielectric constant flexible resin composite material in this embodiment comprises the following steps:

[0049] (1) Take BaTiO with a diameter of 100nm 3 10 g of nanowires (the length of the nanowires is 1 micron) is dispersed in 20 ml of butanone solution, and mixture A is formed through stirring and ultrasonic dispersion;

[0050] (2), get 5 grams of graphene oxide nanosheets and disperse them in 20ml butanone solution, form mixture B through stirring and ultrasonic dispersion, A and B are mixed and ultrasonically stirred for 60 minutes;

[0051] (3), then 5 grams of spherical BaTiO with a diameter of 100 nanometers 3 Add the powder into the mixed solution of A and B, continue to ...

Embodiment 3

[0055] Example 3 A built-in high dielectric constant flexible resin composite material

[0056] A built-in high dielectric constant flexible resin composite material in this embodiment is prepared from the following raw materials:

[0057]

[0058] A method for preparing a built-in high dielectric constant flexible resin composite material in this embodiment comprises the following steps:

[0059] (1), 10 g of CCTO nanofibers (fiber length of 15 microns) with a diameter of 400 nanometers were dispersed in 20 ml of methyl ethyl ketone solution, and mixture A was formed through stirring and ultrasonic dispersion;

[0060] (2), get 5 grams of graphene oxide nanosheets and disperse them in 20ml butanone solution, form mixture B through stirring and ultrasonic dispersion, A and B are mixed and ultrasonically stirred for 60 minutes;

[0061] (3), then add 5 grams of spherical CCTO powders with a diameter of 200 nanometers into the mixed solution of A and B, continue to sonicate ...

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Abstract

The invention discloses a built-in high-dielectric-constant flexible resin composite material, and a preparation method and application thereof. The resin composite material is prepared by compoundinga resin matrix and inorganic fillers through a certain process. Effective contact between dielectric fillers and coupling effect under the action of an electic field are further enhanced by introducing nanometer one-dimensional, two-dimensional and nanoparticle fillers into the resin matrix and through synergistic effect of the fillers, so that a flexible dielectric material with high dielectricconstant is obtained. The composite material is arranged in a chip and a printed circuit board through a certain processing process, and the dielectric constant is high, so higher electric capacity can be realized within a certain area, and the traditional surface mounting ceramic capacitor can be replaced.

Description

technical field [0001] The invention belongs to the technical field of new energy materials. More specifically, the invention relates to a built-in high dielectric constant flexible resin composite material and its preparation method and application. Background technique [0002] In recent years, the new generation of information technology represented by intelligent Internet of Things and wearable technology and the industry's demand for high integration, miniaturization, light weight and high density of electronic systems have driven the rapid thinning of traditional ceramic dielectric materials, resulting in Its leakage current increases sharply. Therefore, searching for new dielectric materials with high energy storage density has become a forward-looking research topic in the field of information functional materials and microelectronics. Due to the advantages of simple process, low cost, easy compatibility with flexible substrates, and suitable for large-scale product...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K7/08C08K7/00C08K7/18H05K1/16
Inventor 杨文虎李峰陶玉红卢星华
Owner 深圳市峰泳科技有限公司