Non-contact protection ring single-photon avalanche diode and preparation method thereof
A single-photon avalanche, non-contact technology, applied in the final product manufacturing, sustainable manufacturing/processing, electrical components, etc., can solve the problems of reducing the photon detection efficiency of the device, and it is difficult to trigger an avalanche, so as to facilitate light absorption, The effect of increasing the effective photosensitive area and improving the detection efficiency
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[0038] Example 1
[0039] The embodiment of the present invention proposes a single photon avalanche diode detector structure that can effectively suppress edge breakdown and is compatible with standard CMOS technology, see figure 1 , See the description below for details:
[0040] The detector is mainly composed of P + / The photosensitive PN junction composed of deep N-well and the ring-shaped P-well guard ring are separated by a certain distance, and the P-well is used to form a guard ring around the photosensitive PN junction to suppress edge breakdown and improve the reliability and detection performance of the device .
[0041] When the device is working, the P-well guard ring acts as a voltage divider to suppress the increase in the edge electric field of the photosensitive area, thereby solving the edge breakdown problem. In addition, the detector can also increase the effective photosensitive area and increase the detection efficiency.
[0042] In addition, due to the lower d...
Example Embodiment
[0043] Example 2
[0044] The embodiment of the present invention also provides a method for manufacturing a non-contact guard ring single photon avalanche diode, which includes the following steps:
[0045] 1) Use standard CMOS processes such as oxidation, photolithography, ion implantation, annealing, etc. to form a lightly doped deep N-well on a P-type lightly doped silicon substrate to achieve electrical isolation from other electronic devices and avoid their mutual influence;
[0046] 2) Prepare a moderately doped N-type well region in the above-mentioned deep N-well region, surround the deep N-well, and then regenerate a thin silicon dioxide layer;
[0047] 3) Prepare a medium-doped P-type well region in the deep N-well as the guard ring of the device;
[0048] 4) Prepare a P-type heavily doped region in the center of the deep N well. This region and the deep N well together form a P + / Deep N-well photosensitive PN junction;
[0049] Wherein, the P-type heavily doped area also ser...
Example Embodiment
[0056] Example 3
[0057] Attached below Figure 1-4 The schemes in Examples 1 and 2 are further introduced, as detailed in the following description:
[0058] figure 1 with figure 2 These are the cross-sectional and top views of the detector. For ease of illustration, figure 2 The oxide layer 8 and the metal electrodes 9, 10, 11 are not shown in the figure.
[0059] In the figure, 1 is the substrate. The material of the substrate 1 is a P-type lightly doped silicon wafer, which serves as the supporting part of the designed single-photon avalanche diode.
[0060] In the figure, 2 is a lightly doped deep N-well. On the one hand, the deep N-well 2 is used as a component of the photosensitive PN junction, and on the other hand, it is also used to isolate the detector and other electronic devices from each other.
[0061] In the figure, 3 is an N-well region. The N-well adopts a medium doping concentration and surrounds the deep N-well.
[0062] In the figure, 4 is the P-well region, and...
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