A flexible ablation resistance film and its preparation method

A resistance thin film, flexible technology, applied in the field of flexible ablation resistance thin film and its preparation, can solve the problems that affect the reliability of flexible thin film, large interface thermal stress, difficult to meet engineering applications, etc.

Active Publication Date: 2020-12-11
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, EPDM and polyimide are flexible materials, which are prone to cracks and shedding during the preparation of flexible films, which affect the reliability of flexible films.
In order to overcome the above problems, researchers have optimized the preparation process of the thin film. For example, the Chinese patent document with the publication number CN102330067A introduces a method for the rapid and uniform preparation of a flexible substrate microcrystalline silicon thin film. The plasma-enhanced chemical vapor deposition method realizes the preparation of microcrystalline silicon thin films with high quality, high deposition rate and good uniformity on flexible substrates at low temperatures. It is applied to thin-film solar cells and can effectively improve the stability and efficiency of cells. However, this The flexible film prepared in the patented technology has the disadvantages of low density and adhesion strength, easy cracking and falling off under high temperature stress environment, and poor film reliability.
As another example, the Chinese patent literature with the publication number CN104498883A introduces a method for depositing a high c-axis oriented aluminum nitride film on a flexible substrate. The flexible substrate is cleaned with plasma, and the cleaned flexible substrate is Place it on the substrate stage of a magnetron sputtering coating machine, vacuumize it, fill it with working gas, and prepare a high c-axis oriented aluminum nitride film by reactive sputtering. The process is simple and the cost is low. The selected substrate is a flexible material. The prepared aluminum nitride film is bendable, has high c-axis orientation and high d33 piezoelectric coefficient, which is beneficial to reduce surface roughness and improve substrate bonding force, and can be used to prepare flexible surface acoustic wave devices, but the patent uses magnetron sputtering The flexible film is prepared by the injection method, which has the disadvantages of loose film layer, low density, large interface thermal stress, etc., which is difficult to meet the engineering application in harsh environment.
It can be seen that the flexible films prepared in the existing preparation methods can only be relatively reliable under atmospheric conditions, and cannot be applied to the thermal protection of spacecraft such as hypersonic vehicles and solid rocket motors.
[0005] Therefore, aiming at the defects and deficiencies in existing flexible films such as complex preparation process and low reliability level, a flexible ablation resistance film with strong anti-environmental interference ability and high reliability level and its matching preparation The method is of great significance for improving the application reliability of hypersonic vehicles, solid rocket motors and other spacecraft in harsh environments such as high temperature and high heat flow

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  • A flexible ablation resistance film and its preparation method
  • A flexible ablation resistance film and its preparation method

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Embodiment 1

[0046] A flexible ablation resistive film, such as figure 1 , including a flexible substrate 1 and an ablation resistance film 8, a composite transition layer is provided between the flexible substrate 1 and the ablation resistance film 8, wherein the composite transition layer includes a sequentially deposited Si 3 N 4 Layer 4, AlN layer 5 to Al 2 o 3 Layer 6 periodic composite film.

[0047] In this embodiment, the periodic composite thin film is based on the flexible substrate 1 and presents "Si 3 N 4 Layer 4, AlN layer 5 to Al 2 o 3 Periodic change trend of layer 6". Specifically: take the flexible substrate 1 as the base surface to deposit Si in sequence 3 N 4 Layer 4, AlN layer 5, Al 2 o 3 Layer 6 forms Si 3 N 4 / AlN / Al 2 o 3 Composite thin films, periodically prepared Si 3 N 4 / AlN / Al 2 o 3 Composite thin film, obtain periodical composite thin film, namely composite transition layer.

[0048] In this embodiment, the period number of the periodic compo...

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Abstract

The invention discloses a flexible ablation resistor thin film and a preparation method thereof. The flexible ablation resistor thin film comprises a flexible substrate and an ablation resistor thin film, wherein a composite transition layer is arranged therebetween, and the composite transition layer comprises a periodic composite film formed by alternately depositing Si3N4 layers, AlN layers andAl2O3 layers. The preparation method comprises the steps of preparing the composite transition layer and preparing the ablation resistor thin film. The flexible ablation resistor thin film has the advantages of high environmental interference resistance, high reliability level and the like. The preparation method of the flexible ablation resistor thin film has the advantages of simple preparationprocess, high environmental adaptability, good reliability and the like. The flexible ablation resistor thin film can be used in a heatproof protection layer of spacecrafts such as a hypersonic aircraft, a solid rocket engine and the like, can realize ablation volume measurement in harsh environments such as high temperature and high heat flow scouring, and is of great significance to improving the application reliability of spacecrafts such as a hypersonic aircraft, a solid rocket engine and the like.

Description

technical field [0001] The invention belongs to the technical field of special film preparation, relates to an ablation resistance film and a preparation method thereof, in particular to a flexible ablation resistance film and a preparation method thereof. Background technique [0002] The heat insulation layer is mainly used in the thermal protection of solid rocket motors, re-entry vehicles and other spacecraft. The performance of the heat insulation layer directly affects the reliability of the engine, and even affects the success or failure of the rocket launch. The working environment of the heat insulation layer is very harsh. It has to withstand the ablation of high temperature and high pressure gas and the erosion of condensed phase particles. In severe cases, the protection of the inner heat insulation layer will fail, and the engine casing will burn through, resulting in engine failure. Therefore, the thickness and geometric shape of the thermal insulation layer di...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K7/16C23C14/06C23C14/08C23C14/18C23C14/35C23C14/58
CPCC23C14/0605C23C14/0641C23C14/0652C23C14/081C23C14/185C23C14/35C23C14/5806G01K7/16
Inventor 陈伟谢锋曾世龚星白庆星
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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