Manufacturing method of high-heat-conductivity porous copper heat dissipating sheet

Abstract

The invention discloses a manufacturing method of a high-heat-conductivity porous copper heat dissipating sheet, and belongs to the technical field of metallurgic casting preparation. The method is characterized in that the bonding force of a polyurethane surface and a metal coating can be increased in the polyurethane roughening process; a continuous thin metal copper layer gradually grows on a substrate surface as chemical coating goes on, thus the specific surface area of porous copper is increased, and meanwhile, the flowing air is accelerated to flow to dissipate heat. According to the method, metal ions are combined with electrons on a cathode to generate metal atoms during electroplating; the metal atoms are continuously crystallized to form a continuous metal deposition layer on the substrate surface; the magnetic flux of manganese zinc ferrite powder is high, so that the magnetic attracting capacity to a conductive metal electronic element is high, and a porous copper heat dissipating sheet is improved during adhering and assembling through magnetic attracting force of heat conducting resin; a plurality of hydroxide radicals are subjected to dehydration condensation to increase crosslinking density; latex is slightly changed due to high crosslinking density viscosity when a circuit board works in a high temperature condition, thus the heat conducting performance of theheat dissipating sheet is improved; and the application prospect is wide.

Description

technical field [0001] The invention discloses a method for preparing a porous copper radiator with high thermal conductivity, and belongs to the technical field of metallurgical casting preparation. Background technique [0002] Heat sink is a device for dissipating heat from electronic components that are prone to heat in electrical appliances. It is mostly made of aluminum alloy, brass or bronze into plates, sheets, and multi-sheets. Commonly used heat sink materials are copper and aluminum alloy, both of which have their own advantages and disadvantages. Copper has good thermal conductivity, but it is more expensive, difficult to process, too heavy, has a small heat capacity, and is easy to oxidize. However, pure aluminum is too soft to be used directly. Only the aluminum alloy used can provide sufficient hardness. The advantages of aluminum alloy are low price and light weight, but the thermal conductivity is much worse than copper. Some radiators take their own advan...

AI Technical Summary

Problems solved by technology

[0005] The technical problem mainly solved by the present invention is that the heat conducted by the existing porous copper heat sink through the heat dissipation base cannot reach the heat dissipation surface in time, and the air holes connected in the heat sink have a large flow resistance to the flowing gas, and it is difficult to exert the heat of the porous metal. Due to the advantages of high specific surface area and other issues, metal heat sinks and graphite heat sinks are mostly used in the prior art. Although metal heat sinks have high thermal conductivity, their interface properties are very poor, and there is a large contact thermal resistance when in contact with a heat source. It transfers heat from the heat source to the metal very well, thus affecting heat dissipation, while the thermal conductivity of the graphite heat sink in the longitudinal direction is very low, and its interface properties are also relatively poor, and it cannot transfer heat from the heat source well. A preparation method of high thermal conductivity porous copper heat sink