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Method for improving quality of diamond wire coating

A diamond wire and quality technology, applied in the field of improving the quality of the diamond wire coating, can solve the problems of uneven thickness of the electroplated corundum coating, reduced corundum yield, serious cathode agglomeration, etc. The effect of cathodic adhesion

Inactive Publication Date: 2019-01-11
山东山田新材科研有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The plating thickness of the electroplated emery prepared under high current density is uneven and the cathode agglomeration is serious. If the agglomeration of the cathode is seriously adhered, the emery can only be deplated and recycled, which reduces the yield of emery and causes waste. , and in some cases in the middle of the process, the cathode adhesion is too large to touch the anode and cause a short circuit

Method used

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  • Method for improving quality of diamond wire coating
  • Method for improving quality of diamond wire coating
  • Method for improving quality of diamond wire coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The method for improving the coating quality of diamond wire includes the following steps:

[0026] Add 1g / L of boric acid to 20℃ deionized water and stir to dissolve, adjust the solution temperature to 20℃, then add 2g / L nickel chloride, 2g / L nickel sulfate hexahydrate, 2g / L lemon Trisodium acid, 1g / L sodium chloride, stir and dissolve in turn, then add 1ml / L dispersant A, stir well, use 20HZ ultrasonic vibration for 1min, then adjust the solution with 3% sodium hydroxide After the pH value reaches 4, the electroplating solution can be obtained by constant volume;

[0027] Electroless plating of 200g diamond powder to obtain electroless plating sand, the quality of electroless plating sand is 1.05 times the quality of diamond micropowder, the electroless plating sand is drained and transferred to a barrel plating bottle, and 0.8L of the above electroplating solution is added To the scale line of the barrel plating bottle, install the barrel plating machine, turn on the pow...

Embodiment 2

[0030] The method for improving the coating quality of diamond wire includes the following steps:

[0031] Add 100g / L boric acid to 100°C deionized water and stir until it dissolves, adjust the solution temperature to 60°C, and then add 90g / L nickel chloride, 200g / L nickel sulfate hexahydrate, and 200g / L lemon. Trisodium acid, 150g / L sodium chloride, stir and dissolve in turn, then add 50ml / L dispersant A, stir well, use 40HZ ultrasonic vibration for 20min, then adjust the solution with 20% sodium hydroxide After the pH value reaches 8, the electroplating solution can be used at a fixed volume;

[0032] Electroless plating of 1000g diamond micropowder to obtain electroless plating sand, the quality of the electroless plating sand is 1.3 times the quality of the diamond micropowder, the electroless plating sand is drained and transferred to a barrel plating bottle, and 1.8L of the above electroplating solution is added To the scale line of the barrel plating bottle, install the bar...

Embodiment 3

[0034] The method for improving the coating quality of diamond wire includes the following steps:

[0035] Add 50g / L boric acid to 50℃ deionized water and stir to dissolve, adjust the solution temperature to 55℃, then add 40g / L nickel chloride, 100g / L nickel sulfate hexahydrate, and 100g / L lemon in sequence Trisodium acid, 100g / L sodium chloride, stir and dissolve in sequence, then add 30ml / L dispersant A, stir well, use 30HZ ultrasonic vibration for 10min, then adjust the solution with 15% sodium hydroxide After the pH value reaches 7, the electroplating solution can be obtained by constant volume;

[0036] Electroless plating of 500g diamond powder is used to obtain chemical plating sand. The quality of the chemical plating sand is 1.2 times that of the diamond powder. After the chemical plating sand is drained of water, it is transferred to a barrel plating bottle, and 1L of the above electroplating solution is added to The scale line of the barrel plating bottle, install the b...

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Abstract

The invention discloses a method for improving quality of a diamond wire coating, and belongs to the technical field of diamond electroplating. In order to solve the problem that an existing coating is uneven in thickness and is severe in cathode agglomeration, the method for improving quality of the diamond wire coating comprises the following steps of: firstly, chemically plating 200-1000g of diamond micro powder to obtain chemical plating and coating sand, draining water of the chemical plating and coating sand, transferring the water-drained chemical plating and coating sand into a roller-plating bottle, adding 0.8-1.8L of electroplating liquor to scale lines of the roller-plating bottle, arranging a roller-plating machine, switching on a rectifier power supply, setting current as a constant-current mode, performing electroplating test after placing in cathode and anode connecting guide wires, and arranging a gap type vibrating device on the roller-plating bottle, wherein an anodeis a nickel block, and a cathode is a copper sheet. The method can be used for a diamond production line.

Description

Technical field [0001] The invention relates to a method for improving the quality of a diamond wire coating, and belongs to the technical field of diamond electroplating. Background technique [0002] Diamond wire is used to cut single crystal or polycrystalline silicon in the photovoltaic industry. The manufacturing methods of diamond wire mainly include electroplating, brazing, resin bonding and extrusion inlaying. The electroplating method refers to adding diamond micropowder composite nickel plating in the plating solution, so that the diamond micropowder particles and metallic nickel are co-deposited on the steel wire. When using unplated diamond to make electroplated diamond wire, the nickel plating layer gradually grows and thickens from the tool matrix, and the diamond particles are embedded in the nickel matrix. Because the diamond is not conductive, the nickel plating layer cannot directly nucleate and grow on the diamond surface. Therefore, it is difficult for diamon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16C25D5/00C25D7/06C25D15/00C23C28/02
CPCC23C18/1662C23C18/1653C23C28/027C25D5/00C25D7/0607C25D15/00
Inventor 龚志刚毛彦超陈冠宇焦安浩邢强强韩宇吴雨韩曹江霞
Owner 山东山田新材科研有限公司
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