Preparation process of high temperature oxidation resistant zrnx/(zralfe)n/(zralfem)n composite gradient coating
A technology of anti-oxidation at high temperature and gradient coating, applied in metal material coating process, coating, superimposed layer plating, etc. Maintains stability and mitigates the effect of reduced binding force
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Examples
Embodiment 1
[0030] a. Clean the base material:
[0031] Zirconium alloy (Zr 4 Alloy) substrate for grinding and polishing; then use acetone and ethanol as solvents to degrease and degrease and clean in an ultrasonic instrument; then clean with deionized water, dry and put into a vacuum chamber, the vacuum degree is -4 Pa;
[0032] b. Treatment of the substrate before deposition:
[0033] Keep the vacuum chamber vacuum -4 Under the condition of Pa, the reverse sputtering was used for 15 min to clean the zirconium alloy substrate; the reverse sputtering bias voltage was -450 V; the reverse sputtering gas was Ar; the reverse sputtering pressure in the vacuum chamber was 3.5 Pa;
[0034] c. Pre-sputtering:
[0035] Keep the vacuum chamber vacuum -4 Under the condition of Pa, pre-sputtering was used to clean each target for 15 min to remove impurities on the target surface; the pre-sputtering power was 120 W; the pre-sputtering bias was -120 V; the pre-sputtering gas was Ar; The pre-spu...
Embodiment 2
[0040] a. Clean the base material:
[0041] Zirconium alloy (Zr 4 Alloy) substrate for grinding and polishing; then use acetone and ethanol as solvents to degrease and degrease and clean in an ultrasonic instrument; then clean with deionized water, dry and put into a vacuum chamber, the vacuum degree is -4 Pa;
[0042] b. Treatment of the substrate before deposition:
[0043] Keep the vacuum chamber vacuum -4 Under the condition of Pa, the reverse sputtering was used for 15 min to clean the zirconium alloy substrate; the reverse sputtering bias voltage was -450 V; the reverse sputtering gas was Ar; the reverse sputtering pressure in the vacuum chamber was 3.5 Pa;
[0044] c. Pre-sputtering:
[0045] Keep the vacuum chamber vacuum -4 Under the condition of Pa, pre-sputtering was used to clean each target for 15 min to remove impurities on the target surface; the pre-sputtering power was 120 W; the pre-sputtering bias was -120 V; the pre-sputtering gas was Ar; The pre-spu...
Embodiment 3
[0050] a. Clean the base material:
[0051] Zirconium alloy (Zr 4 Alloy) substrate for grinding and polishing; then use acetone and ethanol as solvents to degrease and degrease and clean in an ultrasonic instrument; then clean with deionized water, dry and put into a vacuum chamber, the vacuum degree is -4 Pa;
[0052] b. Treatment of the substrate before deposition:
[0053] Keep the vacuum chamber vacuum -4Under the condition of Pa, the reverse sputtering was used for 15 min to clean the zirconium alloy substrate; the reverse sputtering bias voltage was -450 V; the reverse sputtering gas was Ar; the reverse sputtering pressure in the vacuum chamber was 3.5 Pa;
[0054] c. Pre-sputtering:
[0055] Keep the vacuum chamber vacuum -4 Under the condition of Pa, pre-sputtering was used to clean each target for 15 min to remove impurities on the target surface; the pre-sputtering power was 120 W; the pre-sputtering bias was -120 V; the pre-sputtering gas was Ar; The pre-sputt...
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Abstract
Description
Claims
Application Information
- IPC
- C23C14/35; C23C14/02; C23C14/06
- CPC
- C23C14/0036; C23C14/022; C23C14/025; C23C14/0641; C23C14/352; C23C28/048
- Inventors
- 刘波; 蒲国