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High-heat-conductivity and high-temperature stability electronic packaging composite material and preparation method thereof

A technology of high temperature stability and electronic packaging, applied in the field of packaging materials, to achieve the effects of excellent high temperature stability, low moisture absorption performance, and high thermal conductivity

Inactive Publication Date: 2019-05-14
莫爱军
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing electronic packaging materials can no longer meet the high performance requirements of packaging materials. Therefore, it is necessary to conduct further research on electronic packaging materials to further improve the thermal conductivity and high temperature stability of materials, as well as the mechanical properties of materials to meet the existing requirements. Encapsulation Material Requirements

Method used

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  • High-heat-conductivity and high-temperature stability electronic packaging composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A high-temperature stable electronic packaging composite material with high thermal conductivity, prepared from the following raw materials in parts by weight: 40 parts of water-based polyurethane modified by 3-aminopropyltriethoxysilane, 23 parts of polyimide siloxane 15 parts of ethylene-vinyl acetate copolymer, 8 parts of carbon nanotubes, 7 parts of graphene oxide, 3.5 parts of ceramic microbeads, 9 parts of molybdenum disulfide, 4.5 parts of boron nitride, 3.5 parts of silane coupling agent, tetrahydro 6 parts of phthalic anhydride, 10 parts of diphenylmethane diisocyanate, 5.5 parts of diaminodiphenylmethane, 3.5 parts of 2-ethyl-4-methylimidazole, 4.5 parts of ethylene glycol dimethacrylate, poly 3 parts of propylene glycol diglycidyl ether, 2.5 parts of dispersant, 2 parts of defoamer, 1.5 parts of leveling agent, and 15 parts of solvent.

[0022] The silane coupling agent is γ-glycidyl etheroxypropyltrimethoxysilane.

[0023] The dispersant is sodium carboxyme...

Embodiment 2

[0032] A high-temperature stable electronic packaging composite material with high thermal conductivity, prepared from the following raw materials in parts by weight: 30 parts of water-based polyurethane modified by 3-aminopropyltriethoxysilane, 15 parts of polyimide siloxane 10 parts of ethylene-vinyl acetate copolymer, 5 parts of carbon nanotubes, 4 parts of graphene oxide, 2 parts of ceramic microbeads, 6 parts of molybdenum disulfide, 3 parts of boron nitride, 2 parts of silane coupling agent, tetrahydrogen 4 parts of phthalic anhydride, 7 parts of diphenylmethane diisocyanate, 4 parts of diaminodiphenylmethane, 2-5 parts of 2-ethyl-4-methylimidazole, 3 parts of ethylene glycol dimethacrylate , 1 part of polypropylene glycol diglycidyl ether, 1 part of dispersant, 1 part of defoamer, 0.5 part of leveling agent, and 10 parts of solvent.

[0033] The silane coupling agent is γ-methacryloxypropyltrimethoxysilane.

[0034] Described dispersant is polyethylene glycol 400.

[...

Embodiment 3

[0043] A high-temperature stable electronic packaging composite material with high thermal conductivity, prepared from the following raw materials in parts by weight: 35 parts of water-based polyurethane modified by 3-aminopropyltriethoxysilane, 20 parts of polyimide siloxane 12 parts of ethylene-vinyl acetate copolymer, 6 parts of carbon nanotubes, 5 parts of graphene oxide, 3 parts of ceramic microbeads, 8 parts of molybdenum disulfide, 4 parts of boron nitride, 3 parts of silane coupling agent, tetrahydrogen 5 parts of phthalic anhydride, 8 parts of diphenylmethane diisocyanate, 5 parts of diaminodiphenylmethane, 3 parts of 2-ethyl-4-methylimidazole, 4 parts of ethylene glycol dimethacrylate, poly 3 parts of propylene glycol diglycidyl ether, 2 parts of dispersant, 1.5 parts of defoamer, 1 part of leveling agent, 12 parts of solvent.

[0044] The silane coupling agent is γ-glycidyl etheroxypropyltrimethoxysilane.

[0045] The dispersant is polyvinylpyrrolidone.

[0046] T...

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Abstract

The invention provides a high-heat-conductivity and high-temperature stability electronic packaging composite material and a preparation method thereof. The composite material is prepared from, 3-aminopropyl triethoxysilane modified waterborne polyurethane, polyimide siloxane, ethylene-vinyl acetate copolymers, carbon nano tubes, graphene oxide, ceramic micro-beads, molybdenum disulfide, boron nitride, silane coupling agents, tetra hydro phthalic anhydride, methylene diphenyl diisocyanate, diaminodiphenylmethane, 2-ethyl-4-methylimidazole, ethylene glycol dimethacrylate, polypropylene glycol diglycidyl ether, dispersing agents, defoaming agents, leveling agents and solvents. The prepared electronic packaging material has good heat conductivity, low moisture absorption performance, good mechanical strength and excellent high-temperature stability. The prepared packaging material is a material with high heat conductivity and high-temperature stability and good in mechanical property andhas wide application prospects.

Description

technical field [0001] The invention belongs to the technical field of packaging materials, and in particular relates to a high-temperature stable electronic packaging composite material with high thermal conductivity and a preparation method thereof. Background technique [0002] Electronic packaging materials are used to carry electronic components and their interconnections, and have good electrical insulation. They mainly play the role of mechanical support, sealing protection, and dissipation of heat generated by electronic components. An important part of. With the rapid development of information technology, the integration of chips in electronic components is getting higher and higher, the power is getting higher and higher, and the heat dissipation requirements for packaging materials are also getting higher and higher. If the heat cannot be dissipated, it is easy to cause chips and The cracking of the ceramic substrate or the cracking of some solder joints and wel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L75/04C08L79/08C08L23/08C08K13/04C08K3/04C08K7/16C08K3/30C08K3/38
Inventor 莫爱军
Owner 莫爱军
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